US20160040154(特表2016-513973)
"[0097] A particular advantage provided by the present invention is the ability to remove or eliminate a high degree of （高度に除去または排除）prematurely aborted RNA sequences (also known as "shortmers"). In some embodiments, a method according to the invention removes more than about 90%, 95%, 96%, 97%, 98%, 99% or substantially all prematurely aborted RNA sequences."
US8034246(特表2010-527287)
"With the addition of the media filter, over 99% removal of dissolved ionic mercury was achieved with all levels in the treated wastewater being below the detection limit of 0.1 wppb. The addition of the air flotation step could be expected to improve filter operation (increase filter run length) by superior removal（高度に除去）of the precipitated solids prior to entry to the filter bed."
US7902106(特表2008-531263)
"Although this system has the advantages of causing sulfur reduction in the cracking process, it is generally believed that use of greater than about 10 weight percent of the described additives in the catalyst composition does not provide a benefit (e.g. high sulfur removal（硫黄を高度に除去する）while retaining the selectivity of other products) proportional to the level of the additive."
WO03022870(特表2005-509601)
"The present application provides a purified factor from human milk that is capable of inhibiting extracellular calcium influx in PMN. As employed herein, the terms "purified"and"purification"refers to compositions (and related methods) in which the relative amount of a designated component (s), such as a Call factor, has been increased by removal of at least a portion of one or more impurities from the composition. Although these terms may refer to a process which produces a composition which includes 90 wt. % or more of the desired component (s), the terms"purified"and"purification"do not require or imply such a high degree of removal（高度に除去すること）of other substances from the composition."
WO2005123282(特表2008-506530)
(Ab)
"Methods for wet cleaning（ウェット洗浄）quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with（接触させる）at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times."
WO2008019282(特表2009-545895)
"10. The method of claim 9, wherein cleaning the substrate comprises a wet clean（ウェット洗浄）process."
US7585759(特表2009-503852)
"2. The method of claim 1, wherein cleaning（洗浄）said second layer comprises removing particles from said second layer.
3. The method of claim 1, wherein said cleaning further comprises performing a wet clean（ウェット洗浄）process after said second sweep operation."
WO9639266(特表2001-527697)
"Wet versus Drv Processing
One of the long-running technological shifts in semiconductor processing has been the changes (and attempted changes) between dry and wet processing. In dry processing, only gaseous or plasma-phase reactants come in contact with（接触する）the wafer. In wet processing, a variety of liquid reagents are used for purposes such as etching silicon dioxide or removing native oxide layers（自然酸化膜）, removing organic materials or trace organic contaminants, removing metals or trace organic contaminants, etching silicon nitride, etching silicon.
Plasma etching has many attractive capabilities, but it is not adequate for cleanup（洗浄）. There is simply no available chemistry to remove some of the most undesirable impurities, such as gold. Thus wet cleanup（ウェット洗浄）processes are essential to modern semiconductor processing, and are likely to remain so for the foreseeable future."
"To set up the process one must determine the concentration of total HF and NH3 to be dissolved in water. For example, 1 kg. of 40% by weight ammonium, fluoride solution would contain 400 g of NH4F and 600 g of ultra pure water（超純水）. Since the mole ratio of HF to NH3 is 1:1 for pure NH4F the 400 g of NH4F would include 216 g of anhydrous HF and 184 g of anhydrous NH3. (MW NH4F 237, MW HF = 20, MW NH3 - 17)."
WO2015148055(特表2017-509149)
"Various wet and dry cleaning（洗浄）methods are known in the art. In some embodiments, a dry etching or cleaning process can be used such as, without limitation, a plasma-free gas chemical etch system targeted at selective oxide film etching using a Certas machine available from Tokyo Electron Limited (TEL) of Japan"
US8937831(特表2015-503818)
"5. The apparatus of claim 1, wherein the timing variation is a difference between when the dummy memory cell produces a voltage that satisfies a threshold voltage for reading from the dummy memory cell and the predefined timing of when（～するタイミングと、～するタイミングとの間）the dummy memory cell is expected to produce the voltage."
