多数個取り

WO2007013024(特表2009-506520)
"The mounted device die, lead frame, and laminate are encapsulated. Often in the afore-mentioned process, multiple devices（多数個取りの素子）may be arranged on a lead frame array that has been coated with laminate material and having had air-cavity regions defined. These multiple devices are mounted, encapsulated（封入）, and separated into individual packaged product."

WO2013158527(特表2015-516686)
"It will be appreciated that in alternative embodiments, any other suitable patterning process may be used to pattern the imaging layer 22 and form raised features 22', including multiple patterning processes（多数個取り処理）, as well as immersion lithography. As mentioned above, it will also be appreciated that a positive-tone resist or photosensitive material could also be used, instead of the negative-tone imaging layer 22 described herein. In that case（その場合）, the unexposed portions of the imaging layer 22 remain insoluble, while the exposed portions are rendered soluble and are removed with developer（現像液）."

WO2005068148(特表2007-521985)
"The positive pattern of the first transfer mold 10 so produced is transferred (i. e. in reverse image) to produce the mold (second transfer mold) 20 for the fine structure, having the negative pattern. Incidentally, it is advantageous to produce the transfer mold 20 as a flexible mold as will be hereinafter explained. In the practice of the invention, a large number of second transfer molds 20 can be acquired（多数個取りすることができる）with high accuracy from a single first transfer mold 10."

WO2005001518(特表2006-527677)
"Optical memory disks, such as CD (compact disks), CD-R, CD-RW ; DVD (digital versatile disks), DVD-R, DVD-ROM, DVD-RAM, DVD+RW, DVD-RW, PD (phase change disks) and MO (magneto optical), etc. , are typically manufactured by initially forming a substrate and then depositing one or more thin film layers upon the substrate. Substrates for optical memory are usually formed with a series of grooves and/or pits arranged as concentric tracks or as a continuous spiral. The grooves and pits may be used for things such as laser beam tracking, address information, timing, error correction, user data, etc. Substrates used for optical disks are typically formed by injection molding, where a molten polymeric material is injected into a disk shaped mold with one surface having the patterned microstructure（微細構造）to be replicated（複製用の）. The patterned microstructure is typically provided by an exchangeable insert（交換可能な挿入物）, commonly referred to as a stamper. The injection molding process is comprised of a series of precisely timed steps, which include closing the mold, injecting the molten polymer, providing a controlled reduction in peak injection pressure, cooling, center- hole formation, opening the mold and removing the replicated disk and associated sprue.

Following the molding process, disk substrates are typically coated with one or more thin film layers. Thereafter, substrates may be coated with various insulating and/or protective layers, bonding adhesive, decorative artwork, labels, etc.

Although injection-molding methods, such as those described above, can provide high quality optical memory disks with acceptable（許容できる）levels of birefringence and flatness, the rate of disk production is only in the neighborhood of（近く、程度）several seconds, as low as two seconds.

About 60% of this time is attributable to the molding step, and the rest is taken up by the need to open the mold, remove the disk and sprue, and then close the mold before the next cycle can begin. Furthermore, present attempts to improve production rate by using various novel de-molding（型抜き）techniques or by using multi-cavity molds（多数個取り鋳型）have had only limited success."

WO2012060121(再表2012/060121；JP）
"MULTI-PART WIRED SUBSTRATE（多数個取り配線基板）, WIRED SUBSTRATE, AND ELECTRONIC DEVICE"

US9049793（再表2012/046640；JP）
"A multi-piece-array（多数個取り配線基板）"

US20150373846(再表2015/016289；JP)
"[0080] Also, the wiring board 1 may be manufactured in the form of a multipiece wiring board（多数個取り配線基板）."