外部に露出

US20160379940
FIG. 5C schematically discloses reconstituted wafer 260 after having been removed from carrier 201, and turned upside down. In the case of the carrier 201 being a thermo-releasable tape, reconstituted wafer 260 may have been removed from carrier 201 by a heating procedure. Like in the previous embodiment, reconstituted wafer 260 consists of the molded material covering semiconductor chips 2 whose first main faces 104 and connection elements 102 are exposed to the outside.

US4573873
Consider now the pitch control elements of the present invention starting with cyclic pitch control tube 100 and collective pitch control tube 102. Cyclic pitch control tube 100 is disposed within stationary mast 52 and is concentric with longitudinal axis 50. Disposed outside of cyclic pitch control tube 100 is collective pitch control tube 102 which is disposed within drive shaft 66 and stationary mast 52. Thus, beginning from longitudinal axis 50, cyclic pitch control tube 100, collective pitch control tube 102, drive shaft 66, and stationary mast 52 form a nested series of concentric tubes each substantially centered and aligned with longitudinal axis 50 in the order recited. Thus, the only shaft or tube exposed to the outside is stationary mast 52. What results is a highly compact control and drive system totally contained within a single aerodynamic, stationary housing. Thus, the amount of air drag which arises from rotational motion of the control elements can be minimized and controlled. Damage vulnerability is also decreased.

US10236683
FIG. 1 is a combined block diagram and circuit schematic of an electronic system in which a controller 12 is provided to detect liquid intrusion through an external connector 3 (e.g., a receptacle connector as depicted in FIG. 6a ), and also to take a preventative action that mitigates corrosion in the connector 3. In this example, the system is a consumer electronics portable device 1, such as a smartphone, a mobile or cellular phone, a tablet computer, a laptop computer, or a wearable such as a wristwatch or a headset, whose housing has the external connector 3 built-in but exposed to the outside (and hence liquid intrusion). 

US20140248472
FIG. 7 shows both a top surface 102 and a bottom surface 103 of the sapphire part 100 having a compressive layer 160 created through ion implantation. In some embodiments, the top surface 102 and/or a portion of the top surface may be implanted with different ions and/or a different concentration of ions than the bottom surface 103. It should be appreciated that in other embodiments, one of the surfaces may not be implanted with ions. This may be the case when one of the surfaces is not to be exposed externally from a device housing, thus limiting its exposure to defect inducing impacts and other operational effects.

US2015116958
In some embodiments, at least a portion of the internal stiffener 300 may be exposed externally through the surface of the feature and/or region of overmold material 105. Accordingly, the internal stiffener 300 need not be totally encompassed within the feature 305 (e.g., hook) and/or overmold. Likewise, certain connecting structures may be only partially encapsulated in order to secure the connecting structure, and thus the modularized PCB, to a support. The location and configuration of any such connecting structure may vary between embodiments.