方向：冠詞

US10478861(HYDRO ALUMINIUM ROLLED PROD [DE]; AUSTIN AI INC [US])
[0014] The chute may be implemented as a guiding slide that defines a length direction between the upper portion and the lower edge and a width direction（＊定義している）perpendicular thereto and comprises at least one channel along which the at least one piece of material is slidable from the upper portion to the lower edge, wherein the channel in a section along the length direction comprises a convex portion in the upper portion followed by a straight portion between the convex portion and the lower edge, and wherein the channel in a section along the width direction in the upper portion has a profile shape with a trough and two side walls having a first height, and wherein the channel in a section along the width direction between the upper portion and the lower edge has a profile shape with a trough and two side walls having a second height, wherein the first height is larger than the second height. The channel in a section along the width direction through the lower edge of the chute may have a straight shape that is at least substantially horizontal.

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[0056] As is schematically shown in FIG. 2, the system 1 according to the invention may be configured to analyze and sort more than one piece of material 2 simultaneously. For example, the system 1 may comprise more than one laser device 30 and more than one spectrometer device 40 . The laser devices 30 and spectrometers 40 may be arranged pairwise (one laser device 30 and one corresponding spectrometer 40 ) in a direction perpendicular to a transportation direction of the feeder means 10 , i.e. in a width direction.

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[0059] The laser device 30 and the spectrometer 40 may be provided in a common housing. This allows several sets/pairs of laser device 30 and spectrometer 40 to be efficiently provided in a respective common housing along the width direction of the chute 20 . Optionally, the controller 60 may also be provided in the common housing. When the system 1 comprises several common housings each comprising a laser device 30 and a spectrometer 40 , the controller 60 may be provided in one of these common housings, e.g. a common housing that is provided on an outermost position in the width direction.

US11564843(SMITH & NEPHEW INC [US])
1. A stabilizing structure for insertion into a wound, comprising:

a collapsible stabilizing structure comprised at least partially of foam and having a plurality of cells in a plane, each cell having at least one wall wherein the stabilizing structure has a length and a width wherein at least three cells extend in a width direction（＊クレームだから；詳細な説明には"width direction"は不在）and at least one planar support structure within the stabilizing structure extends in a direction perpendicular to the plane and is parallel to an axis along the length of the stabilizing structure, each cell having a top end and a bottom end with an opening extending through the top and bottom ends in a direction perpendicular to the plane;

wherein the stabilizing structure has an outer wall for contacting tissue of the wound and is configured to collapse significantly more within the plane than along the direction perpendicular to the plane upon application of negative pressure to the wound; and

wherein the cells are configured to collapse more in the plane along the width direction than along the length of the stabilizing structure such that opposing edges of the wound collapse towards closure of the wound.

US10988323(BERKSHIRE GREY INC [US])
1. A maintenance system for assisting in maintaining an automated carrier system for moving objects to be processed, said maintenance system comprising:

an array of disconnected track sections mounted on a floor, each track section being rectangular in shape;

a plurality of automated carriers, each said automated carrier comprising a carrier body and a plurality of wheels mounted to the carrier body for moving the automated carrier along the array of disconnected track sections; and

an automated maintenance carrier comprising a substantially planar maintenance body and a plurality of wheels mounted to the substantially planar maintenance body for moving the automated maintenance carrier along the array of disconnected track sections, wherein the substantially planar maintenance body is larger in at least one of a length direction and a width direction（＊クレームだから；詳細な説明には"width direction"は不在）than any of the rectangular track sections,

wherein the automated maintenance carrier further comprises an articulated robotic arm mounted on the substantially planar maintenance body, wherein the articulated robotic arm has an extendable end effector that extends to grasp a disabled automated carrier on the array and retracts to tow the disabled automated carrier onto the substantially planar maintenance body of the automated maintenance carrier.

US11111649(BAMFORD EXCAVATORS LTD [GB])
[0060] In one embodiment, the working arm is mounted to the superstructure at a position that is at one end of the superstructure in a length direction and substantially central to the superstructure in a width direction（＊クレームには不在）.

US9561629(3M INNOVATIVE PROPERTIES CO [US])
15. The method of claim 1, wherein the stretched film comprises at least one material with indices of refraction in a length direction corresponding to the machine direction and a thickness direction that are substantially the same but substantially different from an index of refraction in a width direction（＊クレームだから；詳細な説明には"width direction"は不在）.

US9758315(LOCKHEED CORP [US])
[0116] FIG. 2I(B) shows the four lead screw conveyance system as further described with respect to FIG. 2W and FIG. 2X. The four lead screw conveyance system includes a set of at least four lead screws 902 a (two provided at a lower portion of the conveyance path and two provided at an upper portion of the conveyance path). The upper lead screws 902 a are parallel to each other in a width direction（＊唯一ではないから）and parallel to the lower pair in the height direction as both ends extend along the length of the main conveyance path. The lead screws 902 a are designed and structured to support the frames F at upper and lower edge ends thereof. The lead screws 902 a also rotate parallel to each other.

 

樹木の仕立て

US2023288936(KUBOTA KK [JP])
[0160] One or more posts may be provided in an area where multiple rows of trees are placed.
【００９９】
  複数の樹木列が配置されたエリアには１つ以上の支柱が設けられることがある。

For example, in a vineyard, generally, multiple posts are provided near the trees to create a hedge construction.
例えば、ぶどう園においては、一般に、垣根仕立てのための複数の支柱が樹木の近傍に設けられる。

Similarly to the tree trunks, posts are less likely to change their outer shape from season to season, and therefore are suitable as landmarks.
支柱は、樹木の幹部と同様、季節による外形の変化が少ないため、ランドマークとして適している。

Therefore, the localization module 162 may further detect posts in the surrounding environment of the tractor 100 A based on sensor data, and the map data generating module 164 may generate environment map data that indicates not only the distribution of the trunks but also the distribution of the posts.
そこで、自己位置推定モジュール１６２は、センサデータに基づいて、トラクタ１００Ａの周囲の環境における支柱をさらに検出し、地図データ生成モジュール１６４は、幹部の分布に加えて支柱の分布も示す環境地図データを生成してもよい。

 

樹木の仕立て情報

ChatGPT:

A natural and accurate translation of 樹木の仕立て情報 would be:

Training information of the tree(s)
or
Tree training information

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🔍 Explanation:

• 仕立て in the context of 樹木 (trees) typically refers to:

  • Pruning, shaping, or training of the tree's structure.

  • Especially common in orchards, bonsai, vineyards, or horticulture, where tree form is guided intentionally.

• 仕立て情報 therefore refers to information about how the tree has been trained or shaped, such as:

  • Branch angles

  • Trellis attachment

  • Pruning methods

  • Growth direction, etc.

---

✅ Recommended translations:

Japanese	English	Notes
樹木の仕立て情報	Tree training information	Most natural and compact
樹木の仕立て情報	Training information of the tree	More formal/literal
樹木の仕立て情報	Tree shaping information	Acceptable if the focus is on form
樹木の仕立て情報	Tree pruning/training data	If used in a data-driven or system context

---

Would you like the phrase incorporated into a longer technical sentence or system description?

制御を提供

本発明は、室外機の運転を継続しつつ、室外機の運転中に冷媒の温度を切り替える制御を提供する。

ChatGPT:

以下のように、技術文書・特許文書に適した自然な英訳が可能です：

---

✅ "The present invention provides control for switching the temperature of the refrigerant during operation of the outdoor unit, while maintaining operation of the outdoor unit."

---

🔍 解説：

• "The present invention provides control for..."：特許で一般的な定型表現。

• "switching the temperature of the refrigerant"：冷媒の温度を切り替える

• "during operation of the outdoor unit"：室外機の運転中に

• "while maintaining operation of the outdoor unit"：室外機の運転を継続しつつ
  　– 「安定」とは書かれていないので、"maintaining" で十分です。

---

別案（より口語寄りまたは説明的）：

• "The present invention provides a control method that allows the refrigerant temperature to be switched during operation of the outdoor unit, without stopping the unit."

あなた:

Why not "a control" or "the control"?

ChatGPT:

Great question!

In your sentence:

"The present invention provides control for switching the temperature of the refrigerant..."

you’re asking:
Why not say "a control" or "the control"?

---

✅ Here's the answer:

1. "Control" (uncountable noun)

In technical and patent writing, "control" is often treated as an uncountable noun when referring to the general concept or function of controlling something.

✅ "provides control for switching..."
means
➤ "provides a means or method of controlling..."

This phrasing:

• Sounds more abstract and general-purpose (which is preferred in patents).

• Emphasizes the function or capability, not a specific device or module.

---

2. "A control" (countable noun)

This would imply a specific control unit or mechanism, e.g., a dial, button, or subsystem.

⚠️ "a control for switching the temperature..."
sounds like a physical control component, which may not be what’s meant in your sentence.

---

3. "The control"

This implies that a specific control system has already been introduced or is known in the context.

⚠️ "the control for switching..."
would suggest:

• The reader already knows which control you’re talking about.