US20120151302
"[0073] If the requesting process (350) is one that supports play back of the multimedia content by a media player (370), the requesting process (350) may specify a start presentation time for play back of the multimedia content relative to the beginning of the multimedia content to the access process (360), and the access process (360) is meant to provide back to the requesting process (350) the stream of multimedia content corresponding to the specified start presentation time at a rate that generally equals or exceeds the playback rate of the multimedia content, where there is minimal time between when the requesting process (350) makes the request to the access process (360) and when（＊～する時と、～する時の間）the access process (360) first starts providing the stream of multimedia content to the requesting process (350)."
US5244146
"(h) providing an output signal representative of the total time elapsing between when said fuel-on interval ends and when（＊～する時と、～する時の間）said stop-clock signal is provided."
US8073460
"In still other embodiments, system 100 may allow the mobile device user to determine when system 100 should start and stop tracking the user's movements and therefore only locations visited by the user within that time frame (e.g., between the time （＊"duration of the time in which"？) the user initiates and concludes system 100's tracking) may be used to determine a next destination. In other words, a mobile device user may be able to define a `session` during which system 100 tracks the user's movements, determines next destinations and possibly sends advertising content to the user."
"In yet another embodiment, the amount of time between when mobile device users access two locations （＊"the amount of time between when mobile device users access one location and when they access another location"？）may be used as a criterion to determine how proximate the two locations are."
"Additionally, in some embodiments, locations may be ranked by other user trail related criteria, such as the number of hops between two locations or the amount of time between a mobile device user visiting two locations（＊"the amount of time between when a mobile device user visits one location and when they visit another location"？）, among other criteria. For example, referring back to FIG. 2, when ranking locations near location 210f, locations 210b, 210c, and 210e may be ranked higher than location 210g. In some embodiments, locations from which users travel to a particular location may be ranked higher than locations to which users travel from the particular location. For example, when ranking locations that are proximate location 210c, location 210a may be ranked higher than locations 210b or 210e, according to one embodiment. In other embodiments, the reverse may be true and locations 210b and 210e may be ranked higher than location 210a."
WO2014207584(特表2016-523421)
"2. Method according to claim 1 , further comprising the steps of
(i) decrypting or encrypting the guest memory (22) by a CPU (216), if the
CPU (216) runs in guest (20) context;
(ii) allowing the guest (20) to communicate externally（外部と通信）through a non- encrypted memory range; (iii) paging encrypted pages of the guest memory (22) by the hypervisor (30)."
WO0231669(特表2004-511936)
"12. A communication system comprising: a network appliance device coupled to a network, the device comprising software for detecting incoming calls and initiating call sessions in accordance with the Session Initiation Protocol (SIP); at least one SIP server coupled to the network for exchanging SIP messages with the network appliance device; and a communication gateway coupled to the network for allowing the network appliance device to communicate outside the network（ネットワーク外部と通信する）in accordance with a wireless communication protocol."
WO2013138373(特表2015-515193)
"1. An electronic device, comprising:
an interface for communicating externally（外部と通信する）using a short range communication protocol that is associated with a plurality of profiles including a first full duplex voice profile for communicating encoded voice and a second data profile for communicating digital data other than encoded voice; and
a processing device coupled to the interface,
wherein the processing device is configured to: determine whether to provide digital data (other than encoded voice) of the first electronic device to a resource of a second electronic device; in response to determining to provide the digital data of the first electronic device to the resource, establish a connection with the second electronic device over the interface using the first full duplex voice profile; convert the digital data into audio information; and
transmit the audio information over the established connection."
US20170124856(特表2017-508262)
"2. The apparatus of claim 1, wherein the transmission over said pre-existing public wireless network is the first communication performed by the local control module upon installation by a given user at a given site, before communicating externally（外部と通信する）via any other means."
US20100135279(特表2010-521837)
"18. An arrangement according to claim 11, wherein the sending unit is further adapted to include an external IP address in the remote access request, used by the residential gateway of the first local network for external communication（外部と通信するため）."
