実装基板

EP3092207(特表2017-510540)
"38. The article of any of claims 35-37, wherein the article is chosen from any one or a combination of the following: encapsulants for LEDs, blends into the phosphor layer, blends into the remote phosphor, and blends into the encapsulant layer in LEDs, thermal interface materials (TIMS), solid-state device packaging materials, photon- conversion layers, phosphorescent materials, transparent materials, diffuse/scattering materials, reflective and whitening agents (reflection of all color), LED packaging substrates（ＬＥＤ実装基板）with similar CTE as silicone encapsulants enabling minimizing delamination failures, polymer housings for luminaires, heat sinks, thermofluids, structural materials, gas/vapor/moisture barrier materials, thermoelectric materials, electronics, computers, mobile devices, medical equipment, automotive, industrial, lighting, off-shore, lasers, and aerospace."

EP2739900(特表2014-522086)
"19. An LED based illumination device, comprising:
a color conversion cavity comprising a first surface area including a first wavelength converting material and a second surface area including a second wavelength converting material;
a first LED mounted to（実装）a mounting board（実装基板）, the first LED configured to receive a first current, wherein light emitted from the first LED enters the color conversion cavity and preferentially illuminates the first surface area; and
a second LED mounted to the mounting board at an oblique angle with respect to the first LED, the second LED configured to receive a second current, wherein light emitted from the second LED enters the color conversion cavity and preferentially illuminates the second surface area, and wherein the first current and the second current are selectable to achieve a range of correlated color temperature (CCT) of light output by the LED based illumination device."

US8373259(特表2013-532850)
"1. An apparatus comprising: a package substrate（実装基板）to provide a packaging mount for a photonic transceiver; a semiconductor die including photonic transceiver circuitry, the semiconductor die to be flip-chip bonded to the package substrate, the semiconductor die to overhang（張り出す）the package substrate on an edge of the semiconductor die to be active in an optical mode of the photonic transceiver, the semiconductor die having a groove processed in semiconductor bulk of the semiconductor die to face the package substrate when the semiconductor die is bonded to the package substrate; an alignment pin to contact the semiconductor die at the groove and extend beyond the semiconductor die away from the package substrate to provide passive alignment of the optical mode of the photonic transceiver to an optical lens; and a support to hold the alignment pin to the semiconductor die at the groove."

US8163830(特表2009-524734)
(Ab)
"A composition includes a bismaleimide triazine (BT) compound with a nanoclay composited therewith. A mounting substrate（実装基板）includes polymer compound with a nanoclay composited therewith to form a core for the mounting substrate. A process includes melt blending a polymer such as BT with a nanoclay and forming a core. A process includes dissolving a monomer such as BT with a nanoclay and forming a core. A system includes a nanoclay dispersed in a polymer matrix and a microelectronic device mounted on the mounting substrate that includes the nanoclay dispersed in the polymer matrix."