• Or that you’re referring to a particular control already disclosed.

That’s not suitable for a sentence like:

"The present invention provides...",
because at that point, you are introducing the concept for the first time.

---

✅ Summary:

Expression	Usage Context
control (uncountable)	✅ General function/abstract concept — ideal for patents
a control (countable)	⚠️ Specific mechanism or device (e.g., a knob or software module)
the control	⚠️ Refers to something already introduced or known

 

---

✅ Your sentence is correct as-is:

"The present invention provides control for switching the temperature of the refrigerant..."
is standard, idiomatic, and preferred in technical writing.

母材基板

EP3309827(DENSO CORP [JP])
[0023] The semiconductor chips 10 shown in Fig. 4 are six chips 10a through 10f.
【００２３】
  図４に示す半導体チップ１０は、６個のチップ１０ａ～１０ｆによって構成されている。

The respective chips 10a through 10f have front surfaces and back surfaces, on which the semiconductor switching elements 51a through 56a and the rectifier elements 51b through 56b forming the upper arms 51, 53, and 55 and the lower arms 52, 54, and 56 are provided.
各チップ１０ａ～１０ｆは、表面および裏面を有し、それぞれに上アーム５１、５３、５５もしくは下アーム５２、５４、５６を構成する半導体スイッチング素子５１ａ～５６ａや整流素子５１ｂ～５６ｂなどが形成されている。

For example, a base substrate of the semiconductor chip 10 is a Si, SiC, or GaN semiconductor substrate. 
例えば、半導体チップ１０は、Ｓｉ、ＳｉＣ、ＧａＮなどの半導体基板を母材基板として用いて形成されている。

US2005272224(MATSUSHITA ELECTRIC IND CO LTD [JP])
[0005] In general, a method is employed that uses a highly rigid substrate such as a sapphire substrate and a SiC substrate for crystal growth and that epitaxially grows a semiconductor layer on such substrate using the metal organic chemical vapor deposition (DOCVD).
【０００３】
  一般に窒化物半導体の結晶成長にはサファイア基板やSiC基板といった非常に硬い基板が用いられ、その基板上に有機金属気相成長法（Metal Organic Chemical Vapor Deposition: MOCVD法)によりデバイス構造をエピタキシャル成長する方法が用いられている。

Moreover, recent years have seen the development of a GaN substrate that is obtained by forming a thick-film crystal on a base material substrate by the hydride vapor phase epitaxy (HVPE) and then by separating or removing the base material substrate. 
また最近では、厚膜結晶をハイドライド気相成長法（Hydride Vapor Phase Epitaxy: HVPE法）により母材基板上に形成し、母材基板を分離あるいは除去することで得られるGaN基板が開発され、その上へのデバイス構造形成も行われている。

side by side

US11051736(MEDTRONIC XOMED INC [US])
[0106] Referring again to FIGS. 2-4, the cuff portion 160 extends distally directly from the distal portion 158 of elongate body 152 . In one embodiment, the cuff portion 160 includes a first finger 172 and second finger 174 arranged in a side-by-side relationship ( FIGS. 2-5) and extending from a base portion 177 . 

US10293131(FISHER & PAYKEL HEALTHCARE LTD [NZ])
[0072] FIG. 44 is a front view of the endoskeleton and the exoskeleton of the mask assembly of FIG. 37, with the endoskeleton and the exoskeleton positioned side by side for comparison.

US11801544(GED INTEGRATED SOLUTIONS INC [US])
[0023] FIG. 11 is a perspective view of a punching station having side by side stamping units that are actuated by a controller based on the type of material of the strip material passing through the stamping unit;

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[0053] The punching station 104 accepts the stock S from a properly positioned coil at the stock supply station and performs a series of stamping operations on the stock as the stock S passes through the punching station. The punching station 104 comprises a supporting framework 238 ( FIG. 11 ) fixed to the factory floor. A stock driving system 140 moves the stock through the station until the stock is grasped by a downstream drive system 145 ( FIG. 11 ) described in more detail in the Calcei et al. '681 Patent. Stamping units 144 , 146 , 148 , 150 , 152 , 154 spaced along the station 104 in the direction of stock movement perform individual stamping operations on the stock S.

US8106520(MICRON TECHNOLOGY INC [US])
[0025] FIG. 3 shows a partial cross-section of an IC package 300 having devices 310 and 320 and an interposer 330 , according to various embodiments of the invention. IC package 300 may also include a base 390 having conductive elements 399 to transfer information to and from IC package 300 . IC package 300 may use a structure that includes interposer 330 and structure portions 341 , 342 , and 343 to transfer signals between base 390 and or both of devices 310 and 320 . As shown in FIG. 3, base 390 , devices 310 and 320 , and interposer 330 are arranged in a stack in the z-dimension and attached to each other by conductive joints 301 (e.g., solder, copper, or other materials). IC package 300 may include an enclosure 302 and an interior 303 , which may be filled with insulation material such as epoxy-based molding compound. The components of IC package 300 , such as devices 310 and 320 , interposer 330 , and structure portions 341 , 342 , and 343 , may be enclosed inside enclosure 302 .

[0027] Device 310 may include functions and material similar to or identical to device 110 of FIG. 1 or device 210 of and FIG. 2. As shown in FIG. 3, device 310 may include multiple dice such as dice 311 and 312 located side by side with each of other in the x-dimension and on the same stack level in the z-dimension, which is perpendicular to x-dimension. Each of dice 311 and 312 may include conductive contacts 313 and 314 located at opposite surfaces of the die and vias 315 extending through the die and coupled to conductive contacts 313 and 314 . Each of dice 311 and 312 may also include conductive paths 316 going through the die. Conductive paths 316 may include conductive material 317 inside vias 315 . Each of dice 311 and 312 may also include additional conductive paths (not shown in FIG. 3) to transfer signals between base 390 and device 320 . The additional conductive paths may not go through vias that extend through the die. Device 310 may include a memory device where each of dice 311 and 312 may include other components, such as memory cells and related circuitry, which are omitted from FIG. 3 to help focus on the embodiments described herein.

US9814377(WELCH ALLYN INC [US])
[0040] Referring to FIGS. 8(a )-8(c ) , various versions of supported LEDs and LED supporting members are shown in various combinations for enabling a specific (e.g., white) light to be spectrally produced for the described illumination system. For purposes of describing these embodiments, similar parts are labeled with the same reference numerals for the sake of clarity. An LED supporting member 820 defined by a ring-like configuration supports a plurality of LEDs in a spaced circumferential manner about a defined center opening 821 for positioning and aligning same in relation to a light guide, such as those previously discussed in FIGS. 5(a )-7(d ) . The LEDs are attached either using adhesives or other suitable means in regard to a facing surface 823 of the supporting member 820 onto a single or independently mounted circuit boards. In a first version shown in FIG. 8(a ) , a plurality of LEDs are disposed in a spaced circumferential configuration provided on the facing surface 823 of the supporting member 820 .

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[0041] Referring to FIG. 8(b ) , there is provided an alternative configuration of plural LEDs as positioned at each of the spaced circumferential positions 824 of the supporting ring 820 . More specifically and according to this version, a pair of amber LEDs 830 are disposed at the first circumferential position 824 and positioned in side by side relation. A second pair of green LEDs 834 are disposed at the second circumferential position 824 , also in side by side relation with a third pair of blue LEDs 838 being disposed, according to this example, at the third circumferential position 824 . As in the preceding version, this pattern of side by side LEDs is repeated over the remaining five (5) circumferential positions 824 , as depicted. It should be noted that though two LEDs are shown herein in side by side relation at each ring position, it will be readily understood that the number of LEDs provided at each circumferential position of the supporting element can easily be varied, for example, depending on the application required.

US8322079(YKK CORP AMERICA [US])
[0037] As shown in FIG. 1, the single-hung window 1 comprises a so-called “dual-type” single-hung window, which is installed in an opening in the exterior wall of a building, such as a house, for separating an interior space and an exterior space of the building. The dual-type single-hung window 1 has two window frames 10 disposed side by side or in horizontal juxtaposition with an upper sash 20 and a lower sash 30 supported within each of the window frames 10 . The window frames 10 each include a head member 11 , a sill member 12 and a pair of side or jamb members 13 , 13 connected together into a rectangular shape. The upper and lower sashes 20 and 30 each have a sash frame including a top rail 21 , 31 , a bottom rail 22 , 32 , and a pair of side rails or stiles 23 , 33 connected together into a rectangular shape, and a panel of glazing (double-glazing) 24 , 34 held within the sash frame.

US8029014(GRACO CHILDRENS PROD INC [US])
[0033] Turning now to the drawings, an exemplary stroller is generally depicted at 100 in FIGS. 1-4 and is constructed in accordance with the teachings of the present disclosure. In this example, the stroller 100 generally has a frame assembly 102 , a seat assembly 104 ( FIG. 1) supported by the frame assembly 102 , and a plurality of wheels supporting the frame assembly 102 on a ground surface. The frame assembly 102 in the disclosed example includes a pair of rear wheels 106 and a pair of front wheel assemblies indicated generally at 108 . In this example, each front wheel assembly 108 has two wheels 109 spaced apart side by side. The configuration and construction of the front wheel assemblies 108 and the rear wheels 106 can vary considerably and yet fall within the spirit and scope of the present invention.