WO2015179155(特表2017-516041)
(Ab)
"A ring seal for sealing opposing flow component sealing surfaces defines a fluid flow path that is suitable for applications such as a semiconductor manufacturing modular gas delivery system. The ring seal includes an annular extension in the form of a modified "delta" extending from one or both sealing surfaces of the ring seal. The modified "delta" extends to an apex or point above the ring seal's sealing surface. First and second extension surfaces extend in opposite directions from the apex back toward the ring seal's sealing surface. In one aspect, the first extension surface defines a ridge（隆起）where the slope of the first extension surface changes to decline faster to the ring seal's sealing surface. In another aspect, the apex is located within the annular extension closer to the axial hole than to an outer radial diameter of the annular seal body（シール体）."
WO2009032569(特表2010-538233)
(Ab)
"A high temperature ball valve seal is disclosed that achieves（実現）Class IV shutoff for operating temperatures above 550 degrees F. The ball valve seal includes a C-seal positioned between a main seal and a seal body（シール体）to prevent fluid from flowing through a secondary flowpath（流路）when the ball valve is in a closed position."
WO2015058629(特表2016-535705)
(Ab)
"A closure assembly (2) for a container（収納体）(4) is provided, the closure assembly (2) comprising: a closure body（シール体）(10) for securing to the container (4) to extend across and seal an opening (6a) in the container (4); the closure body (10) comprising a bore (16) therein, the bore (16) communicating with the opening (6a) in the container (4) and providing a conduit between the interior of the container (4) and the exterior of the container (4) through which product within the container (4) may be dispensed（排出）; a closure member (50) having a port (60) therein, the closure member (50) slideably mounted to the closure body (10) and slideable between a closed position in which the port (60) is out of alignment with the bore (16) in the closure body (10) and the closure member(50) acts to close the bore (16) in the closure member (50) and an open position in which the port (60) is aligned with the bore (16) in the closure body (10). A measuring vessel (102) for use in conjunction with（組合わせて）the closure assembly (2) is also provided, the measuring vessel (102) comprising a side wall (106), an opening (110) defined by the side wall (106) and a base (108), the vessel (102) comprising a member (120) extending inwards from the base (108), such that the member (120) reduces the volume of the interior portion of the vessel (102) in the region of the base (108)."
WO2013148477(特表2015-518117)
(Ab)
"A tensioning system including a base and an arm pivotally coupled to（ピボット結合）the base, the arm having an engagement surface（係合面）and being configured to pivot（ピボット回転）relative to the base about（中心にして）a pivot axis. The system further includes a biasing mechanism operatively coupled to（動作結合）the arm to bias the arm relative to the base, and a seal assembly（シール体）sealingly（シール作用をもって）positioned between the arm and the base. The seal assembly is coaxial with the pivot axis and configured to accommodate relative axial movement between the base and the arm and relative radial movement between the base and the arm while still maintaining a seal therebetween."
WO2013103732(特表2015-510091)
"1. An aerostatic or hydrostatic bearing seal assembly comprising:
a rotatable shaft with a runner coupled to the rotatable shaft;
a housing located concentric to the shaft and defining a cavity, the housing being coupled to（連結）an annular seal body（シール体）via a first O-ring seal, the seal body including a conductive passage（伝導通路）for communicating pressurized fluid to（伝達する）a labyrinth（ラビリンス）which distributes the pressurized fluid to a porous media positioned between the runner and the seal body, the pressurized fluid creating an annular air film between the rotatable shaft and seal body."
WO2015167683(特表2017-514232)
(Ab)
"This disclosure provides systems, methods and apparatus related to touch and gesture recognition with an electronic interactive display. The interactive display has a front surface（前面）that includes a viewing area, a planar light guide（導光体）disposed proximate to（近接し）and behind the front surface, a light source, and at least one photo sensing element（感光素子）coupled with（結合）the first planar light guide. The planar light guide is configured to receive scattered light, the received scattered light resulting from interaction between light emitted by the light source and an object in optical contact with the front surface. The photo sensing element is configured to detect at least some of the received scattered light and to（＊toの繰り返し）output, to a processor, image data. The processor is configured to recognize, from the image data, one or both of a contact pressure and a rotational orientation of the object."
