ENGLISH LANGUAGE & USAGE
The Difference Between
perimeter: 外周、周長（数学）、周辺、外面
periphery: 周辺、外面
Merriam Webster Unabridgedによれば、peripheryは1) the perimeter of a circle, ellipse, or other closed curvilinear figure, 2) the external boundary or surface of any body
peripheryにすでにexternalの意味があるから、例えば「外周部」の訳としてexternal (outer) periphery portionは冗長か？
追記 内周があれば別
ある回路から別の回路への「回り込み信号」
wrap-around signal ?
runaround signal ?
stray signal ?
sneak signal ?
extraneous signal ?
US20080002793
"[0029] FIG. 2 is a schematic block diagram depicting a full duplex device enabled with a digital communications auto-squelch system. The device 200 is full duplex in that it can communicate in both Rx (uplink) and Tx (downlink) directions. The alarm detection module function described in FIG. 1 is here performed with an Rx alarm detection circuit 202 to read incoming signals, and a programming and control block 204 to process the receive signals and determine if an alarm condition exists. Further, an Rx pattern generation block 206 generates the alarm-condition signal in response to commands（命令）from the programming block 204. An Rx MUX 208 passes the received signal or the alarm-condition signal in response to commands from the programming block 204. Duplicate functionality exists in the Tx link. Further, the Rx MUX 208 can be used to wrap-around（巻き込む？）a Tx link signal into the Rx link. For example, the wrap-around signal（巻き込み信号？）can be an alarm-condition signal generated by Tx pattern generation block 210. That is, the user can configure any alarm-condition signal to run from any device input, to any device output."
US9347851
"In certain embodiments of the invention, the selection of the frequency and velocity values for use is determined as follows. The mathematical modeling predicts specific values, but these values are verified by reviewing the data acquired. The process produces a verification signal that has traveled over 360° around the pipe. If the verification signal is the reflection from a long seam weld, it has traveled over 180° down and back. If the verification signal is the pitch catch wrap-around signal（回り込み信号；パイプを一周した信号）, it has traveled over 360° from one transducer to the other transducer. Since the pipe diameter is known and the transducer separation is known, the distance the wrap-around signal traveled is also known."
US20110019728
"As previously mentioned, the above-examples illustrated in FIGS. 12-18 are based on application of a superframe (i.e., a controlled sequence of frames) using a pulse shift and wrap around modification operation to suppress the carrier. However, other techniques can also be used to suppress the carrier and other techniques can be used to control the modulation sequencing. In a particular example, the modulation sequencing, using the superframe concepts described above, can be applied to a chopped PWM signal, a pulse shift with no wrap around signal（巻き込み信号？）, a PWM signal with a suppressed carrier based on other carrier modulation techniques, or any combination thereof, to achieve results similar to those illustrated in FIGS. 14-19."
"With wrap around（巻き込み、包含？）, when a PWM pulse that is wider than T/2 is shifted by −T/4, any portion of the pulse that would fall into the previous frame (i.e., that would cross the frame boundary) is placed at the end of the current frame (i.e., is wrapped around)."
相補的：complementary (serving to complete)
おべんちゃら：complimentary (expressing praise)
デザート：dessert（多い方が良いからsが１つ多い）
砂漠：desert
Surface-mount technology, Wikipedia
"Surface-mount technology (SMT) is a method for producing（製造、作製）electronic circuits in which the components are mounted（搭載、実装）or placed（配置）directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction（組立、製造、製作）method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole（スルーホール、貫通孔）technology used for components not suitable for surface mounting（表面実装）such as large transformers and heat-sinked（放熱板付きの？）power semiconductors."
"Surface-mount technology was developed in the 1960s and became widely used in the late 1980s. Much of the pioneering work in this technology was by IBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the Launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles.[2] Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board（基板）became far more common with surface mounting than through-hole mounting（挿入実装）, allowing much higher circuit densities. Often only the solder joints hold the parts to the board, in rare cases parts on the bottom or "second" side of the board may be secured（固定）with a dot of adhesive to keep components from dropping off inside reflow ovens if the part has a large size or weight.[citation needed] Adhesive（接着剤）is sometimes used to hold SMT components on the bottom side（裏面）of a board if a wave soldering process is used to solder both SMT and through-hole components simultaneously. Alternatively, SMT and through-hole components can be soldered together without adhesive if the SMT parts are first reflow-soldered, then a selective solder mask is used to prevent the solder holding the parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to（可能にする、相性が良い、向いている）a high degree of automation, reducing labor cost and greatly increasing production rates（生産率；＊「生産性」の英訳としてproductivityに違和感を感じる場合がある。その場合、production ratesの方が良いかも？）. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of equivalent through-hole parts."
"Assembly Techniques
Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to（塗布）all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer. After pasting, the boards then proceed to the pick-and-place machines（ピックアンドプレイス）, where（そこで）they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays. Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB.
The boards are then conveyed into the reflow soldering oven. They first enter a pre-heat zone, where the temperature of the board and all the components is gradually, uniformly raised. The boards then enter a zone where the temperature is high enough to melt the solder particles in the solder paste, bonding the component leads to the pads on the circuit board. The surface tension of the molten solder helps keep the components in place, and if the solder pad geometries（形状）are correctly designed, surface tension automatically aligns the components on their pads. There are a number of techniques for reflowing solder. One is to use infrared lamps; this is called infrared reflow. Another is to use a hot gas convection. Another technology which is becoming popular again is special fluorocarbon liquids with high boiling points which use a method called vapor phase reflow. Due to environmental concerns, this method was falling out of favor（廃れる）until lead-free legislation was introduced which requires tighter controls on soldering. Currently, at the end of 2008, convection soldering is the most popular reflow technology using either standard air or nitrogen gas. Each method has its advantages and disadvantages. With infrared reflow, the board designer must lay the board out（レイアウト、配置）so that short components don't fall into the shadows of tall components. Component location is less restricted if the designer knows that vapor phase reflow or convection soldering will be used in production（製造）. Following（の後）reflow soldering, certain irregular or heat-sensitive components may be installed and soldered by hand, or in large-scale automation, by focused infrared beam (FIB) or localized convection equipment.
If the circuit board is double-sided then this printing, placement, reflow process may be repeated using either solder paste or glue to hold the components in place. If a wave soldering process is used, then the parts must be glued to（接着）the board prior to processing to prevent them from floating off when the solder paste holding them in place is melted.