US5491302(TESSERA INC [US])
One aspect of the present invention provides a method of connecting a part of a semiconductor chip or other microelectronic assembly having a plurality of contacts disposed in a row to a connection component including a plurality of leads having connection sections disposed side by side in said row. The method comprises the steps of juxtaposing the connection component with the part of the semiconductor chip assembly and connecting the connection section to the corresponding contacts. In the step of juxtaposing the row of connection sections is disposed above the row of contacts in alignment therewith, so that each connection section is offset from a corresponding contact in a first direction along said rows. In the connecting step, the connection sections and the corresponding contacts are connected by performing a connection cycle on the connection sections in sequence along the row in the first direction. Each connection cycle for each connection section includes the step of engaging one or more connections section with a tool and moving the engaged section or sections and the tool downwardly and in a second direction opposite to said first direction into engagement with the corresponding contacts, whereby during each connection cycle the tool and the engaged connection section or sections move away from the next adjacent unconnected connection section. Because the tool moves away from the next unconnected connection section, there is increased clearance for the tool shank.

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In a method according to one embodiment of the invention, the semiconductor chip is initially disposed on a substrate or a flat support surface 25. Then, the connection component 20 is positioned atop the chip 12 (see FIG. 1) with the bottom layer 24 of the connection component facing the top surface 14 of the chip. The connection component is juxtaposed with the chip in such a manner that the gap 26 of the connection component is aligned with the row of contacts 18 of the chip. Thus, a longitudinal axis of the gap 26, coincides with or extends substantially parallel to the lengthwise axis of the row of contacts or connection pads 18. The connection section of each lead is positioned across the gap 26 extending transversely to the lengthwise axis of the row of contacts. The juxtaposing step may be performed using conventional positioning elements of the type commonly employed for positioning semiconductor chips with respect to TAB (tape automated bonding) tape. The positioning equipment includes one or more video cameras 108, computer equipment 110 and servomechanisms 112. During the juxtaposing step, the video camera and computer equipment detect the positions of the fiducial marks 102 and 104 on the connection component body and chip, and may also command the servomechanism to adjust the relative positions of the connection component and chip accordingly so as to bring the connection component and chip to the desired alignment. Even with such corrections, however, it is not normally possible to bring all portions of the connection component body into perfect alignment with the associated parts of the chip.

注目情報

US9965705(BAIDU USA LLC [US])
[0033] Attention Model:
【００２５】
  注目モデル：

[0034] Attention models have been successfully adopted in many computer vision tasks, including object detection, fine-grained image classification, fine-grained visual recognition, and image captioning.
注目モデルは、対象検出、精細画像分類、精細視覚認識及び画像キャプションを含む多数のコンピュータ視覚タスクに用いている。

The attention information can be modeled as a attention region sequence in an image.
注目情報は画像中の注目領域シーケンスとしてモデリングできる。

A recurrent neural network is utilized to predict the next attention region based on the current attention region's location and visual features.
リカレントニューラルネットワークはカレント注目領域の位置及び視覚的特徴に基づいて次の注目領域を予測することに用いる。

Some employ this framework for object recognition, object detection, and fine-grained object recognition, respectively.
当該フレームワークをそれぞれ対象認識、対象検出及び精細対象認識に用いることがある。

Others have developed an attention-based model for image captioning that uses recurrent neural network as generator, so that the model focuses its attention on different image regions when generating different words in sentences.
更に、画像キャプション用の注目に基づくモデルが開発されており、当該モデルはリカレントニューラルネットワークを生成器とすることで、文の異なる単語を生成する時に、モデルはその注目を異なる画像領域に合わせる。

The model extracts a set of proposal regions in each image, and the attention weights are learned using the decoding LSTM generator hidden state and the visual features extracted in each proposal region.
前記モデルは各画像における一組の提案領域を抽出し、且つ注目重みは復号化ＬＳＴＭ生成器の隠れ状態と各提案領域から抽出された視覚的特徴によって学習される。

In one case [see T. Y. Lin, A. Roy Chowdhury, and S. Maji. Bilinear CNN models for fine-grained visual recognition. arXiv preprint arXiv: 1504.07889, 2015], a bilinear CNN structure was proposed to combine the location and content for fine-grained image classification.
一つの場合では（Ｔ・Ｙ・リン（Ｔ．Ｙ．Ｌｉｎ）、Ａ・ロイ・チョードリー（Ａ．Ｒｏｙ  Ｃｈｏｗｄｈｕｒｙ）及びＳ・マジ（Ｓ．Ｍａｊｉ）の、「精細視覚認識用の双線形ＣＮＮモデル」（Ｂｉｌｉｎｅａｒ  ＣＮＮ  ｍｏｄｅｌｓ  ｆｏｒ  ｆｉｎｅ－ｇｒａｉｎｅｄ  ｖｉｓｕａｌ  ｒｅｃｏｇｎｉｔｉｏｎ）、ａｒＸｉｖプレプリントａｒＸｉｖ：１５０４．０７８８９、２０１５を参照）、双線形ＣＮＮ構造が位置とコンテンツを組み合わせて精細画像分類に用いることが提案されている。

ABC-CNN is inspired by the successful application of attention on these vision tasks and utilizes question-guided attention to improve VQA performance.
注目がこれらの視覚タスクに成功的に応用されることに示唆され、ＡＢＣ－ＣＮＮは質問でガイドされた注目を使用してＶＱＡの性能を改良する。

並走

US10117760(Q3 MEDICAL DEVICES LTD [IE])
[0066] FIG. 1A is a diagram showing an embodiment of the stent of the present application. In this embodiment, stent 100 has an elongated body 10 with a proximal end 12 and a distal end 14 .
【００４９】
  図１Ａは、本出願のステントの一実施形態を示す図である。本実施形態において、ステント１００は、近位端１２と遠位端１４とを含む長尺の本体１０を含む。

Two sinusoidal channels 16 are formed on the exterior surface of the elongated body 10 , extending from the proximal end 12 to the distal end 14 in a fashion similar to the grooves on a drill head.
２つの正弦波形経路部１６が、穿孔器ヘッド上の溝と同様の形態で近位端１２から遠位端１４まで延びた長尺の本体１０の外面上に形成される。

The channels may have beveled edges to facilitate fluid flow inside the channels. The channels can be of varying depths and lengths.
経路部は、経路部の内部における流体の流れを円滑化する傾斜した縁部を含み得る。経路部は、非一定の深さおよび長さをもち得る。

The ends of the stent body can be of various shapes including conical shape. FIG. 1B is a see through drawing of FIG. 1A.
ステント本体の端部は、錐形状を含む様々な形状をもち得る。図１Ｂは、図１Ａに示す図を透明にした図である。

The two-channel design allows for two channels on the exterior surface of the stent to run in parallel from one end to the other or to criss-cross to allow for increased fluid flow as well as the ability to increase side branch flow of the main stented channel.
２経路部設計は、ステントの外面における２経路部が一端部から他方まで並走すること、または、十字交差してより多くの流体の流れを可能に、および、主たるステント処置された経路部のサイド分岐流を増やす能力を可能にすることを可能にする。

US2021064958(INTEL CORP [US])
As shown, optical waveguide 121 and optical waveguide 123 converge to run alongside each other to direct the first input optical signal and the second input optical signal along optical path 225 (“path 225 ”).
図示するように、光導波路１２１および光導波路１２３は、互いに並走するように収束して、第１の入力光信号および第２の入力光信号を光路２２５（以下、「経路２２５」）に沿って導く。

In embodiments, path 225 may include a critical coupling length, l, that may be longer or shorter than path 225 , but that promotes adiabatic evanescent coupling between optical signals in optical waveguide 121 and 123 .
実施形態では、経路２２５は、経路２２５よりも長くても短くてもよいが、光導波路１２１および１２３における光信号間の断熱エバネッセント結合を促進する臨界結合長ｌを含んでもよい。

US2023135085(AERWAVE MEDICAL INC [US])
[0025] FIG. 5 is a side elevational view of a right bronchial branch showing adjacent nerves running alongside the bronchial tube.
【図５】気管支と並走する隣接神経を示す右気管支の側面図である。

US2023303129(BOSCH GMBH ROBERT [DE])
[0011] In a development of a support structure of this kind with a plurality of support units, two support units for parallel travel of two cars along two route sections are provided in the region of the support structure.
【００１１】
  このような複数の支持体ユニットを備えた支持構造体の改良では、支持構造体の領域に、２つの走行路線に沿って２つの車両を並走させるための２つの支持体ユニットが設けられている、ということが想定されている。

Such a configuration makes it possible, if there are two route sections arranged parallel to each other and traversing the portal-like support structure, to remove or relocate a car on one route section, while the other route section can continue to be operated.
このような構成は、ガントリ状の支持構造体を横断する互いに平行に配置された２つの走行路線において、一方の走行路線では車両を導出するまたは入れ換える一方で、他方の走行路線は引き続き運転可能である、ということを可能にする。