WO2013134017(特表2015-509655)
"17. A backlight assembly configured to provide backlight illumination for a display, comprising:
a light guide plate（導光板）having a surface from which the backlight illumination is provided to the display and having an edge into which light is launched（送り出され）to form the backlight illumination;
a plurality of light guides（導光体）having respective ends coupled to the edge of the light guide plate, wherein the light guides are configured to guide the light via total internal reflection."
US9136741(特表2016-526872)
"Flywheels have been used as energy storage devices or for smoothing mechanical or electrical power for hundreds of years. Recently（近年）, there have been significant advancements（著しい発展）in the field of flywheel energy storage because of the availability of high strength-to-weight (the specific strength) materials, like composites. The kinetic energy stored per unit mass of flywheel material can be shown to be directly proportional to the specific strength (strength divided by density) of the material."
"A cast ingot of the desired alloy, for example, American Iron and Steel Institute (AISI) designation 4340, is cut to the desired volume and subjected to one or more upsetting operations（据込作業）in an open die set-up in a hydraulic press at the hot forging temperature. This process compresses voids in the ingot and stretches inclusions into thin and finer particles called stringers. Since the loading is axisymmetric, the process may also result in dispersion of stringers. In an exemplary embodiment, the blank（素材）is further hot-forged into a shape containing bosses on either surface using a closed-die set of tools."
US9573301(特表2016-514634)
(Ab)
"Ply wrinkling during hot drape forming of a composite laminate is reduced at corner radii. A tensioning material placed over an uncured composite laminate charge（積層素材）maintains a compressive force on the laminate charge as the charge is formed over a tool."
charge: the quantity of material … loaded at one time into an apparatus …in any single operation (Merriam-Webster Unabridged)；充填素材（プラスチック工業辞典、小川伸 著）
US8995125(特表2015-529906)
"Base 12 includes a housing 24, shown in FIG. 2, that consists of a unitary material（単一素材）structure that includes the upper wall 26, a lower wall 28 that is spaced apart from and opposes upper wall 26, a front wall 30, and two side walls 32 and 34, that extend generally vertically between the upper wall 26 and lower wall 28. The unitary housing structure can also include at least partial rear walls 31 that can, for example, extend upward from lower wall 28. In such a unitary structure, a single piece of material（材料）includes the aforementioned walls, 26, 28, 30, 31, 32, and 34, with any one of these walls being solidly, or unitarily, connected with the adjacent walls by continuous, uninterrupted, sections of the same material（材料）. For example, the housing 24 can be made from a single piece of plastic or metal wherein the walls are integrally formed with the adjacent walls without any joining in the form of fastening, gluing, welding, or metallic joining such as soldering, braising or the like. Plastic materials（プラスチック素材）can include polycarbonate (PC), ABS, PCABS, or the like. Metal materials（金属素材）can include aluminum, aluminum alloy, magnesium alloys, stainless steel, or the like."
「素材」と「材料」の使い分けの必然性は？
US9156209(特表2013-536067)
"With growing environmental concerns over（懸念が高まるなか）petrochemical products and environmentally harmful practices, new environmentally friendly polymers are being developed as a replacement for petrochemical based plastics. Materials（素材）such as PLA (polylactic acid) such as produced by Natureworks (Cargill) are derived from natural and rapidly renewable resources of corn. To date the vast majority of interest and commercialization is the application of PLA has been for disposable packaging and other disposable products. Although thought of as（と認識されているが）a disposable plastic, PLA has many abilities and functions that can further expand the usage of this environmentally friendly biobased technology."
"Typical encapsulants（カプセル材料；＊封止材料、封入材料）for LEDs are organic polymeric materials（ポリマー素材）. Encapsulant lifetime is a significant hurdle holding back improved performance of high brightness LEDs (HB LEDs). Conventional LEDs are encapsulated in epoxy resins that, when is use, tend to yellow（黄変）over time thereby reducing the LED brightness and changing the color rendering index of the light emitted from the light emitting device."