After soldering, the boards may be washed to remove flux residues and any stray solder balls that could short out（短絡）closely spaced component leads. Rosin flux is removed with fluorocarbon solvents, high flash point hydrocarbon solvents, or low flash solvents e.g. limonene (derived from orange peels) which require extra rinsing or drying cycles. Water-soluble fluxes are removed with deionized water and detergent, followed by an air blast to quickly remove residual water. However, most electronic assemblies are made using a "No-Clean" process where the flux residues are designed to be left on the circuit board [benign]. This saves the cost of cleaning, speeds up the manufacturing process, and reduces waste."
SMT placement equipment, Wikipedia
"SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, consumer electronics as well as industrial, medical, automotive, military and telecommunications equipment."（対応日本語ページでは「チップマウンター」とあり、"surface mounter"との記載があるが、和製英語かも。"pick and place machine"?）
US7545514
"FIG. 1 is a diagrammatic view of an exemplary Cartesian pick and place machine 201 with which embodiments of the present invention are applicable. Pick and place machine 201 receives a workpiece, such as circuit board 203, via transport system or conveyor 202. A placement head 206 then obtains one or more electrical components to be mounted upon（実装、配設）workpiece 203 from component feeders (not shown) and moves in x, y and z directions, relative to workpiece 203, to place（配置）the component in the proper orientation at the proper location upon workpiece 203. Placement head 206 may include sensor 205 that is disposed to view one or more components held by respective one or more nozzle, from a substantially side view as placement head 206 moves the component(s) from pickup locations to placement locations. Sensor 205 allows placement machine 201 to view components held by nozzles 208, 210, 212 such that pick efficacy can be determined prior to mounting the component(s) upon workpiece 203. Other pick and place machines may employ a placement head that moves over a stationary camera to image（撮像；"capture(take) an image of"の方が良いという人もいる）the component. Placement head 206 may also include a downwardly looking camera 209, which is generally used to locate fiducial marks upon workpiece 203 such that the relative location of placement head 206 with respect to workpiece 203 can be readily calculated."
US5075759
"With the increasing use of high power transistors (1 to 80 Watts) in electrical circuits which operate at high frequencies, such as radio frequencies (RF), e.g. 25 MHz to 1GHz, it has become necessary to design transistor packages which permit the transistors to operate properly in such circuits. The packages for such high power transistors must be capable of dissipating（放熱）the relatively high quantities of heat generated by the transistor to maintain the transistor at a suitable operating temperature, i.e., a temperature which will not adversely affect（悪影響）the operating characteristics of the transistor. Another important characteristic for such packages is that they provide for（可能にする;make ready, make preparations）good electrical grounding of the transistor with a minimum of parasitic inductance."
"In addition, some prior art semiconductor device packages are prone to（し易い、しがち）have flux and solder enter the cavity of the device, for example, during soldering operations used to attach the packages to the circuit. Further, most prior art RF packages are not well suited for surface mounting and are not designed to be easily handled by pick and place equipment. Also, positioning of capacitors close to most prior art packages is often difficult because of the protruding flying leads found on these packages."
Inductor, Wikipedia
An inductor（＊不定冠詞；具体的、ある特定の例を意識）, also called a coil or reactor, is a passive two-terminal（2端子）electrical component which resists changes（変化；＊複数、色々な変化、一般）in electric current（＊無冠詞、特定する必要ない）passing through it. It consists of a conductor such as a wire, usually wound into a coil. Energy is stored in a magnetic field in the coil as long as current（＊無冠詞）flows. When the current flowing through an inductor changes, the time-varying（時間的に変化、時変）magnetic field induces a voltage（＊不定冠詞）in the conductor, according to Faraday’s law of electromagnetic induction. According to Lenz's law（＊無冠詞）the direction of induced electromotive force (or "e.m.f.") is always such that it opposes the change in current that created it. As a result, inductors（＊複数）always oppose a change in current, in the same way that a flywheel opposes a change in rotational velocity（回転速度；＊無冠詞）. Care should be taken（気を付ける、注意）not to confuse this with the resistance provided by a resistor.
resonator: passive, part of oscillator
oscillator: active
Difference between resonator and oscillator
"A crystal oscillator is an electronic oscillator circuit that uses the mechanical resonance of a vibrating crystal of piezoelectric material" (Crystal Oscillator, Wikipedia)
US9190698 (Lithium-ion electrolytes with improved safety tolerance to high voltage systems)
"The invention discloses various embodiments of electrolytes for use in（ための、用）lithium-ion batteries, the electrolytes having improved safety and the ability to operate with high capacity anodes and high voltage cathodes. In one embodiment there is provided（倒置）an electrolyte for use in a lithium-ion battery comprising（から成る）an anode and a high voltage cathode. The electrolyte has a mixture of a cyclic carbonate of ethylene carbonate (EC) or mono-fluoroethylene carbonate (FEC) co-solvent, ethyl methyl carbonate (EMC), a flame retardant additive, a lithium salt, and an electrolyte additive that improves compatibility and performance of the lithium-ion battery with a high voltage cathode. The lithium-ion battery is charged to a voltage in a range of from about 2.0 V (Volts) to（範囲）about 5.0 V (Volts)." (Abstract)
"Lithium-ion (“Li-ion”) cells typically include a carbon (e.g., coke or graphite) anode intercalated with（挿入）lithium ions to form LixC; an electrolyte consisting of a lithium salt dissolved in one or more（一種類以上の）organic solvents; and a cathode made of（から成る、作製、作られた、構成）an electrochemically active material, typically an insertion compound, such as LiCoO2. During cell discharge, lithium ions pass from the carbon anode, through the electrolyte to the cathode, where the ions are taken up（引き出す？）with the simultaneous release of electrical energy. During cell recharge, lithium ions are transferred back to the anode, where they reintercalate into（再挿入）the carbon matrix."
