再配線

ＲＦ信号経路は、ＲＦ端子と、ＲＦ外部端子と、ＲＦ再配線を含む。

ChatGPT:

Here are some possible translations:

1. "The RF signal path includes an RF terminal, an RF external terminal, and RF rewiring."
2. "The RF signal path comprises an RF terminal, an RF external terminal, and RF wiring redistribution."
3. "The RF signal path consists of an RF terminal, an RF external terminal, and RF rerouting."

• "Rewiring" is a direct translation of 再配線, but in technical contexts, "wiring redistribution" (especially in IC design) or "rerouting" (for circuit modifications) might be more precise.
• "Comprises" suggests that these are the essential components, while "includes" allows for additional elements.
• "Consists of" strictly limits the components to only those listed.

Would you like a more general or precise wording?

あなた:

ＲＦ再配線は、平面視においてＲＦ端子と重なる端部を有する。

ChatGPT:

Here are some possible translations:

1. "The RF rewiring has an end portion that overlaps the RF terminal in a plan view."
2. "The RF rewiring includes an end portion that overlaps the RF terminal when viewed in plan."
3. "The RF rewiring has an end that is aligned with the RF terminal in a top view."
4. "The RF rewiring features an end portion positioned to overlap the RF terminal in a planar view."

• "Plan view" and "top view" are both commonly used in technical contexts, but "plan view" is more precise for engineering and circuit design.
• "Overlaps" is a natural way to describe 重なる in English.
• "End portion" (端部) is used to clarify that it refers to a part of the rewiring rather than the entire structure.

Would you like a more literal or technical phrasing?

あなた:

How about "redistribution wire" for 再配線?

ChatGPT:

Yes, "redistribution wire" is a reasonable translation for 再配線, but the more commonly used term in semiconductor and PCB design is "redistribution layer (RDL)" when referring to the entire layer of rewiring.

For RF再配線, a few suitable translations include:

1. "RF redistribution wire" (if referring to a single conductive trace)
2. "RF redistribution wiring" (if referring to multiple traces)
3. "RF redistribution layer (RF RDL)" (if referring to an entire rewiring layer)

Would you like the translation to be as precise as possible for a semiconductor-related context, or do you prefer a more general engineering translation?