"Other recycled material（再利用材料）like polylactic acid biopolymers from the production of water bottles are found in high volumes."
"The usage of recycled plastic for simple compression molding into sheets or screw extrusion into sheet is known. Generally, the materials（材料）are mixed（混合）or blended（融合；＊配合？）and fully melted into a homogenous material."
US20110220130(特表2013-513399)
(Ab)
"The tobacco products incorporate binder systems（バインダー系）. The binder systems exhibit thermoplastic properties, characteristics, or behaviors. The binder system can incorporate at least one type of binding agent that exhibits thermoplastic properties. Additionally, the binder system can incorporate materials（材料）to provide a binding agent that exhibits thermoplastic characteristics, for example at least one thermoplastic binding material in combination with a plasticizer. Also, tobacco products can incorporate a plasticizer blend. Tobacco products are produced by contacting tobacco, with other desired ingredients（素材）, in the presence of a binder system, and forming the resulting mixture into a shape. Of particular interest are processing conditions that involve exposing a tobacco formulation to less than about 100.degree. C. during processing, using relatively low amounts of a binding agent that exhibits desirable thermoplastic behavior at such processing temperatures, and using relatively low to moderate amounts of liquid processing aids. Other processing conditions include adding a plasticizer blend to the tobacco formulation."
US20090218322(特表2011-513079)
"1. A method of manufacturing extrusion dies, the method comprising: providing a die blank（ダイ素材）; forming a first plurality of slots and die pins in a first portion of a face of the die blank by plunging an EDM electrode into the die blank, each of the slots having a first width; and forming a second plurality of slots and die pins in a second portion of the face proximate to the first plurality of slots, wherein each of the second plurality of slots has a second width, the second width being less than the first width."
US9263662(特表2017-510992)
"Filling（充填）can be accomplished using a variety of methods, e.g., atomic layer deposition, chemical vapor deposition, deposition from chemical bath（薬液槽）or polymerization bath, electrochemical deposition, drop casting or spin coating or immersion followed by evaporation of a solvated filling material（溶媒和充填材料）. In some cases（場合によっては）, one or more of the above methods may be used to obtain filling materials（充填材料）with the desired combination of properties."
US20140242731(特表2016-515300)
"Integrated circuit wafers, which typically are in the form of flat（扁平な）round disks (although other shapes are possible) and often are made from（から作られる）silicon, Gallium Arsenide, or other materials, may be processed using various chemicals. One process is the use of liquid chemical etchant to remove material from or on the substrate, this process is often referred to as wet etching. Commonly used methods include submerging the wafers in chemical baths（薬液槽）(referred to as "batch processing" or "immersion processing"), or dispensing fluid on a wafer while spinning (referred to as "single wafer processing（枚葉処理）"). As wafer sizes increase and geometry sizes decrease, substantial benefits can be realized by employing single wafer processing inasmuch as the processing environment may be better controlled."
WO2007047386(特表2009-511350)
"12. The avionics module according to claim 10, wherein the internal region of the avionics module comprises: a printed wiring board; and a heat sink（放熱板）that includes a plurality of heat sink fins directly connected to one of the side surfaces of the avionics module, wherein one of the side surfaces of the avionics module comprises: a plurality of fins that are configured to direct the air inlet（空気流入）from the rear surface of the avionics module across a particular portion of the one of the side surfaces, to thereby cool the plurality of heat sink fins, the heat sink, and the printed wiring board."
WO2007133857(特表2009-532882)
"4. The LED assembly（アセンブリ）of claim 1, wherein the LED further comprises: a heat sink（放熱板）; an LED die in thermal contact with the heat sink; and a reflective surface disposed to reflect a portion of light emitted by the LED die."
"31. A light producing apparatus（発光装置）, comprising: a substrate; an elongate mounting structure formed on the substrate; and a plurality of LEDs removably secured to the elongate（細長い）mounting structure（実装構造体）, each of the plurality of LEDs comprising a first mechanical attachment leg and a second mechanical attachment leg, each of the first mechanical attachment leg and the second mechanical attachment leg being adapted to secure（固定）said LED to the substrate such that the elongate mounting structure extends between the first and second mechanical attachment legs."