"Future NASA missions aimed at exploring Mars, the Moon, and the outer planets require rechargeable batteries that can operate effectively over a wide temperature range (−60° C. (Celsius) to +60° C. (Celsius)) to satisfy the requirements of various applications, including: Landers (lander spacecraft), Rovers (surface rover spacecraft), and Penetraters (surface penetrator spacecraft). Some future applications typically（典型）will require high specific energy batteries that can operate at very low temperatures, while still providing adequate（十分な）performance and stability at higher temperatures. In addition, many of these applications envisioned（想定、計画、予測）by the ESRT (Exploration Systems Research and Technology) program will require improved safety, due to their use by humans. Lithium-ion rechargeable batteries（複数形；一般）have the demonstrated characteristics of high energy density, high voltage, and excellent cycle life. Currently, the state-of-the-art lithium-ion system（定冠詞、断定的；不定冠詞だと変に具体的になって聞き手、読み手の好奇心を下手にくすぐるのではないか？）has been demonstrated to operate over a wide range of temperatures (−40° C. to +40° C.), however, abuse（過酷な）conditions such as being exposed to high temperature, overcharge, and external shorting, can often lead to cell rupture and fire. The nature of the electrolyte can greatly affect the propensity of the cell/battery to（傾向、易さ）catch fire, given the flammability of the organic solvents used within. Therefore, extensive effort has been devoted recently to developing（近年、開発のため鋭意努力）non-flammable electrolytes to reduce the flammability of the cell/battery."
"Desired properties for Li-ion electrolytes can include high conductivity over a wide temperature range (e.g., 1 mS (milli-Siemens) cm−1 from −60° C. to +60° C.); good electrochemical stability over a wide voltage range (e.g., 0 to 4.5V (volts)) with minimal oxidative degradation of solvents/salts; good chemical stability; good compatibility with a chosen electrode couple, including good SEI (solid electrolyte interface) characteristics on the electrode and facile lithium intercalation/de-intercalation kinetics; good thermal stability; good low temperature performance throughout the life of the cell, including good resilience to high temperature exposure and minimal impedance build-up with cycling and/or storage; and low toxicity. Since the flammability of the electrolyte solution in Li-ion batteries is a major concern, significant research has been devoted to developing electrolyte formulations with increased safety. Known electrolytes used in state-of-the-art Li-ion cells have typically comprised binary mixtures of organic solvents, for example, high proportions of ethylene carbonate, propylene carbonate or dimethyl carbonate, within which is dispersed a lithium salt, such as lithium hexafluorophosphate (LiPF6). Examples may include 1.0 M (molar) LiPF6 in a 50:50 mixture of ethylene carbonate/dimethyl carbonate, or ethylene carbonate/diethyl carbonate. More recently, electrolytes have also been developed which combine more than two solvents and/or have incorporated the use of electrolyte additives to address specific performance goals."
Lithium-ion battery (Wikipedia)
"The three primary functional components of a lithium-ion battery are the positive and negative electrodes and electrolyte. Generally, the negative electrode of a conventional lithium-ion cell is made from（から成る、作られる）carbon. The positive electrode is（である、から成る）a metal oxide, and the electrolyte is a lithium salt in an organic solvent.[45] The electrochemical roles of the electrodes reverse（逆になる）between anode and cathode, depending on the direction of current flow through the cell.
The most commercially popular negative electrode is graphite. The positive electrode is generally one of three materials: a layered oxide (such as lithium cobalt oxide), a polyanion (such as lithium iron phosphate) or a spinel (such as lithium manganese oxide).[46]
The electrolyte is typically a mixture of organic carbonates such as ethylene carbonate or diethyl carbonate containing complexes of lithium ions.[47] These non-aqueous electrolytes generally use non-coordinating（非配位性）anion salts such as lithium hexafluorophosphate (LiPF
6), lithium hexafluoroarsenate monohydrate (LiAsF
6), lithium perchlorate (LiClO
4), lithium tetrafluoroborate (LiBF
4) and lithium triflate (LiCF
3SO
3)."
"The participants（関与する）in the electrochemical reactions in a lithium-ion battery are the negative and positive electrodes with the electrolyte providing a conductive medium for Lithium-ions to move between the electrodes.
Both electrodes allow lithium ions to move in and out of their interiors. During insertion (or intercalation)（挿入）ions move into the electrode. During the reverse process, extraction (or deintercalation)（脱離）, ions move back out. When a lithium-ion based cell is discharging（放電している）, the positive Lithium ion moves from the negative electrode (usually graphite = "
" below) and enters the positive electrode (lithium containing compound). When the cell is charging（充電している; cf. being charged）, the reverse occurs.
Useful work is performed when electrons flow through a closed external circuit. The following equations show one example of the chemistry, in units（単位）of moles, making it possible to use coefficient 
.
The cathode (marked +) half-reaction is:[54]
The anode (marked -) half reaction is:
The overall reaction has its limits. Overdischarge（過放電）supersaturates lithium cobalt oxide, leading to the production（生成、発生、生じる） of lithium oxide,[55] possibly by the following irreversible reaction:
Overcharge（過充電）up to 5.2 volts leads to the synthesis of cobalt(IV) oxide, as evidenced by x-ray diffraction:[56]
In a lithium-ion battery the lithium ions are transported to and from the positive or negative electrodes by oxidizing the transition metal, cobalt (Co)（遷移金属、すなわちコバルト）, in Li
1-xCoO
2 from Co3+
to Co4+
during charge, and reduced from Co4+
to Co3+
during discharge. The cobalt electrode reaction is only reversible for x < 0.5, limiting the depth of discharge allowable. This chemistry was used in the Li-ion cells developed by Sony in 1990."
"Electrolytes[edit]
The cell voltages given in the Electrochemistry section are larger than the potential at which aqueous solutions will electrolyze（電解する）.
Liquid electrolytes（液体電解質）in lithium-ion batteries consist of（から成る）lithium salts, such as LiPF
6, LiBF
4 or LiClO
4 in an organic solvent, such as ethylene carbonate, dimethyl carbonate, and diethyl carbonate.[57] A liquid electrolyte acts as（作用、機能する）a conductive pathway for the movement of cations passing from the positive to the negative electrodes during discharge（放電中）. Typical conductivities（複数形）of liquid electrolyte at room temperature (20 °C (68 °F)) are in the range of 10 mS/cm, increasing by approximately 30–40% at 40 °C (104 °F) and decreasing slightly at 0 °C (32 °F).[58]
The combination of linear and cyclic carbonates (e.g., ethylene carbonate (EC) and dimethyl carbonate (DMC)) offers（により得ることができる）high conductivity and SEI-forming ability. A mixture of a high ionic conductivity and low viscosity carbonate solvents is needed, because the two properties are mutually exclusive in a single material.[59]
Organic solvents easily decompose（分解する）on the negative electrodes during charge（充電中）. When appropriate organic solvents are used as the electrolyte, the solvent decomposes on initial charging and forms a solid layer called the solid electrolyte interphase (SEI),[60] which is electrically insulating yet provides significant ionic conductivity. The interphase prevents further decomposition of the electrolyte after the second charge. For example, ethylene carbonate is decomposed at a relatively high voltage, 0.7 V vs. lithium, and forms a dense and stable interface.[61]
Composite electrolytes based on POE (poly(oxyethylene)) provide（が得られる）a relatively stable interface.[62][63] It can be either solid (high molecular weight) and be applied in dry Li-polymer cells, or liquid (low molecular weight) and be applied in regular Li-ion cells.