US11126178(ZOOX INC [US])
[0043] In other examples, the command request may include other or additional instructions that define or constrain movement of an object in the environment.
【００４４】
  他の例においては、指令要求は、環境内のオブジェクトの動きを定義または制約する、他のまたは追加の命令を含み得る。

For instance, the command request may identify an object as irrelevant for collision purposes.
例えば、指令要求は、衝突の目的では無関係として、オブジェクトを識別し得る。

In one example, when the vehicle 202 is alongside another vehicle, such as the second additional vehicle 106 in FIG. 1,
一例においては、車両２０２が、図１における第２の追加車両１０６など、別の車両と並走しているとき、

the request generation system 230 can generate a request to fall behind, e.g., follow or merge behind, the second additional vehicle 106 . 
要求生成システム２３０は、第２の追加車両１０６の後方に下がる、例えば、追跡する、または後方で合流することを求める要求を生成することができる。

US11085132(SABIC GLOBAL TECHNOLOGIES BV [NL])
[0039] With reference to FIGS. 1 to 12, aspects of the disclosure relate to an apparatus 100 for electrospinning a polymer fiber web 110 onto a substrate 120 . A simplified schematic diagram of the apparatus 100 is illustrated in FIG. 1,
図１から１２を参照するならば、本開示内容の態様は、ポリマー繊維ウェブ１１０を担体１２０上に電界紡糸する装置１００に関する。装置１００の簡略化した配線配管図を図１に示す。

Particular components of the apparatus include an electrospinning enclosure 300 , at least one liquid polymer coating device 400 , a wire drive system 600 , a wire tensioning system 700 , an electrically conductive ground plate 800 and at least one high voltage power supply unit 820 that applies a high voltage to the plurality of continuous electrode wires 1000 .
この装置の特定の構成要素としては、電界紡糸筐体３００、少なくとも１つの液体ポリマーコーティングデバイス４００、ワイヤ駆動システム６００、ワイヤ緊張システム７００、導電性接地板８００、および高電圧を複数の連続電極ワイヤ１０００に印加する少なくとも１つの高電圧電源ユニット８２０が挙げられる。

A substrate 120 is unrolled from a substrate supply roller 200 and driven through the electrospinning enclosure.
担体１２０は、担体供給ローラ２００から解かれ、電界紡糸筐体の中を通って走行する。

A plurality of continuous electrode wires 1000 are driven through the eleetrospinning enclosure generally parallel to the face of the moving substrate 120 by the wire drive system 600 and wire tensioning system 700 .
複数の連続電極ワイヤ１０００は、移動する担体１２０の面と、通常は平行に、ワイヤ駆動システム６００およびワイヤ緊張システム７００により、電界紡糸筐体の中を通って走行する。

The moving directions of the plurality of continuous electrode wires 1000 and substrate 120 could either be co-current or counter-current. 
複数の連続電極ワイヤ１０００と担体１２０の移動方向は、並走または逆走のいずれでも良い。

US10820600(HANDTMANN ALBERT MASCHF [DE])
[0015] In one example, the cover may be configured as a cover which is running parallel to the drum or the fan belt, and in one example, as running parallel belt or roller carpet.
【００１６】
  カバーは、好ましくは並走ベルトまたはローラカーペットとして、ドラムまたはファンベルトと並走するカバーとして構成されることが特に好ましい。

Thus, during the transport of the sausage portions, there is not or only a slight relative movement between cover and sausage portion that in turn leads to a particularly gentle transfer and transport of the sausage portions.
これにより、ソーセージポーションの搬送中に、カバーとソーセージポーションとの間の相対移動が起こらず、またはわずかしか起こらず、その結果、ソーセージポーションの移送および搬送が特に穏やかに行われることになる。

If the cover is driven, the velocity is adjusted such that the relative velocity between sausage portion and/or drum and cover as possible approaches to zero.
カバーを駆動する場合には、ソーセージポーションおよび／またはドラムとカバーとの間の相対速度が可能な限りゼロに近づくように速度が調節される。

[0042] As in particular shown in FIG. 9, the cover 15 may also be configured as parallel running driven cover, here e.g. as parallel running belt 15 .
【００３１】
  図９で特に示されるように、カバー１５は並走従動カバーとして、例えばここでは並走ベルト１５として構成されてもよい。

This involves the advantage that the relative velocity between the second transport device 10 , i.e. also the sausage portions transported along therewith and the cover 15 may be minimized and/or reduced to zero.
これには、カバー１５と第２の搬送装置１０との間、すなわち同様に、第２の搬送装置１０に沿って搬送されるソーセージポーションとの間の相対速度を最小限に、および／またはゼロにするという利点がある。

This, in particular is advantageous in the lower area of the transport device 10 , as it is possible here that the sausage portion 1 comes into contact with the cover 15 due to force of gravity.
これは、ソーセージポーション１がここで重力によってカバー１５と接触する可能性があるため、搬送装置１０の下側領域において特に好適である。

The parallel running cover 15 allows a particularly careful transporting of the sausage portions. 
並走カバー１５によって、ソーセージポーションを特に慎重に搬送することができる。

US9433441(GLOBUS MEDICAL INC [US])
[0032] The curved opening 17 for receiving the rod member 80 is formed by inner walls of the clamp 10 .
【００１４】
  ロッド部材８０を受容するための湾曲開口部１７は、クランプ１０の内壁により形成される。

In some embodiments, the curved opening 17 has a radius that can accommodate both the rod 80 and the elongate member 60 placed therein.
いくつかの実施形態では、湾曲開口部１７は、ロッド８０とその中に配置される細長い部材６０の両方を収容することができる半径を有する。

As shown in FIG. 1B, the inner walls of the clamp 10 can include a track or groove 32 formed therein that runs along the inner walls of the clamp 10 .
図１Ｂに示されるように、クランプ１０の内壁は、クランプ１０の内壁に並走し、その内部に形成される、軌道または溝３２を含み得る。

The groove 32 advantageously accommodates the elastic member 32 therein. In some embodiments, the groove 32 has a width that is approximately the same as the width of an elastic member 60 positioned therein.
溝３２は、その内部に弾性部材３２を有利に収容する。いくつかの実施形態では、溝３２は、その内部に配置される弾性部材６０の幅とほぼ同じ幅を有する。

With the addition of the groove 32 , the clamp 10 , rod member 80 and elastic member 60 can be held together, even before tightening the set screw 25 (as discussed below).
溝３２の追加で、（以下に示されるように）止めねじ２５を締め付ける前でさえ、クランプ１０、ロッド部材８０及び弾性部材６０を一体的に保持することができる。

In some embodiments, the groove 32 runs substantially or completely along the inner walls of the clamp 10 .
いくつかの実施形態では、溝３２は、実質的にまたは完全にクランプ１０の内壁に並走する。

可能な情報：information capable of

US9361446(AMAZON TECH INC [US])
[0045] The bot detection service 212 may determine the probability of a particular request(s) being generated by an automated agent and associate the probability with the request. In various embodiments, the bot detection service 212 receives a copy of the request and returns, to the request routing service 206 , the probability of the request being generated by an automated agent and information identifying the request. The bot detection service 212 may transmit the request and the associated probability to the request routing service 212 and the request routing service 212 may determine how to process the request based at least in part on the associated probability. The bot detection service 212 may also redirect the request to the rendering service 214 based at least in part on the probability of the request being generated by an automated agent. The bot detection service 212 may also generate a list of possible automated agents based at least in part on the information received from the request routing service 206 . The list may be configured to include information identifying the request and/or the requestor as well as a score indicating the likelihood of the request being generated by an automated agent. The identifying information may include a signature based at least in part on the IP address of the requestor, a cookie associated with the request, a token associated with the request, a parameter associated with the request, a customer account associated with the request, a session associated with the request, an identification number associated with the request, purchase history associated with the request or other information capable of identifying a requestor associated with a request.

US2020288069(DIVX LLC [US])
[0041] In a yet further embodiment, the series of encoded video frames are encoded as a series of video chunks and each encoded subtitle track is encoded as a series of subtitle chunks. Each subtitle chunk includes information capable of being represented as text on a display. In addition, each subtitle chunk can contain information concerning a single subtitle. Furthermore, each subtitle chunk can include information concerning the portion of the video sequence over which the subtitle should be superimposed.

US9459693(SEARETE LLC A LTD LIABILITY CORP OF THE STATE OF DELAWARE [US])
21. The head mountable system of claim 3, wherein circuitry configured for transmitting at least one of the identification information or the annotation information comprises:

circuitry configured for associating the identification information with the annotation information; and

circuitry configured for providing the associated identification information and annotation information for storage, the annotation information capable of being retrieved at least partially via at least one query including at least the identification information.

