内蔵基板

US2022357214(TDK ELECTRONICS AG [DE])
[0003] In order to integrate passive components, such as sensors, condensers, protective components or heaters into electrical systems, the dimensions must be adapted for modern packaging designs, which are in the micrometer and even nanometer scale range.
【０００２】
  センサ、コンデンサ、保護素子、ヒータなどの受動的コンポーネントを電気システムに組み込むためには、マイクロメートル、さらにはナノメートルスケール領域での最新のパッケージデザインに適合する寸法が必要である。

To achieve this degree of miniaturization, the components are deposited as thin films onto carrier structures with electrical connections and described as a discrete device.
このような小型化を達成するために、コンポーネントは、電気的端子を有する担体構造上に薄膜として成膜され、不連続コンポーネントとして表される。

These novel components can be integrated into MEMS (Micro Electro Mechanical System) or SESUB (Semiconductor Embedded in Substrate（＊"semiconductor embedded substrate"？) structures.
これらの新しいコンポーネントは、ＭＥＭＳ（微小電気機械システム）やＳＥＳＵＢ（半導体内蔵基板）構造に組み込むことができる。

US11245977(SNAPTRACK INC [US])
[0013] Furthermore, it is possible that the support substrate comprises a layer arranged underneath the polymer layer in addition to the aforementioned polymer layer.
【００１３】
  更に、支持基板は上記ポリマー層の他に、ポリマー層の下に配置される層を備えてよい。

In this case, the layer may consist of one or more layers
その場合、層は１又は複数の層から成ってよく、

and may be a SESUB (semi-conductor-embedding substrate), a printed circuit board, an LTCC substrate (LTCC=low-Temperature co-fired ceramics),
半導体内蔵基板（ＳＥＳＵＢ）、回路基板、ＬＴＣＣ（Ｌｏｗ－Ｔｅｍｐｅｒａｔｕｒｅ  Ｃｏ－ｆｉｒｅｄ  Ｃｅｒａｍｉｃｓ）基板、

an HTCC substrate (HTCC=high-temperature co-fired ceramics), an organic substrate foil, an inorganic substrate foil, a metal foil, a monocrystalline substrate, a semiconductive substrate, a ceramic substrate, or a glass substrate. 
ＨＴＣＣ（Ｈｉｇｈ－Ｔｅｍｐｅｒａｔｕｒｅ  Ｃｏ－ｆｉｒｅｄ  Ｃｅｒａｍｉｃｓ）基板、有機支持薄片、無機支持薄片、金属薄片、単結晶基板、多結晶基板、半導体基板、セラミック基板、又はガラス基板であってよい。

US7833426(HEWLETT PACKARD DEVELOPMENT CO [US])
[0057] During operation of a print cartridge incorporating substrate（＊基板を内蔵したプリントカートリッジ）300 c bubbles may occur. Some of the described embodiments can allow a bubble to evacuate more readily from the print head compared to a traditional print head design. In this particular embodiment, a bubble is indicated generally at 704 . Buoyancy forces acting upon bubble 704 are directed along the z-axis. Fluid flow along bore b5 can be represented as a vector having both y-axis and z-axis components. Generally only the z-axis component of the fluid flow acts against the bubble's buoyancy forces and the bubble is more likely to migrate toward first surface 302 c and ultimately from the slot. In some instances bubble 704 may migrate toward first sidewall 702 c and then up the first sidewall toward first surface 302 c.

US2023273185(UNIV EINDHOVEN TECH [NL])
[0024] It was found that by means of the device of the present invention the microsieve arrangement can be utilized as a disposable add-on for a re-usable electrode-comprising substrate by carrying out a passively aligned click-on hybrid assembly step.
【００２４】
  本発明のデバイスを使って、受動的に調整されたクリックオンハイブリッドアセンブリステップを実行することにより、マイクロシーブ配列を、使い捨て可能なアドオン型のまたは再利用な可能の電極内蔵基板として利用できることが分かった。

In other words, the microsieve arrangement is arranged such that it is pluggable with the electrode-comprising substrate.
言い換えれば、マイクロシーブ配列は、電極内蔵基板に接続可能に構成される。

US2007104768(Z MEDICA CORP [US])
[0044] Other materials that may be mixed with, associated with, or incorporated into the zeolites include metal ions. By permeating the zeolite-incorporated substrate with an aqueous solution of a metal salt, metal ions can be incorporated into the zeolite and/or the substrate to provide a catalytic function. Metal ions that may be used include, but are not limited to, silver, copper, zinc, iron, nickel, cobalt, palladium, platinum, combinations of the foregoing, and the like. When silver, copper, or zinc are incorporated into the zeolites or the substrates, antibacterial properties are realized.

US2010216635(XEROX CORP [US])
[0032] In various embodiments, during formation of the image-forming medium or a reverse writing erasable paper, the yellow light absorbing material can be dissolved at the same time with the photochromic material in a solvent as disclosed herein to form the coating solution. In some cases, preparation of the coating solution can require heating in order to ensure a complete dissolution. For example, when dimeric or polymeric yellow colorants are used, heating can be necessary in order to ensure complete dissolution of the yellow colorant. In other embodiments, the exemplary yellow light absorbing material can be coated as a yellow over coat on a photochromic material incorporated substrate, e.g., on a photochromic-containing layer formed on a substrate.