Room temperature ionic liquids (RTILs) are another approach to（するための方法、手段）limiting the flammability and volatility of organic electrolytes.[64]"
"Materials[edit]
The increasing demand for batteries has led vendors and academics to focus on improving the energy density, operating temperature, safety, durability, charging time, output power, and cost of lithium ion battery solutions. The following materials have been used in commercially available cells. Research into other materials continues.
Cathode materials are generally constructed out of（から成る、構成される）two general materials: LiCoO¬2 and LiMn2O4. The cobalt-based material develops a pseudo tetrahedral structure that allows for two-dimensional Lithium ion diffusion.[78] The cobalt-based cathodes are ideal due to their high theoretical specific heat capacity, high volumetric capacity, low self-discharge, high discharge voltage, and good（良好）cycling performance. Limitations include the high cost of the material, slight toxicity, and low thermal stability.[79] The manganese-based materials adopt a cubic crystal lattice system, which allows for three-dimensional Lithium ion diffusion.[78] Manganese cathodes are attractive（興味深い、注目されている）because manganese is cheaper and less toxic than other materials used. Limitations include the tendency for manganese to dissolve into the electrolyte during cycling leading to poor cycling stability for the cathode.[79] Cobalt-based cathodes are the most common however other materials are beginning to be developed to make cheaper and less toxic cathodes.[80]"
US5057692 (High speed, radiation tolerant, CT scintillator system employing garnet structure scintillators)
"This class of scintillator material is based on activated luminescence of cubic garnet crystals. Garnets are a class of materials with the crystal chemical formula A3 B5 O12 in which the A cations are eight-coordinated（８配位）with oxygens and the B cations are either octahedrally (six) or tetrahedrally (four) coordinated（８面体または４面体配位）with oxygens. The crystal structure is cubic with 160 ions per unit cell containing eight formula units. In accordance with the present invention, the A cations are rare earth or yttrium ions alone, in combinations and/or with activator substitutions. The B cations may be rare earth ions or other ions, again, alone, in combinations and/or with substitutions. In particular, we have found that with activator ions substituted in the eight-coordinated or six-coordinated（８配位または６配位）sites, these garnets are luminescent in response to x-ray stimulation. A particularly important activator ion which we have discovered is x-ray luminescent in this host material is the chromium 3+ ion located in six-coordinated（６配位）sites."
US8808807 (Functionalized inorganic films for ion conduction)
"To increase the water retention in the porous inorganic films, hydrophilic species, such as silica, alumina, niobia, or aluminosilica, are incorporated into the inorganic framework along the pore surfaces. The formation of Brønsted acid sites in the framework increases the acidity and hydrophilicity of the material. For example, treatment（処理）of the mesoporous silica film with an alkaline solution containing soluble aluminum species yields（生み出す、生ずる）an aluminosilica film that has four-coordinated（４配位）Al—O—Si sites (e.g., Brønsted or Lewis acid sites) incorporated on the surface of the silica framework. As shown in FIG. 3, the quantity of four-coordinated（４配位）Al sites in the film is determined by single-pulse 27Al MAS NMR. The peaks at 113 ppm, 5 ppm, and 9 ppm correspond to AIN, four-coordinated Al, and six-coordinated（６配位）Al, respectively. About 90% of the incorporated aluminum atoms in the film possess approximately a tetrahedral coordination（４面体配位）, while the remaining aluminum atoms have closer to octahedral coordination（８面体配位）corresponding to framework aluminum atoms that are coordinated（配位）additionally with adsorbed water molecules or that are extra-framework species in the form of macroscopically phase-separated Al2O3. Two-dimensional HETeronuclear chemical shift CORrelation (HETCOR) NMR spectroscopy establishes unambiguously that a substantial fraction of the six-coordinated（６配位）Al atoms are interacting strongly with adsorbed water, consistent with the increased hydrophilicity of the film. Correlated signal intensity in the 29Si{1H} HETCOR spectrum in FIG. 4 shows that four-coordinated（４配位）framework 29Si sites are interacting with water protons in the sample. Specifically, cross-peaks associated with chemical shift correlations between the protons of water and the 29Si species that are covalently bonded to framework 27Al species through an oxygen bridge are clearly evident in FIG. 4. The corresponding experimental conditions（実験条件）are: 10 kHz spinning rate, 3.6 μs 90° 1H pulse, 1 s recycle delay, and 2096 scans for each of the 64 t1, increments."
S6848715 (Autoliv ASP, Inc.)
A folded rigid knee airbag for preventing the（定冠詞）lower body portion of a vehicle occupant from being propelled forward during a collision is provided. The folded rigid knee airbag includes a back panel and a front panel attached to（取付）the back panel. Both the front panel and the back panel may be made from（作る、作製、成る）a rigid material, such as sheet metal. The back panel may include first and second accordion folds（蛇腹状の折り畳み）, and first and second vertical folds. The airbag may be in communication with（連通）an inflator. During discharge of the inflator, the accordion folds and the vertical folds unfold（広がる、解ける）to form four substantially planar walls. The accordion folds and the vertical folds enable the front panel to remain substantially flat and maintain a substantially uniform cross-sectional area during inflation（膨張）.
What is claimed is:
1. An airbag for preventing the lower body portion of a vehicle occupant from being propelled forward during a collision, comprising: a front panel made from a rigid material; a back panel made from a rigid material and attached to the front panel, the back panel comprising an inflator interface configured to（構成）receive（受け入れる、収容する）an inflator such that（であるように、結果）the inflator is substantially stationary with respect to a substantially flat portion of the back panel during inflation of the airbag; wherein the back panel comprises a plurality of folds that cross each other（互いを横断する）such that the front panel remains substantially flat during discharge of the inflator.