US9905082(SPORTSMEDIA TECH CORP [US])
[0029] Context information may generally refer to any information capable of providing context to the live event, such as the live event participants or the live event information. Illustrative context information may include weather conditions and/or forecasts, player injury information, event location (for instance, indicating home and away teams), bookmaker odds and/or spreads, off-the-field information that may affect the live event and/or participants, or the like.

燃焼極

EP3104443(AISIN SEIKI [JP])
[0030] The combustion unit 35, as illustrated in Fig. 1 and Fig. 4 , burns the combustible gas led out from the fuel electrode of the fuel cell 51 using the oxidizer gas and heats the evaporating unit 32 and the reforming unit 33 between the evaporating unit 32, the reforming unit 33, and the fuel cell 51.
【００２４】
  燃焼部３５は、図１および図４に示すように、蒸発部３２および改質部３３と燃料電池５１との間にて、燃料電池５１の燃焼極から導出される可燃性ガスを酸化剤ガスで燃焼させ、蒸発部３２および改質部３３を加熱するものである。

The combustion unit 35 corresponds to a combustion space in which the combustible gas is burned using the oxidizer gas.
燃焼部３５は、可燃性ガスを酸化剤ガスで燃焼させる燃焼空間である。

The combustible gas is gas which burns, and is reforming gas (anode off gas) led out from the fuel flow passages 51a2 and 51b2 without being used for the power generation.
可燃性ガスは、燃えるガスであり、発電に使用されずに燃料流路５１ａ２，５１ｂ２から導出した改質ガス（アノードオフガス）である。

The oxidizer gas is air (cathode air (cathode off gas)) led out from the air flow passages 51a3 and 51b3 without being used for the power generation.
酸化剤ガスは、発電に使用されずに空気流路５１ａ３，５１ｂ３から導出した空気（カソードエア（カソードオフガス））である。

In the combustion unit 35, the anode off gas is burned, the combustion gas (flame 36) is generated, and the evaporating unit 32 and the reforming unit 33 are heated by the generated combustion gas.
燃焼部３５では、アノードオフガスが燃焼されて燃焼ガス（火炎３６）が発生し、その燃焼ガスによって蒸発部３２および改質部３３が加熱される。

US2014377684(RIKEN KK [JP])
[0004] The SOFC is primarily categorized into an electrolyte-supported cell having a thick electrolyte and a fuel-electrode-supported cell having a thick fuel electrode. However,
【０００３】
  ＳＯＦＣには主に、電解質を厚くした電解質支持型セルと、燃料極を厚くした燃料極支持型セルとがあるが、

since the electrolyte causes significant internal resistance during power generation, the fuel-electrode-supported cell that may have a thin electrolyte has been increasingly used for the purpose of improving a battery performance.
電解質は発電時に大きな内部抵抗となるため、電池特性の向上の目的から電解質を薄くできる燃料極支持型セルが普及しつつある。

[0005] As the fuel electrode of the fuel-electrode-supported cell,
【０００４】
  燃料極支持型セルの燃焼極としては、

nickel-zirconia cermet obtained by mixing nickel oxide with an average particle diameter of approximately 1 μm (NiO, note that it changes into Ni metal during operation of the fuel cell) and zirconia (ZrO2 ) fine particles with an average particle diameter of approximately 0.5 μm has been known.
平均粒径が１μｍ程度の酸化ニッケル（ＮｉＯ、但し燃料電池作動時には金属Ｎｉ）と、平均粒径が０．５μｍ程度のジルコニア（ＺｒＯ_２）微粒子とを混合して得たニッケル－ジルコニアサーメットが知られている。

 

燃料電池は、空気極と、電解質層と、燃焼極を有する。

ChatGPT:

Here is a natural and faithful English translation of that sentence:

"The fuel cell includes an air electrode, an electrolyte layer, and a fuel electrode."

---

🔍 Breakdown of translation choices:

• 燃料電池 → "fuel cell"
   ✅ Standard and direct.

• 空気極 → "air electrode"
   ✅ Widely used term in fuel cell terminology (the cathode in most systems, where oxygen is reduced).

• 電解質層 → "electrolyte layer"
   ✅ Common and precise.

• 燃焼極 → "fuel electrode"
   ✅ Though literally “combustion electrode,” in fuel cell terminology this typically refers to the anode, where the fuel (e.g., hydrogen) is oxidized.  ✅ "Fuel electrode" is the standard technical term.

---

✅ Alternative (more explanatory) version:

"The fuel cell has an air electrode, an electrolyte layer, and a fuel electrode, which constitute its basic structure."

Let me know if you'd like this phrased for a patent claim or technical summary!

発信信号

EP4319991(LYTEN INC [US])
[0119] Tuned resonance sensing carbon-containing materials can be incorporated into or with automotive features, surfaces, and/or components in the context of durable sensors in various exterior surfaces of vehicles.
【００７０】
  同調した共振感知炭素含有材料は、車両のさまざまな外面内の耐久性のあるセンサという観点から、自動車の特徴、表面、及び／またはコンポーネント中に組み込まれる、またはそれらと結合されることができる。

As shown, the vehicle is equipped with surface sensors on the front faring (such as, hood) of the vehicle, on support members of the vehicle, and on the roof of the vehicle. Each of the foregoing locations of the vehicle can be subjected to stresses and accompanying deformations during operation of the vehicle.
示されるように、車両は、車両のフロントフェアリング（フードなど）、車両の支持部材、及び車両のルーフの上に表面センサを備える。車両の前述の位置のそれぞれは、車両の動作中に応力及び付随する変形を受けることがある。

As examples, the surface sensors on the front faring will undergo air pressure changes when the vehicle is in operation (such as, during forward motion).
例として、フロントフェアリング上の表面センサは、車両動作中（前進運動中など）に空気圧変化を受ける。

Under the forces of the air pressure, the material that composes the surface can deform slightly and, in accordance with the phenomenon described as pertains to Figure 2B1 and Figure 2B2, demonstrate a change in resonant frequency of the material proportionate to the degree of change or deformation of the material.
空気圧の力の下で、表面を構成する材料は、わずかに変形し、図２Ｂ１及び図２Ｂ２に関連して記載される現象に従って、材料の変化または変形の程度に比例した材料の共振周波数における変化を示すことができる。

Such a change can be detected using the ‘ping” and observation techniques described earlier.
そのような変化は、前述の「ピング音」及び観測技法を使用して検知されることができる。

[0120] Observed emitted signals can collectively define a signature for a particular material or surface and can be further classified.
【００７１】
  観測された発信信号は、特定の材料または表面についてのシグネチャをまとめて規定することができ、さらにクラス分類されることができる。

Specific characteristics of the signal can be isolated for comparison and measurement to determine calibration points that correspond to the specific isolated characteristics.
信号の特異的な特性を比較及び測定のために分離し、特異的な分離された特性に対応する較正点を決定することができる。

Accordingly, aspects of the environment surrounding a vehicle can be accurately and reliably determined.
したがって、車両を取り巻く環境の態様を正確かつ確実に決定することができる。

US11784856(MACOM TECH SOLUTIONS HOLDINGS INC [US])
[0006] FIG. 1 illustrates a prior art transceiver having separate sequence generator and error checker.
【０００５】
  図１は、別個のシーケンス生成器およびエラー検査器を有する従来技術のトランシーバを示す。

This embodiment is an optical environment having a lower transmit path and an upper receiver path both on a space limited die 104 .
この実施形態は、両方ともスペース限定ダイ１０４上に下側送信経路および上側受信経路を有する光環境である。

In reference to the lower path, differential inputs 108 A, 108 B receive an outgoing signal for transmission.
下側経路を参照すると、差分入力１０８Ａ、１０８Ｂは、送信のために発信信号を受信する。

The inputs 108 connect to an equalizer 112 which performs equalization on the signal prior to transmission.
入力１０８は、送信前に信号の等化を実行するイコライザ１１２に接続する。

The output of the equalizer 112 feeds into one or more buffers 116 , which in turn connect to a clock and data recover circuit (CDR) 120 and to a multiplexer 128 .
イコライザ１１２の出力は、１つまたは複数のバッファ１１６に提供され、バッファは、クロックおよびデータ復元回路（ＣＤＲ）１２０およびマルチプレクサ１２８に接続する。

A sequence generator 124 also connects to the multiplexer 128 to provide a pseudorandom number sequence to the multiplexer.
シーケンス生成器１２４はまた、マルチプレクサ１２８に接続して擬似ランダムシーケンスをマルチプレクサに提供する。

The output of the multiplexer connects to a driver 132 configured to present the outgoing signal on output 140 .
マルチプレクサの出力は、出力１４０上に発信信号を提示するように構成されたドライバ１３２に接続する。

An error checker 136 is configured to receive the outgoing signal and perform error checking based on a comparison to a known and expected bit pattern (sequence), such as might be generated by a sequence generator a transmitting station.
エラー検査器１３６は、発信信号を受信し、送信局のシーケンス生成器によって生成され得るような既知のビットパターン（シーケンス）と予想されるビットパターンとの比較に基づいてエラー検査を実行するように構成される。

