スタッドバンプ

US7118389
"A socket for solderless connection between a stud-bumped（スタッドバンプ）IC chip and a host PCB. The socket includes a three-dimensional (e.g., cylindrical or cubical（立方体) hollow metal frame that is either free-standing（自立）or supported by an underlying（下方、下部）patterned template structure. The metal frame includes side walls（側壁）that extend（延在）away from the host PCB, and a contact structure located at the upper (i.e., free) end of the side walls. The contact structure defines an opening through which a stud bump can be inserted into a central chamber of the metal frame. The side walls and/or the contact structure are formed such that when the tip end（先端）of the stud bump is inserted into the central chamber, at least one of the base structure and the sidewall（少なくとも一方）of the stud bump abuts（当接）the contact structure at two or more contact points."

abut (vi):  to touch along a border or with a projecting part; terminate at a point of contact; lean or rest for support (Merriam-Webster Unabrided)

"1. A socket for electrically connecting a stud bump mounted thereon, the stud bump including a base section and an elongated（長い、長尺）body extending between the base section to a tip end, ... the contact structure defining an opening that communicates with（連通）the central chamber..."

"Recently, the stud-bump bonding (SBB) technology, which is based on the wire-bonding technology, has been developed（開発）as a very attractive solution（手法、手段）for a low-cost flip-chip technology. With SBB technology, gold stud bumps are placed on the die bond pads of IC chips through a modification of the “ball bonding” process used in conventional wire bonding. In ball bonding, the tip（先端）of the gold bond wire is melted to form a sphere. The wire-bonding tool presses this sphere against（押し付け）the aluminum bond pad, applying mechanical force, heat, and ultrasonic energy to create a metallic connection. The wire-bonding tool next extends the gold wire to the connection pad on the board, substrate, or lead frame, and makes a “stitch” bond to that pad, finishing by breaking off（切断）the bond wire to begin another cycle. For gold stud bumping, the first ball bond is made as described, but the wire is then broken close above the ball. The resulting gold ball with truncated wire, or “stud bump”, remains on the bond pad to provide（して～を可能とする）a permanent, reliable connection through the aluminum oxide to the underlying metal. This technology has several advantages: UBM process is not necessary, bumping cost is low, and fine-pitch（狭い、微小ピッチ） and chip-level bumping is possible."