2. The airbag of claim 1, wherein the back panel is configured so that（であるように構成）the front panel is disposed substantially parallel to the back panel after discharge of the inflator.
3. The airbag of claim 1, wherein the back panel is configured so that the front panel is disposed at an angle（傾斜）relative to the back panel after discharge of the inflator.
4. The airbag of claim 1, wherein the back panel and the front panel are made from sheet metal.
5. The airbag of claim 1, wherein the front panel is thicker than the back panel.
6. The airbag of claim 1, wherein the front panel comprises a peripheral region, wherein the back panel comprises a peripheral region, and wherein the peripheral region of the front panel is folded around the peripheral region of the back panel.
7. An airbag for preventing the lower body portion of a vehicle occupant from being propelled forward during a collision, comprising: a front panel made from a rigid material; a back panel made from a rigid material and attached to the front panel, the back panel comprising an inflator interface configured to receive an inflator, wherein the inflator interface is centrally located（中心に配置）with respect to the back panel, the back panel further comprising a folded portion configured to unfold during discharge of the inflator to form a substantially planar portion.
8. The airbag of claim 7, wherein the back panel is configured so that the front panel is disposed substantially parallel to the back panel after discharge of the inflator.
13. An airbag for preventing the lower body portion of a vehicle occupant from being propelled forward during a collision, comprising: a front panel made from a rigid material; a back panel made from a rigid material and attached to the front panel, the back panel comprising: an inflator interface configured to receive an inflator; a first accordion fold configured to unfold during discharge of the inflator to form a first substantially planar（平面）wall; a second accordion fold configured to unfold during discharge of the inflator to form a second substantially planar wall opposite the first substantially planar wall; a first vertical fold configured to unfold during discharge of the inflator to form a third substantially planar wall adjacent（隣接）the first and second substantially planar walls; and a second vertical fold configured to unfold during discharge of the inflator to form a fourth substantially planar wall opposite the third substantially planar wall.
14. The airbag of claim 13, wherein the size（定冠詞）of the second accordion fold is substantially equal to the size of the first accordion fold.
15. The airbag of claim 14, wherein the first and second vertical folds extend from the first edge to the second edge, and wherein the first and second vertical folds have a substantially uniform height.
16. The airbag of claim 13, wherein the size of the second accordion fold is greater than the size of the first accordion fold.
17. The airbag of claim 16, wherein the first and second vertical folds extend（延在）from the first edge to the second edge, and wherein the height of the first and second vertical folds increases moving in a direction（の方向に行くにしたがって増加）from the first edge to the second edge.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an airbag designed to protect the occupants of a vehicle during a collision. More specifically, the invention relates to a folded rigid knee airbag that prevents the lower body portion of a vehicle occupant from being propelled（投げ出す）forward during a collision.
2. Description of Related Art
Inflatable airbags enjoy widespread acceptance（普及）as passenger restraints for use in motor vehicles. In fact, vehicle manufacturers are now required to install（取付）airbags in most new vehicles manufactured for sale in the United States.
Airbags are often installed in the steering wheel and in the dashboard on the passenger side of a car. These airbags are typically covered by a trim cover panel that is made of（作る、作製、成る）rigid plastic, and that is configured to be opened by the pressure created by the deploying（展開）airbag. These airbags are typically used for the primary deceleration of a vehicle occupant since, in a large fraction（割合）of collisions, the occupant is accelerated forward toward the windshield. Thus, such an airbag will be referred to herein as a "primary airbag."
A primary airbag is typically in communication with an inflator, which is typically in communication with a sensor mechanism configured to sense an impact to the vehicle. Upon receipt of（受ける、受信）an electrical signal transmitted from the sensor mechanism, the inflator discharges, causing the primary airbag to inflate. In its inflated position, the primary airbag prevents the upper body portion of a vehicle occupant from being propelled forward toward the windshield. When this occurs, there is a tendency for the lower body portion of the occupant to be propelled forward and under the primary airbag. This tendency is referred to as "submarining（潜航、潜水）," and may be quite pronounced when the occupant is not properly restrained by a seat belt.
Knee airbags have been developed in order to prevent submarining. Knee airbags deploy during a collision event and engage an occupant's knees or lower legs, thus holding the occupant in place（固定）on the seat and preventing submarining.
One known rigid knee airbag is a metallic bladder which includes two metal sheets that are welded together along the edges（定冠詞）. However, during deployment the center of such a metallic bladder expands to a greater extent than the peripheral regions. Therefore, the surface（定冠詞）of such a metallic bladder can interact with a vehicle occupant at an angle during an accident.
Another known rigid knee airbag is an inflatable bladder that includes a forward main panel and a rearward main panel. Each of the main panels has a generally octagonal shape prior to inflation. The inflatable bladder also includes right and left end panels. Prior to inflation, the end panels are folded to form pleat folds（プリーツ、ひだ状の折り畳み）. However, such a knee airbag has a projected area（投影面積）prior to deployment which is much larger than the ultimate reaction surface presented to the occupant. Such an airbag is therefore inefficient to package（収める、収納）inside a vehicle.
Accordingly, it would be an advancement in the art to provide a folded rigid knee airbag with a front panel that remains substantially flat during inflation. It would be a further advancement in the art to provide a folded rigid knee airbag wherein the cross-sectional area of the airbag in its inflated configuration is substantially equal to the cross-sectional area of the airbag in its compact configuration. The present invention provides these advancements in a novel and useful way.
SUMMARY OF THE INVENTION
The apparatus of the present invention has been developed in response to the present state of the art（現行の技術）, and in particular, in response to the problems and needs in the art that have not yet been fully solved by currently available folded rigid knee airbags. Thus, it is an overall objective（全体的な課題、目的）of the present invention to provide a folded rigid knee airbag having a front panel that remains substantially flat during inflation, and also having a cross-sectional area that does not change substantially during inflation.
To achieve the foregoing objective, and in accordance with the invention as embodied and broadly described herein, a folded rigid knee airbag is provided. The folded rigid knee airbag may be positioned in any number of locations within a vehicle. For example, a primary airbag may be contained（収める、収納）within a steering wheel. The folded rigid knee airbag may then be mounted beneath the primary airbag in a lower portion of an instrument panel within the vehicle. In an alternative embodiment, the airbag may be positioned underneath a front seat.