WO2010030743(特表2012-502619)
"7. The energy device of claim 1, wherein said at least one electrically conductive surface comprises a material selected from the group of: the anode of an electrochemical storage device, the anode current collector of an electrochemical storage device, the cathode of an electrochemical storage device, the cathode current collector of an electrochemical storage device, the encapsulation（被包）of an electrochemical storage device, the substrate of an electrochemical storage device, the casing of an electrochemical storage device, the negative electrode of a capacitor, the positive electrode of a capacitor, the casing of a capacitor, the casing of a mechanical energy storage device, a mechanical spring, the metal frame of a flywheel, the casing of an electro-mechanical device, the electrodes of a piezo-electric element, the wiring of a magneto-electric element, the electrodes of a micro electromechanical system (MEMS), the casing of a thermal energy storage device, the casing of a chemical energy storage device, the casing of a fuel cell, the electrodes of a fuel cell, the electrical interconnects of between fuel cells, the casing of hydrogen generator with hydrogen container, the casing of an ozone generator with ozone container, the electrodes in a Peltier electric generator, the electrically and thermally conductive heat sinks（放熱板）within a Peltier electric generator, the casing of Peltier electric generator, the electrodes in an atomic particle generator, the casing of an atomic particle generator, the collectors in a magnetostrictive generator, and the casing of a magnetostrictive generator."
WO2013085618(特表2015-500569)
"2. The apparatus of claim 1 , wherein the set of discrete heat dissipation elements is a two-dimensional (2D) array of heat dissipation plates（放熱板）."
WO2015048162(特表2016-534915)
"A display mirror assembly for a vehicle includes a front shield having a first side（側面）and a second side. A partially reflective（部分的反射性）, partially transmissive（部分的透過性）element is mounted on the first side. A rear shield is disposed behind the front shield. A display module is mounted between the front shield and the rear shield and includes in order from（から順に）the front shield: a display; an optic block; a heat sink（放熱板）having an edge lit（エッジ点灯）PCB mounted along a top edge thereof; and a PCB. The front shield is secured to at least one component of the display module with a first retaining feature and the rear shield is secured to at least one component of the display module with a second retaining feature. A housing at least partially surrounds the partially reflective, partially transmissive element, the front shield, carrier plate, display module, and rear shield."
WO2012125632(特表2014-512091)
"1. A method for preparing a silicon-on-insulator structure comprising a handle wafer, a silicon device layer, a dielectric layer between the handle wafer and the silicon device layer, the handle wafer having an axis, a radius, a front surface, a back surface, and a peripheral edge extending in the axial direction from the front surface to the back surface, wherein ...
bonding a donor wafer and the handle wafer（ドナーウエハおよび前記ハンドルウエハを張り合わせる）to form a bonded wafer wherein the donor wafer and handle wafer are separated along the axis by the dielectric layer, the dielectric layer forming a donor-dielectric interface between the donor wafer and dielectric layer and a handle-dielectric interface between the dielectric layer and front surface of the handle wafer, the bonded wafer comprising a bond interface located at the donor-dielectric interface, the handle-dielectric interface or in the dielectric layer between the two interfaces; and
removing a portion of the donor wafer from the bonded wafer such that a silicon layer remains bonded to the dielectric layer to form the silicon on insulator structure."
WO2009049265(特表2011-501821)
"29. An apparatus for laminating curved optical films, comprising: a curved drum operable to provide a curved surface for bonding（張り合わせる）first and second optical films; at least two feeders operable to feed the first and second optical films onto the curve drum; a coating apparatus operable to apply adhesive to a surface of the first or second optical film; and a press roller operable to apply pressure against the first and second optical films and laminate the first and second optical films."