US2022178896(PROCTER & GAMBLE [US])
The algorithm may be programmed to send outgoing signals to the sensor to take sensor measurements at specific times during the day, or at set intervals throughout the day.
【０２０５】
  アルゴリズムは、発信信号をセンサに送信して、１日のうちの特定の時間に、又は１日全体を通して設定された間隔でセンサ測定値を取得するようにプログラムされ得る。

The CCU may be configured to use sensor measurements from different sensors located within a house or building.
【０２０６】
  ＣＣＵは、家又は建物内に配置された異なるセンサからのセンサ測定値を使用するように構成されてもよい。

Different sensors may be used at different times of the day and/or different days of the week or different sensors may simultaneously take measurements.
異なるセンサが、１日のうちの異なる時間及び／又は異なる曜日に使用されてもよく、あるいは異なるセンサが同時に測定値を取得してもよい。

US11553310(QUALCOMM INC [US])
[0004] An example user equipment includes: at least one transceiver configured to transmit outbound signals wirelessly and receive inbound signals wirelessly;
【０００３】
  [0003]  例示的なユーザ機器（user equipment）は、発信信号（outbound signal）をワイヤレスに送信し、着信信号（inbound signal）をワイヤレスに受信するように構成された少なくとも１つのトランシーバ（transceiver）と、

a memory; and at least one processor, communicatively coupled to the at least one transceiver and the memory,
メモリ（memory）と、少なくとも１つのトランシーバとメモリとに通信可能に結合された少なくとも１つのプロセッサ（processor）とを含み、

and configured to: send, to a network entity via the at least one transceiver, a processing-capability message indicating a processing capability of the user equipment for processing an aggregated positioning reference signal,
少なくとも１つのプロセッサは、少なくとも１つのトランシーバを介してネットワークエンティティ（network entity）に、アグリゲートされた測位基準信号（aggregated positioning reference signal）を処理するためのユーザ機器の処理能力（processing capability）を示す処理能力メッセージ（processing-capability message）を送ることと、

where the processing-capability message corresponds to one or more assistance-data types;
ここで、処理能力メッセージは、１つまたは複数の支援データタイプ（assistance-data type）に対応する、

obtain the aggregated positioning reference signal from the at least one transceiver; and
少なくとも１つのトランシーバからアグリゲートされた測位基準信号を取得することと、

process the aggregated positioning reference signal based on assistance data to determine a positioning signal measurement,
測位信号の測定値（positioning signal measurement）を決定するために支援データ（assistance data）に基づいてアグリゲートされた測位基準信号を処理することと、

the assistance data including the one or more assistance-data types.
支援データは、１つまたは複数の支援データタイプを含む、を行うように構成される。

 

How about "transmission signal" for 発信信号?

ChatGPT:

In this context, "outgoing signal" is generally the more natural and accurate choice for 発信信号, especially when the focus is on initiating communication to another device. Here's the reasoning:

🔍 Comparison:

Japanese term	Option	Notes
発信信号	Outgoing signal	Commonly used to describe a signal originating from a device (e.g., in telecom and control systems).
	Transmission signal	Grammatical and understandable, but sounds more general and could refer to any signal being transmitted—not necessarily one that initiates communication.

 

📘 Usage nuance:

• "Transmission signal" is often used in discussions about signal characteristics (e.g., waveform, modulation, bandwidth).

• "Outgoing signal" conveys the directionality and intent — that it’s being sent from the device to others, matching the nuance of 発信.

✅ Recommended:

"An outgoing signal" is more appropriate for 発信信号 here.

キッティング

US12214975(DEXTERITY INC [US])
[0025] As used herein, kitting includes the picking of one or more items/objects from corresponding locations and placing the one or more items in a predetermined location in a manner that a set of the one or more items corresponds to a kit.
【００２５】
  本明細書で用いられているキッティングは、１または複数のアイテム／物体を対応する位置からピックして、１または複数のアイテムのセットがキットに対応するように１または複数のアイテムを所定の位置にプレースすることを含む。

An example of a kitting system and/or process for kitting a set of items is further described in U.S. patent application Ser. No. 17/219,503, the entirety of which is hereby incorporated herein for all purposes.
アイテムのセットをキッティングするためのキッティングシステムおよび／または処理の例が、米国特許出願第１７／２１９，５０３号でさらに記載されており、その出願は、参照によりすべての目的のためにその全体が本明細書に組み込まれる。

吸着面、吸着する

US11251061(KSM COMPONENT CO LTD [KR])
[0003] An electrostatic chuck (ESC) is a device that horizontally fixes a semiconductor wafer or LCD glass substrate by using an electrostatic force, and is largely classified into a Coulomb-type electrostatic chuck and a Johnson-Rahbek-type electrostatic chuck according to the adsorption method.
静電チャック（Ｅｌｅｃｔｒｏｓｔａｔｉｃ ｃｈｕｃｋ；ＥＳＣ）は、静電気力を利用して半導体ウェハやＬＣＤガラス基板などを水平固定させる装置であって、吸着方法によって大きくクーロン（Ｃｏｕｌｏｍｂ）型静電チャックとジョンソン－ラベック（Ｊｏｈｎｓｅｎ－Ｒａｈｂｅｋ）型静電チャックに分類される。

Among them, the Johnson-Rahbek-type electrostatic chuck generally has a low volume resistivity characteristic of 1×109 ˜1×1012 Ω·cm, charges electric charges on the wafer adsorption surface of the dielectric due to its low volume resistivity characteristics, and fixes the wafer through electrostatic attraction of these surface charges.
このうち、ジョンソン－ラベック型静電チャックは、一般的に、１×１０^９～１×１０^１２Ω・ｃｍ程度の低い体積抵抗特性を有し、低い体積抵抗特性により誘電体のウェハ吸着面に電荷が充電され、このような表面電荷の静電気的引力を介してウエハが固定される。

On the other hand, the Coulomb-type electrostatic chuck fixes the wafer by using electrostatic attraction between different charges existing on the upper and lower surfaces of the dielectric. In the Coulomb-type electrostatic chuck, only when the volume resistivity of the dielectric is 1×1015 Ω·cm or more, the leakage current is small and the wafer desorption performance is excellent, and as the size of the semiconductor wafer is increased, sufficient electrostatic adsorption force may not be uniformly formed over the entire wafer contact surface.
一方、クーロン型静電チャックは、誘電体上下面に存在する互いに異なる電荷間の静電気的引力を利用してウェハを固定するものであって、誘電体の体積抵抗値が１×１０^１５Ω・ｃｍ以上であれば漏れ電流が少なく、ウェハ脱着性能に優れ、半導体ウェハのサイズが大きくなるほど十分な静電吸着力をウェハ接触面の全体に均一に形成できないことがある。

US10347520(FEMVIX CORP [KR])
[0012] On the other hand, the technique of U.S. Pat. No. 2008/0276865 entitled “Electrostatic Chuck, Manufacturing Method Thereof And Substrate Treating Apparatus” relates to a technique of forming a polycrystalline structure by spraying and coating yttria (Y2 O3 ) powder on the adsorption surface (mounting surface) of an electrostatic chuck, which adsorbs and fixes a wafer, using the AD method.
【００１２】
  また、米国特許登録ＵＳ  ２００８／０２７６８６５「Ｅｌｅｃｔｒｏｓｔａｔｉｃ  Ｃｈｕｃｋ，  Ｍａｎｕｆａｃｔｕｒｉｎｇ  Ｍｅｔｈｏｄ  Ｔｈｅｒｅｏｆ  Ａｎｄ  Ｓｕｂｓｔｒａｔｅ  Ｔｒｅａｔｉｎｇ  Ａｐｐａｒａｔｕｓ」の技術は、ウェーハを吸着固定する静電チャックの吸着面にエーロゾル沈着（ＡＤ）方法を用いて酸化イットリウム（Ｙ₂Ｏ₃）パウダーを噴射コーティングして多結晶質構造を形成することに関するものである。

However, protrusions contacting with the bottom of the wafer exist on the adsorption surface of the electrostatic chuck,
但し、前記静電チャックの吸着面にはウェーハ底面と接触する突出が存在するが、

and the problem is that since the amount of powder supplied to the transfer tube from the aerosol generator cannot be constantly controlled by the nature of the system, thickness of the coating film on the protrusions and surrounding areas is non-uniform across the adsorption surface of the electrostatic chuck,
上述したように、エーロゾル発生器から輸送管に供給されるパウダーの量をシステム的に一定に制御することができないため、突出及び突出部の周りのコーティング膜の厚さが静電チャック吸着面に亘って不均一になり、

and thus line patterns having a predetermined width are generated on the adsorption surface after AD coating is actually performed, and, therefore, it may negatively affect the electrical characteristics of the electrostatic chuck. 
その結果、実際にエーロゾル沈着（ＡＤ）コーティングを行った後に吸着面に所定の幅を有する線模様が生じてしまうという問題があり、このため、静電チャックの電気的な特性に否定的な影響を及ぼす虞があるという欠点がある。