The airbag includes a back panel and a front panel. Both the front panel and the back panel may be made from a rigid material, such as sheet metal. The front panel may be attached to a decorative（装飾）trim panel which serves as（として機能する、働く、役割を果たす）a bolster（ボルスタ、まくらばり）for contacting the lower body portion of the occupant during a collision involving the vehicle, and which also allows the airbag to be integrated into the interior of the vehicle.
The front panel may be attached to the back panel in any number of ways（任意の方法で、限定されない、自由に）. For example, the peripheral region of the front panel may be folded around the peripheral region of the back panel. A plurality of spot welds may then be used to attach the front panel to the back panel. Alternatively, the area of the front panel may be substantially equal to the area of the back panel, and the peripheral regions of the front panel and the back panel may be welded together in a continuous fashion.
The airbag is in communication with an inflator through an inflator interface. The inflator may be of any suitable type or construction for supplying a medium for inflating the airbag. In one embodiment, the inflator interface may take the form of a rectangular orifice that is configured to receive an adapter unit. The adapter unit may include a hollow rigid box with an orifice in one side, so that the inflator may be inserted directly in the orifice. In another embodiment, the inflator interface may be configured so that the inflator may be inserted directly into the back panel.
The back panel is configured such that the front panel remains substantially flat during discharge of the inflator. In one embodiment, first and second accordion folds extend from the left side edge to the right side edge of the back panel in a horizontal direction. First and second vertical folds protrude out of the front side of the back panel in a vertical direction. The first accordion fold intersects the first vertical fold near the upper edge and the left side edge of the back panel, the first accordion fold intersects the second vertical fold near the upper edge and the right side edge of the back panel, the second accordion fold intersects the first vertical fold near the lower edge and the left side edge of the back panel, and the second accordion fold intersects the second vertical fold near the lower edge and the right side edge of the back panel. During discharge of the inflator, the accordion folds and the vertical folds unfold to form four substantially planar walls.
In one embodiment, the front panel is disposed substantially parallel to the back panel after inflation. Such an airbag may be used in a vehicle where the lower portion of the instrument panel is substantially parallel to the lower body of the vehicle occupant. In some vehicles, however, the lower portion of the instrument panel is disposed at an angle relative to the lower body of the vehicle occupant. Thus, in an alternative embodiment, the front panel may be disposed at an angle relative to the back panel after inflation.
In such an airbag, the second accordion fold may be substantially larger than the first accordion fold. In addition, the height of the first and second vertical folds may increase moving in a direction from the upper edge to the lower edge of the back panel. During discharge of the inflator, the airbag unfolds so that the substantially planar wall formed by the second accordion fold is taller than the substantially planar wall formed by the first accordion fold, thereby enabling the front panel to be disposed at an angle relative to the back panel after inflation.
These and other features and advantages of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of the invention as set forth hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
In order that the manner in which the above-recited and other advantages of the invention are obtained will be readily understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Understanding that these drawings depict only typical embodiments of the invention and are not therefore to be considered to be limiting of its scope, the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The presently preferred embodiments of the present invention will be best understood by reference to the drawings, wherein like parts are designated by like numerals throughout. It will be readily understood that the components of the present invention, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations. Thus, the following more detailed description of the embodiments of the present invention, as represented in FIGS. 1 through 9, is not intended to limit the scope of the invention, as claimed, but is merely representative of presently preferred embodiments of the invention.
FIG. 1 is a side cutaway view of an interior portion of a vehicle 110 having a folded rigid knee airbag 112 installed. A vehicle occupant 114 having an upper body portion 116 and a lower body portion 118 is shown seated in a front seat 120. The front seat 120 is located in front of a steering wheel 122, an instrument panel 124, and a windshield 126. A primary airbag 128 is contained within the steering wheel 122. The folded rigid knee airbag 112 is mounted in a lower portion of the instrument panel 124 within the vehicle 110.
The location of the folded rigid knee airbag 112 in FIG. 1 is exemplary only. The folded rigid knee airbag 112 may be positioned in any number of locations. For example, in one alternative embodiment, the airbag 112 may be positioned underneath the front seat 120.
The folded rigid knee airbag 112 includes a back panel 130 and a front panel 132 which is attached to a decorative trim panel 134. The decorative trim panel 134 serves as a bolster for contacting the lower body portion 118 of the occupant 114 during a collision involving the vehicle 110. The trim panel 134 also allows the airbag 112 to be integrated into the interior of the vehicle 110.
In the embodiment shown in FIG. 1, the airbag 112 is in communication with an inflator 136 through an adapter unit 138. In an alternative embodiment, the inflator 136 may be in direct communication with the airbag 112. The vehicle 110 also includes a sensor mechanism 140, which is configured to sense an impact to the vehicle 110. A pair of lead wires 142a-b are attached to the sensor mechanism 140. The lead wires 142a-b provide electrical communication between the sensor mechanism 140 and the inflator 136. The airbag 112 is attached to the instrument panel 124 by a pair of connector studs 144a-b held in place by a pair of nuts 146a-b.
Upon receipt of an electrical signal transmitted from the sensor mechanism 140, the primary airbag 128 and the folded rigid knee airbag 112 inflate into their respective inflated positions 148 and 150. In its inflated position 148, the primary airbag 128 prevents the upper body portion 116 of the occupant 114 from being propelled forward toward the windshield 126. When this occurs, there is a tendency for the lower body portion 118 of the occupant 114 to be propelled forward and under the primary airbag 128. This tendency is referred to as submarining, and may be quite pronounced when the occupant 114 is not properly restrained by a seat belt. In its inflated position 150, the folded rigid knee airbag 112 prevents submarining, i.e., prevents the lower body portion 118 of the vehicle occupant 114 from sliding forward.
FIG. 2 is an exploded perspective view of the folded rigid knee airbag 112. As stated previously, the folded rigid knee airbag 112 includes a back panel 130, a front panel 132, an inflator 136, an inflator interface 232, and an adapter unit 138. The folded rigid knee airbag 112 also has a vertical direction 210 and a horizontal direction 212.
The back panel 130 has an upper edge 214, a lower edge 216, a left side edge 218, and a right side edge 220. The back panel 130 also has a front side 222 and a back side 224 opposite the front side 222.
Four recesses 226a, 226b, 226c and 226d are positioned around the perimeter of the back panel 130. In particular, a first recess 226a is positioned on the upper edge 214 toward the left side edge 218. A second recess 226b is positioned on the upper edge 214 toward the right side edge 220. A third recess 226c is positioned on the lower edge 216 toward the left side edge 218. A fourth recess 226d is positioned on the lower edge 216 toward the right side edge 220.