US20090100872(特表2011-500498)
"(Ab)
A method for laminating（張り合わせる）glass, glass-ceramic, or ceramic layers. The method comprises providing a first layer of glass, glass-ceramic, or ceramic, wherein the glass, glass-ceramic, or ceramic of the first layer is electromagnetic radiation-sensitive or has an electromagnetic radiation susceptor disposed on it; stacking（積層する）a second layer of glass, glass-ceramic, or ceramic on the first layer; and irradiating the stack with electromagnetic radiation to laminate the first and second layers."
WO2006138626(特表2008-547210)（中村修二氏）
(Ab)
"An (Al, Ga, In)N and ZnO direct wafer bonded（直接ウェーハ・ボンディングされた）light emitting diode (LED), wherein light passes through electrically conductive ZnO. Flat and clean surfaces are prepared for both the (Al, Ga, In)N and ZnO wafers. A wafer bonding process is then performed between the (Al, Ga, In)N and ZnO wafers, wherein the (Al, Ga, In)N and ZnO wafers are joined together（張り合わせ）and then wafer bonded（ウェーハ・ボンディングを行う）in a nitrogen ambient（窒素雰囲気中で）under uniaxial pressure at a set temperature for a set duration. After the wafer bonding process, ZnO is shaped for increasing light extraction from inside of LED."
WO2006135642(特表2008-543371)
(Ab)
"A stapler for delivering a staple formed from a shape memory material is disclosed. The staple includes a first tine and a second tine connected by a bridge. The staple may be disposed within the stapler in an open position with the first tine distal of the second tine. The stapler is configured to sequentially deliver the first tine and the second tine, respectively, to opposing body tissues. The stapler includes an elongate shaft (e.g., a catheter) having a working lumen and a control mechanism for delivering the staple. A drive cable extends along the working lumen of the elongate shaft. Upon warming up to a temperature at or above a transformation temperature of the shape memory material, the staple may assume a closed position, thus drawing together（引っ張り合わせ）opposing body tissues and closing an incision."
WO2006113179(特表2008-538449)
(Ab)
"A self-supported thin film membrane of ceramic materials and related electrochemical cells and cell stacks. The membrane structure is divided into a plurality of self-supporting thin membrane regions by a network of thicker integrated support ribs. The membrane structure may be prepared by laminating（張り合わせ）a thin electrolyte layer with a thicker ceramic layer that forms a network of support ribs."
WO200183623(特表2003-531758)
"16. A reactive multilayer foil comprising a deformed and laminated stack（張り合わせた積層体）of alternating layers of materials that can exothermically react, the stack deformed by pressure into a sheet with the layers laminated（張り合わされ）by cold welding."
WO2005012615(特表2007-500626)
"14. A method for forming a trim cover comprising:
a. supplying a cloth
b; applying（設ける）a polyurethane dispersion as a backing layer to said cloth, wherein said polyurethane backing layer is applied and adhered to（張り合わせかつ接着）the cloth without the use of adhesives or flame lamination."
WO2009148917(特表2011-522159)
"6. The method of claim 5 wherein the first and second EGR actuator commands are associated with at least one of（少なくとも一方）exhaust valve opening or closing percentages（弁の開度または閉度）."
WO2006073814(特表2008-527298)
"13. The control as set forth in claim 8, wherein at least one of said two methods utilizes a pressure ratio across an associated expansion device, and the following formula:
mr = %Cvj[pound][phi] ,
wherein said Ap value is a differential pressure across the associated expansion device, and
the % symbol is the percentage of opening（開度）of the associated expansion valve, with Cv being a characteristic constant of the associated expansion device."
US7234445(特表2007-501350)
"A device for actuating at least one throttle valve of an internal combustion engine is provided. When the throttle valve opening angles（開度）are small, the throttle valve and the actuating device are positively coupled, and when the throttle valve opening angles are large, the throttle valve and the actuating device are form lockingly coupled in the closing direction, but are only conditionally coupled in the opening direction, such that the throttle valve can be brought into operation for smaller throttle valve opening angles."