US2022375780(DISCO CORP [JP])
[0004] JP 2005-153090A also discloses a processing apparatus for supplying a processing fluid of loose abrasive grains to the reverse side of a wafer and processing the reverse side of the wafer to a mirror finish with a polishing pad.
【０００５】
  また、上記の特許文献１に開示された加工装置では、ウエーハの裏面に遊離砥粒を加工液として供給し研磨パッドによってウエーハの裏面を鏡面に加工することができる。

The wafer is held under suction on a holding unit including a chuck table for holding the wafer thereon and a table base on which the chuck table is detachably supported.
そして、ウエーハを吸引保持する保持手段は、ウエーハを保持するチャックテーブルと、該チャックテーブルを着脱自在に支持するテーブルベースと、を備え、

The chuck table includes a porous plate having a suction surface, i.e., a holding surface for attracting the wafer under suction,
該チャックテーブルは、ウエーハを吸着する吸着面を備えたポーラスプレートと、

a frame surrounding portions of the porous plate other than the suction surface,
該吸着面以外を囲繞する枠体と、

a plurality of wafer suction holes that are defined in the bottom surface of the frame and transmit suction forces therethrough to the suction surface of the porous plate,
該枠体の底面に形成され該ポーラスプレートの吸着面に吸引力を伝達するウエーハ吸引孔と、

and a plurality of bolt holes that are defined in the frame and receive therein respective bolts to fasten the chuck table to the table base. The chuck table is capable of holding the wafer thereon under suction forces applied through the wafer suction holes to the suction surface.
該枠体に形成され該テーブルベースに固定するボルト孔と、を含み構成されていて、ウエーハを吸引保持できる構成となっている。

US2022285196(TOKYO ELECTRON LTD [JP])
[0071] The first holder 120 is a holder configured to hold the first substrate W 1 .
【００３７】
  第１保持部１２０は、第１基板Ｗ１を保持する保持部である。

The first holder 120 includes an electrostatic chuck 121 and a cooling plate 122 .
第１保持部１２０は、静電チャック１２１と冷却板１２２とを有している。

The electrostatic chuck 121 has an internal electrode and a dielectric material, and is configured to attract the first substrate W 1 onto an attraction surface thereof with an electrostatic force generated by applying a voltage to the internal electrode.
静電チャック１２１は、内部電極と誘電体とを有し、内部電極に電圧を印加することによって発生する静電気力を用いて第１基板Ｗ１を吸着面に吸着させる。

The cooling plate 122 is, for example, a water cooling plate, and cooling water flows therein. The first substrate W 1 held on the electrostatic chuck 121 is regulated to a required temperature, for example, a room temperature by the cooling plate 122 .
冷却板１２２は例えば水冷板であって、内部を冷却水が流通する。この冷却板１２２により、静電チャック１２１に保持された第１基板Ｗ１が所望温度、例えば常温に調整される。

US12125733(SHINKO ELECTRIC IND CO [JP])
[0031] The ceramic layer 130 is made of a ceramic 132 inside which electrically conductive electrodes 131 are provided.
【００１９】
  セラミック層１３０は、内部に導電性の電極１３１を有し、セラミックからなる例えば厚さ４．５ｍｍ程度の層である。

For example, the ceramic layer 130 is about 4.5 mm thick. The ceramic 132 is obtained by firing green sheets, for example, produced by use of aluminum oxide.
セラミックは、例えば酸化アルミニウムを用いて作製されたグリーンシートを焼成することにより得られる。

By electrostatic force generated due to a voltage applied to the electrodes 131 of the ceramic layer 130 , the ceramic layer 130 contacts and adsorbs the object such as a substrate.
セラミック層１３０の電極１３１に電圧が印加されることによって発生する静電力によって、セラミック層１３０は、例えば基板などの対象物に接触して吸着する。

That is, in FIG. 2 , an upper face of the ceramic layer 130 serves as the adsorption face that contacts the object, and the object is adsorbed to the adsorption face when the voltage is applied to the electrodes 131 .
すなわち、図２においては、セラミック層１３０の上面が対象物に接触する吸着面となり、電極１３１への電圧印加時には、対象物が吸着面に吸着される。

 

正極合材

US2022384867(SOLID POWER OPERATING INC [US])
[0059] Construction of the Cathode Layer
【００５９】
正極層の構築

[0060] The cathode layer was constructed using an NMC cathode active material, a Li2 S—P2 S5 containing solid-state electrolyte, a carbon-based conductive additive, and a polymer.
【００６０】
  ＮＭＣ正極活物質、Ｌｉ_２Ｓ－Ｐ_２Ｓ_５含有固体電解質、炭素系導電性添加剤、及びポリマーを使用して、正極層を構築した。

These components were mixed in a solvent capable of dissolving the polymer, forming a cathode composite which was then placed on an aluminum foil current collector.
これらの成分をポリマーを溶解可能な溶媒中で混合して正極合材を形成し、これをアルミ箔集電体上に配置した。

The cathode composite layer was the dried and compressed to form a compact cathode layer.
正極合材層を乾燥させ、圧縮して、コンパクトな正極層を形成した。

US2021114364(AIST [JP])
[0002] The present application relates to a new structure of oxide ceramics and to a technique for manufacturing structure.
【０００１】
  本発明は、酸化物セラミックスの新たな構造体、および、当該構造体を製造する技術に関する。

[0003] Oxide ceramics are widely applied as electronic ceramics utilizing such piezoelectric and dielectric properties.
酸化物セラミックスは、圧電性や誘電性などを利用した電子セラミックスとして広く応用されている。

Recently, in order to apply it to the wearable device, there is a demand for the development of “the flexible device” in which a flexible organic substance such as plastic and electronic ceramics are combined.
最近では、ウェアラブルデバイスへの適応に向けて、プラスチックなどの柔軟な有機物と電子セラミックスを複合化した「フレキシブルデバイス」の開発が求められている。

[0004] “Oxide all-solid Lithium-ion secondary battery” attracts attention as a next-generation storage battery.
また、次世代蓄電池として注目を集めている「酸化物全固体リチウムイオン二次電池」については、

In the “oxide all-solid-state lithium-ion secondary battery”, first, the active material of the oxide ceramics, the solid electrolyte, and the auxiliary agent for supplementing the conductivity and the like are uniformly deposited on the metal foil without any gaps. As a result, a positive electrode mixture and a negative electrode mixture are prepared respectively.
酸化物セラミックスの活物質や固体電解質、導電性を補う助剤などを、隙間なく均一に金属箔上へ堆積した正極合材及び負極合材をそれぞれ用意し、

Further, a very advanced technique of bonding the positive electrode mixture and the negative electrode mixture without gap by sandwiching the solid electrolyte of the oxide is required.
さらに、酸化物の固体電解質でこれらの正極合材と負極合材を隙間なく接合すると言った、非常に高度な技術が要求されている。

 

正極合材

ChatGPT:

「正極合材」は、リチウムイオン電池などの文脈でよく使われる専門用語で、英語では一般的に以下のように訳されます：

---

✅ 推奨訳：

cathode composite material

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解説：

• 正極 → cathode（放電時に電子を受け取る電極。充電池では正極＝cathode）

• 合材 → composite material
   → バインダー、導電助剤、活物質などを混合した電極の塗布材料を指します。

---

文脈による補足表現：

• cathode composite → 簡潔な表現。文脈が明確な場合はこちらも使用されます。

• cathode active material layer → 場合によってはこのように訳されることもありますが、こちらは合材を塗布した層を指すことが多いです。

---

例文での使用：

• The cathode composite material was applied to the aluminum current collector and dried.
  （正極合材がアルミニウム集電体に塗布され、乾燥された。）

---

文脈に応じて「合材スラリー（composite slurry）」や「正極層（cathode layer）」などの表現も考慮できますので、必要があれば教えてください！

面発光素子

US2023238477(UNIV CALIFORNIA [US])
[0060] This invention combines ELO with a substrate removal technique
【００６０】
  本発明は、ＥＬＯと基板除去技法を組み合わせ、

that provides a way to realize better thermally managed devices,
より良好な熱的に管理される素子、

smaller footprint devices at least two times smaller than conventional size, as these devices can be realized on wings of the III-nitride ELO layers,
これらの素子がＩＩＩ族窒化物ＥＬＯ層のウィング上に実現され得るので、従来のサイズの少なくとも、２分の１のより小さい占有面積の素子、

and also more unique devices, which require removal of the substrate to employ cladding on the surfaces normal to the light emission, i.e., on the top and bottom of the edge-emitting devices.
および、発光に対して垂直の表面、すなわち、端面発光素子の上部および底部上にクラッディングを採用するために基板の除去を要求するより独特の素子を実現する方法を提供する。

US9960330(KONINKLIJKE PHILIPS NV [NL])
[0035] Of particular note, the light that is emitted from the sidewalls 115 of the substrate 110 of the LED 200 of FIG. 2A 
特に注目すべきは、図２ＡのＬＥＤ２００の基板１１０の側壁１１５から出射された光は、

is not dependent upon a phosphor content in the substrate 110 ,
基板１１０中の蛍光体含有量に依存しておらず、

and may be marketed as a ‘core’ side-emitting device 200 with known characteristics,
且つこの基板は、既知の特性を有する「コア」側面発光素子２００として販売されており、

to which a wavelength conversion element may be added to create side-emitting devices 201 with particular light output color characteristic.
波長変換素子を追加して、特定の光出力色特性の側面発光素子２０１を形成することができる。