First and second accordion folds 228a, 228b extend from the left side edge 218 to the right side edge 220 in a horizontal direction 212. A first vertical fold 230a protrudes out of the front side 222 in a vertical direction 210 and extends from the first recess 226a to the third recess 226c. Similarly, a second vertical fold 230b protrudes out of the front side 222 in a vertical direction 210 and extends from the second recess 226b to the fourth recess 226d. The configuration of the accordion folds 228a, 228b and the vertical folds 230a, 230b will be explained in greater detail below in connection with FIG. 5.
The first vertical fold 230a intersects the first accordion fold 228a near the upper edge 214 and the left side edge 218. The first vertical fold 230a intersects the second accordion fold 228b near the lower edge 216 and the left side edge 218. The second vertical fold 230b intersects the first accordion fold 228a near the upper edge 214 and the right side edge 220. The second vertical fold 230b intersects the second accordion fold 228b near the lower edge 216 and the right side edge 220.
The back panel 130 includes an inflator interface 232. In the embodiment shown in FIG. 2, the inflator interface 232 takes the form of a rectangular orifice 232 that is centrally located with respect to the back panel 130 because it is positioned approximately halfway between the upper edge 214 and the lower edge 216, and approximately halfway between the left side edge 218 and the right side edge 220. The rectangular orifice 232 is sufficiently large to receive an adapter unit 138, as will be described in greater detail below. Four small orifices 234a, 234b, 234c and 234d are arranged in a horizontal direction 212 above the rectangular orifice 232 toward the upper edge 214. Similarly, four small orifices 234e, 234f, 234g and 234h are arranged in a horizontal direction 212 beneath the rectangular orifice 232 toward the lower edge 216. The small orifices 234a, 234b, 234c, 234d, 234e, 234f, 234g, and 234h are sufficiently large to receive a connector stud as will be described in greater detail below.
The front panel 132 has a front side 236 and a back side 238 opposite the front side 236. The front panel 132 has an upper peripheral region 240, a lower peripheral region 242, a left peripheral region 244, and a right peripheral region 246. The area of the front panel 132 is greater than the area of the back panel 130 to allow the peripheral regions 240, 242, 244 and 246 to be folded around the edges 214, 216, 218, and 220 of the back panel 130.
Both the back panel 130 and the front panel 132 are preferably made from a rigid material. For example, the back panel 130 and the front panel 132 may be made from sheet metal.
The inflator 136 may be of any suitable type or construction for supplying a medium for inflating the folded rigid knee airbag 112. For example, the inflator 136 may be a pyrotechnic inflator that uses the combustion of gas-generating material to generate an inflation fluid that inflates the folded rigid knee airbag 112. The inflator 136 includes a diffuser portion 247 for disseminating the inflation fluid. The inflator 136 also includes lead wires 142a-b which enable the inflator 136 to be in electrical communication with the sensor mechanism 140.
The back panel 130 includes an inflator interface 232 that is configured to receive the inflator 136. As shown in FIG. 2, the inflator interface 232 may take the form of a rectangular orifice 232 which is configured to receive an adapter unit 138. The adapter unit 138 includes a hollow rigid box 248 with an orifice 250 in one side. The inflator 136 may be inserted in the orifice 250. Of course, numerous other configurations for the inflator interface 232 will be readily apparent to one skilled in the art in light of the teachings contained herein. For example, the inflator interface 232 may be configured so that the inflator 136 may be directly inserted in the back panel 130.
When the inflator 136 discharges, it is desirable to prevent inflation fluid from escaping out of the orifice 250. This may be accomplished in a variety of ways. For example, a plastic sealing wedge 252 may be placed around the inflator 136. When the inflator 136 is inserted into the orifice 250, the sealing wedge 252 then creates a tight seal between the inflator 136 and the adapter unit 138. Alternatively, the diameter of the orifice 250 may simply be closely matched to the diameter of the inflator 136.
When the inflator 136 discharges, it is also desirable for the inflator 136 to be secured to the adapter unit 138 so that the force of the discharge does not cause the inflator 136 to be propelled out of the orifice 250 away from the adapter unit 138. This, too, may be accomplished in a variety of ways. For example, the inflator 136 may include a connector stud 254 attached to the diffuser portion 247 of the inflator 136. The adapter unit 138 may include a small orifice (not shown) opposite the orifice 250, the small orifice having a diameter which is slightly larger than the connector stud 254. The inflator 136 may be inserted through the orifice 250 so that the connector stud 254 extends through the small orifice. A nut (not shown) may then be used to secure the inflator 136 to the adapter unit 138. Of course, numerous other methods for attaching the inflator 136 to the adapter unit 138 will be readily apparent to one skilled in the art in light of the teachings contained herein.
The adapter unit 138 includes a plate 256. The hollow rigid box 248 may be an integral part of the plate 256, or it may be welded to the plate 256. Four connector studs 258a, 258b, 258c and 258d are arranged in a horizontal direction 212 along the distal edge of the plate 256, and four connector studs 258e, 258f, 258g and 258h are arranged in a horizontal direction 212 along the proximal edge of the plate 256. The portion of the plate 256 over which the hollow rigid box 248 sits includes an orifice (not shown), so that inflation fluid from the inflator 136 may be directed into the airbag 112.
FIG. 3 is a top perspective view of the folded rigid knee airbag 112 in its compact configuration. The upper peripheral region 240 of the front panel 132 is folded around the upper edge 214 of the back panel 130, the lower peripheral region 242 of the front panel 132 is folded around the lower edge 216 of the back panel 130, the left peripheral region 244 of the front panel 132 is folded around the left side edge 218 of the back panel 130, and the right peripheral region 246 of the front panel 132 is folded around the right side edge 220 of the back panel 130. A plurality of spot welds 310 are disposed around each of the peripheral regions 240, 242, 244 and 246 to attach the front panel 132 to the back panel 130. In an alternative embodiment, the area of the front panel 132 may be substantially equal to the area of the back panel 130, and the peripheral regions of the front panel 132 and the back panel 130 may be welded together in a continuous fashion.