WO2014176121(特表2016-516532)
"29. The tissue removal system of claim 17, comprising a controller configured for controlling the extent to which the valve port is open（弁ポートの開度）, and providing a pulsed vacuum as a series of vacuum pulses defined by a maximum vacuum level and a minimum vacuum level, wherein the maximum vacuum level and the minimum vacuum level correspond to the extent to which the valve port is opened, the maximum vacuum level corresponds to the valve port being up to 100% open, and the minimum vacuum level corresponds to the valve port being 0% open or greater."
WO2013167892(特表2015-521061)
"8. A steam cleaner according to claim 7 wherein the control means effects alteration of the degree of opening（開度）of a constriction in the path of flow of the cleaning agent from the tank thereof to the cleaning head."
WO2012021706(特表2013-533457)
"1. An outdoor heat pump unit of a heat pump based air conditioning and heating system comprising
an enclosure with openings formed in its side and back panels,
a condenser fan mounted on the top of the enclosure and in communication with an interior of the enclosure, the condenser fan configured to draw air in through the openings in the side and back panels of the enclosure and across a heat exchanger positioned within the interior of the enclosure,
a discharge hood mounted on the top of the enclosure over the condenser fan, the discharge hood including a discharge outlet, and
a damper mounted adjacent the outlet of the discharge hood and configured to adjust the opening（開度）of the outlet as a function of outside ambient air temperature."
US9109519(特表2013-519040)
"6. The method as recited in claim 1, wherein the control variables include an opening（開度）of the throttle valve, an opening of the exhaust gas recirculation valve, and at least one of an opening angle（開角）of an intake valve, and a closing angle（閉角）of the intake valve."
US7823442(特表2010-523892)
(Ab)
"A throttle position sensor（スロットル開度センサ）having a housing and a body rotatably mounted within the housing. An alignment clip is attached to the body so that the alignment clip rotates in unison with（調和して）the body. This alignment clip, furthermore, is adapted to receive an end of a throttle shaft at a predetermined angular position and aligned body to the throttle shaft. A sensor is also mounted to the housing and generates an output signal representative of the rotational position of the body relative to the housing."
WO2006006985(特表2008-504161)
"4. The method of claim 3, wherein the at least one parameter is selected from the group of (i) a rate of fuel flow to the engine, (ii) a rate of air flow to the engine, (iii) a timing of fuel injection, (iv) a throttle position（スロットル開度）, and (v) an engine air pressure."
6歳の雌です。文字通り、バタン！キュ～。在宅での仕事はコイツと金魚が話し相手です。
生きてます。
In isolation the process is only 25% efficient, but this is greatly increased (to around 50%) when used with a low-grade cold store, such as a large gravel bed, to capture the cold generated by evaporating the cryogen. The cold is re-used during the next refrigeration cycle.[8]
冷熱：the cold?
Cryogenic energy storage (Wikipedia)
WO2014059331(特表2016-500530)
"89. The adaptive optics scanning system of claim 6, wherein the detector(s) (735) comprises a high speed photodiode to implement（実現）unbalanced detection or two high speed photodiodes to implement balanced detection for performing swept source / Fourier domain OCT."
WO2008143810(特表2010-527557)
"4. The device of Claim 1 wherein the wireless interface is a Bluetooth physical layer with a Bluetooth proxy to implement（実現）a packet switching gateway."
WO2005114503(特表2008-502033)
"18. The method of Claim 14, further comprising evaluating said at least portion of said design using graded feasibility（実現可能性）models.
"28. The apparatus of Claim 27, wherein said computer program is further adapted to:
identify at least one value for at least one performance metric associated with a first lower level of said hierarchical process, said at least one value being selected such that at least one performance metric associated with a first higher level of said hierarchical process is substantially optimized; and subsequently identifying a set of performance metrics in a second lower level of said hierarchy such that at least one performance metric associated with a second higher level of said hierarchal process is realized（実現）."
WO2004084035(特表2006-524007)
"9. The apparatus of claim 8, wherein the loader is configured to perform actions, further comprising: (a) receiving a request for access to the screener key from the decryption engine ; (b) requesting authorization to provide（実現）access foa a a authentication module ; and (c) if authorization is received, providing the encrypted screener key to the decryption engine."