The hollow rigid box 248 extends through the rectangular orifice 232. The connector studs 258a, 258b, 258c, 258d, 258e, 258f, 258g and 258h extend through the small orifices 234a, 234b, 234c, 234d, 234e, 234f, 234g and 234h. A plurality of nuts (not shown) may be used to secure the connector studs 258a, 258b, 258c, 258d, 258e, 258f, 258g and 258h to the back panel 130. The inflator 136 is inserted into the orifice 250 in the hollow rigid box 248 so that the connector stud 254 extends through the small orifice (not shown) in the hollow rigid box 248. A nut (not shown) may be used to secure the connector stud 254 to the hollow rigid box 248. The plastic sealing wedge 252 creates a tight seal between the inflator 136 and the adapter unit 138.
FIG. 4 is a top perspective view of the folded rigid knee airbag 112 in its inflated position 150. The first at accordion fold 228a has unfolded to form a first substantially planar wall 410 having a first upper edge 412, and the second accordion fold 228b has unfolded to form a second substantially planar wall 414 opposite the first substantially planar wall 410 and having a second upper edge 416. Similarly, the first vertical fold 230a has unfolded to form a third substantially planar wall 418 having a third upper edge 420, and the second vertical fold 230b has unfolded to form a fourth substantially planar wall 422 opposite the third substantially planar wall 418 and having a fourth upper edge 424. The area of the back panel 130 enclosed by the upper edges 412, 416, 420, and 424 is substantially parallel to the front panel 132, and is substantially flat. The inflator 136 remains substantially stationary with respect to this substantially flat portion of the back panel 130.
Advantageously, the accordion folds 228a, 228b and the vertical folds 230a, 230b allow the front panel 132 to remain substantially flat during inflation. This permits the airbag 112 to inflate evenly, thereby reducing the likelihood that the trim panel 134 will interact with the vehicle occupant 114 at an angle during an accident. In addition, the cross-sectional area of the airbag 112 in its inflated configuration is about the same as the cross-sectional area of the airbag 112 in its compact configuration. This allows the airbag 112 to be more easily integrated into the interior of the vehicle 110.
The front panel 132 may be made to be thicker than the back panel 130. For example, in one embodiment the front panel 132 is made from sheet metal that is about 0.020 inches thick, while the back panel 130 is made from sheet metal that is about 0.014 inches thick. This difference in thickness further enhances the ability of the front panel 132 to remain substantially flat during inflation.
FIG. 5 is a top plan view of the back panel 130 in its pre-folded state. One example of how the accordion folds 228a, 228b and the vertical folds 230a, 230b may be created will now be explained.
To create the first accordion fold 228a, the upper edge 214 is first bent at a 180.degree. angle toward the back side 224 along the fold line 510. The upper edge 214 is then bent at a 180.degree. angle toward the front side 222 along the fold line 512.
To create the second accordion fold 228b, the lower edge 216 is first bent at a 180.degree. angle toward the back side 224 along the fold line 514. The lower edge 216 is then bent at a 180.degree. angle toward the front side 222 along the fold line 516.
To create the first vertical fold 230a, the left side edge 218 is first bent at a 90.degree. angle toward the front side 222 along the fold line 518. The left side edge 218 is then bent at a 180.degree. angle toward the back side 224 along the fold line 520. Finally, the left side edge 218 is bent at a 90.degree. angle toward the front side 222 along the fold line 522.
To create the second vertical fold 230b, the right side edge 220 is first bent at a 90.degree. angle toward the front side 222 along the fold line 524. The right side edge 220 is then bent at a 180.degree. angle toward the back side 224 along the fold line 526. Finally, the right side edge 220 is bent at a 90.degree. angle toward the front side 222 along the fold line 528.
Of course, numerous other methods for creating the accordion folds 228a, 228b and the vertical folds 230a, 230b will be readily apparent to one skilled in the art in light of the teachings contained herein.
「第2データは、第１データの一部をランダムデータに置き換えたデータである」
1) The second data are data partially replacing the first data with random data.
2) The second data are data that partially replace the first data with random data.
3) The second data are data that have partially replaced the first data with random data.
4) The second data are data obtained by partially replacing the first data with random data.
どれがいいんでしょう？
1) two pieces of data, i.e.,(that is, namely) A and B
2) two pieces of data including A and B
3) two pieces of data, specifically A and B
4) two pieces of data of A and B
4)でいいのか？
"BACKGROUND OF THE INVENTION
The manufacturing（製造）of electronic and optoelectronic integrated circuits (ICs) involves complex lithographic processes to form microscopic solid-state devices and circuits in semiconductor wafers. These lithographic processes typically include forming layers of material on the wafer, patterning the layers, doping the substrate and/or the patterned layers, and heat-treating（熱処理）(e.g., annealing) the resulting（得られた）structures. These processes are repeated to build up the IC structure. The result is a wafer containing a large number of ICs.
A "wafer sort" is then performed, wherein（追加説明）each IC chip on the wafer is electrically tested for functionality. The wafer is then separated ("diced") into the individual IC chips, which are then "packaged" individually or in groups for incorporation onto a "panel," e.g., a printed circuit board (PCB) or motherboard.
The packaged dies (or "dies" for short（略して）) must be placed in specific locations（特定の場所に）on the panel to within a given accuracy（特定の精度以内で）so that interconnections between the dies can be successfully established. To this end（このため、目的）, the panel includes alignment marks or "fiducials" to assist in achieving the desired placement accuracy. The dies are placed on the panel by a die placement machine, sometimes referred to as a "chip shooter." The machine includes an optical vision system that locates and recognizes the fiducials as well as an alignment mark on the die. Information from the optical vision system relating to（関する）the position of the die relative the fiducials allows the die to be placed on the panel at a specific location.
This die placement process provides a die placement accuracy no better than（以下、でしかない）about 25 microns (3 sigma). The main factor limiting the accuracy of the die placement process is the error in the placement of fiducials on the panel. To date（これまで、現在）, a placement accuracy of 25 microns (3 sigma) has been satisfactory for most die placement applications. However, for certain new packaging applications, a die placement with much greater accuracy (e.g., 2 microns, 3 sigma) is required. For example, in bump lithography, once the dies are mounted to the panel, further lithography steps are carried out. In particular, a print solder resist layer is deposited, and then plate metal (e.g., copper) traces are formed to establish the electrical connections between the dies. Without highly accurate die placement on the panel, the subsequent lithography steps cannot be successfully performed.
Accordingly, what is needed is（必要）a die placement apparatus and method that provides（単数扱い）for greater die placement accuracy." (US6954272)