Because the light emitting surface of the light emitting element 120 is protected by the substrate 110 ,
発光素子１２０の発光面が基板１１０によって保護されるので、

the side emitting LED 200 can be handled and manipulated in a process that is independent of the process used to create the LED 200 .
側面発光ＬＥＤ２００は、ＬＥＤ２００を形成するために使用するプロセスとは無関係（独立）であるプロセスで処理及び操作することができる。

US9415724(OSRAM OLED GMBH [DE])
[0029] An organic photodiode can comprise in particular an organic functional layer stack between two electrodes, wherein the organic functional layer stack has as an organic light detecting layer at least one pn junction for generating charge carriers.
【００２９】
  前記有機フォトダイオードは、特に、２つの電極間に有機機能層スタックを備え、この有機機能層スタックは、有機受光層として、電荷キャリア生成のための少なくとも１つのｐｎ接合部を有する。

By way of example, the organic photodiode, with regard to the electrodes and the organic functional layer stack, can have the same construction as an organic light emitting element, that is to say in particular an OLED, and can be operated inversely with respect thereto, that is to say with opposite electrical polarity.
例えば、前記有機フォトダイオードは、電極及び有機機能層スタックに関して、有機発光素子すなわちＯＬＥＤと同じ構造を有し、それとは反対の、つまり逆の電気的極性で動作される。

As a result it may be possible, for example, for all the organic optoelectronic, light detecting and light emitting elements of the mirror device to be embodied identically,
これにより、例えば、前記ミラー装置の全ての有機受光素子と有機発光素子とを、同じように構成することも可能である。

as a result of which an unchanged process implementation without additional outlay and without additional costs may be possible during production in comparison with, for example, conventional surface emitters such as OLEDs. 
それにより、例えばＯＬＥＤのような従来の面発光素子に比べて、製造の際の余分な手間や追加費用なしでそのままのプロセス制御を行うことが可能になる。

US2022197177(CANON KK [JP])
[0002] Conventionally, there has been generally known an electrophotographic system printer in which a photosensitive drum is exposed to light by an exposure head using a light emitting element such as an LED or an organic EL to form a latent image on the photosensitive drum.
【０００２】
  従来、ＬＥＤ又は有機ＥＬ等の発光素子を用いた露光ヘッドによって感光ドラムを露光して感光ドラム上に潜像形成を行う電子写真方式のプリンタが一般的に知られている。

Such an exposure head includes light emitting element rows arranged in the longitudinal direction of the photosensitive drum and a rod lens array that forms an image of light of the light emitting element rows on the photosensitive drum.
このような露光ヘッドは、感光ドラムの長手方向に配列した発光素子列と、発光素子列の光を感光ドラム上に結像するロッドレンズアレイと、によって構成されている。

The LED or the organic EL as the light emitting element includes a surface light emitting element array in which the irradiation direction of light from the light emitting surface is parallel to the optical axis of the rod lens array.
発光素子としてのＬＥＤ又は有機ＥＬは、発光面からの光の照射方向がロッドレンズアレイの光軸と平行となる面発光素子アレイである。

US2023387363(STANLEY ELECTRIC CO LTD [JP])
[0036] As illustrated in FIGS. 1 A to 1 C, the semiconductor light emitting element 11 includes a light emitting semiconductor layer 20 provided on a support substrate 31 .
【００１４】
  図１Ａ～図１Ｃに示すように、半導体発光素子１１は、支持基板３１上に設けられた発光半導体層２０を有する。

Although a light emitting diode (LED) will be described below as the semiconductor light emitting element 11 by way of example, a surface light emitting element such as a surface light emitting laser diode (LD) may be provided.
なお、以下において半導体発光素子１１として発光ダイオード（ＬＥＤ）を例に説明するが、面発光ＬＤ（レーザダイオード）などの面発光素子であってもよい。

US2022077655(SUMITOMO ELECTRIC INDUSTRIES [JP])
[0036] A surface-emitting semiconductor laser having a semiconductor mesa portion including a vertical resonator on a substrate is known.
【０００６】
  垂直共振器を含む半導体メサ部を基板上に備える面発光半導体レーザが知られている。

In such a surface-emitting semiconductor laser, a pad electrode for supplying current to an electrode in contact with the semiconductor mesa portion is disposed around the semiconductor mesa portion.
そのような面発光半導体レーザにおいては、半導体メサ部と接触を成す電極に電流を供給するためのパッド電極が、半導体メサ部の周辺に配置される。

When the surface-emitting semiconductor laser is flip-chip mounted on a mounting surface of a wiring board, the level of the pad electrode surface needs to be sufficiently high to prevent the top surface over the semiconductor mesa portion from contacting the wiring board.
配線基板の実装面に対して面発光半導体レーザをフリップチップ実装する場合、半導体メサ部の頂面が配線基板に接触することを防ぐ為、パッド電極表面のレベルを十分に高くする必要がある。

In one example, the level of the pad electrode surface is equal to or higher than the level of the semiconductor mesa portion.
一例では、パッド電極表面のレベルは半導体メサ部のレベルと同等またはそれより高い。

In this case, a sub-mesa is provided above the substrate, and the pad electrode is provided above the sub-mesa. A bump such as a solder is provided on the pad electrode.
その場合、基板上に副メサ部が設けられ、パッド電極はその副メサ部上に配置される。パッド電極上には半田等のバンプが設けられる。

管、チューブ

US2023371795(UNIV VANDERBILT [US])
[0069] As shown in FIGS. 4 A- 4 C, the sheath 50 includes an inner tube 56 and an outer tube 58 , which are connected to each other (e.g., via welding or adhesive bonding) at the tip 60 of the sheath 50 .
【００５３】
  図４Ａ—４Ｃに示すように、シース５０は、シース５０の先端６０において互いに接続された内管５６及び外管５８を有する。

According to one example configuration, the tubes 56 , 58 can be constructed of a shape memory alloy, such as a nickel-titanium alloy (“nitinol”).
一例として、管５６、管５８は、ニッケルチタン合金（「ニチノール」）等の形状記憶合金から構成されていてもよい。

Nitinol allows for an extremely thin-walled construction of the tubes 56 , 58 , while the shape memory properties of the material causes the tubes to return to their pre-configured state once bending forces are removed.
ニチノールは、管５６、５８の肉厚を薄くした構造となっており、材料の形状記憶特性により、曲げ力が一旦除去されるとその予備構造状態に戻る。

Other materials, such as surgical stainless steels or plastics/polymers, can also be used to construct the sheath 50 .
シース５０の構築には、例えば、外科用ステンレス鋼やプラスチック・ポリマー等の他の材料が用いられてもよい。

According to another example configuration, the tubes 56 , 58 can be formed from laser-cut hypodermic tubes or “hypotubes.”
他の構成例によれば、管５６、５８は、レーザ切断された皮下注射管又は「ハイポチューブ」によって形成されてもよい。

//////////////

[0075] When the actuation force is applied to the sheath 50 , the relative axial force acts at the tip 60 where the tubes 56 , 58 are interconnected.
【００５９】
  シース５０に作動力が作用すると、管５６及び５８が接続する先端部６０には、相対軸方向力が作用する。

The actuation force is transmitted to the tip 60 via the splines 64 , 66 and is therefore applied asymmetrically, i.e., offset from the sheath axis S.
この作動力は、スプライン６４、６６を介して先端部６０に伝達され、シース軸線Ｓから外れて非対称に作用する。

As a result, the tip portion 52 bends inward toward the axis S along the spine of the “pushing” tube.
これにより、先端部５２は、管の山部に沿って軸線Ｓ方向へ内向きに湾曲する。

In FIG. 4 B, the outer tube 58 is the pushing tube and the inner tube 56 is the pulling tube, so the end portion 52 bends along the outer tube spline 66 —to the right as shown in FIG. 4 B.
図４Ｂにおいて、外管５８が押圧チューブであり、内管５６が引っ張りチューブであるため、端部５２は、図４Ｂに示すように、外管スプライン６６に沿って右に湾曲する。

In FIG. 4 C, the outer tube 58 is the pulling tube and the inner tube 56 is the pushing tube, so the end portion 52 bends along the inner tube spline 64 —to the left as shown in FIG. 4 C.
図４Ｃにおいて、外管５８が引っ張りチューブであり、内管５６が押圧チューブであるため、端部５２は、図４Ｃに示すように、内管スプライン６４に沿って左に湾曲する。

US11642498(BIOFLOW INC [US])
[0116] Aspects of this invention provide various unique features for a catheter assembly.
【００８４】
  本発明の態様は、カテーテルアセンブリのための様々な固有の特徴を提供する。

The catheter assembly may include a disposable film or isolating medium travelling from the outer diameter, inverting into the inner diameter (or inner lumen) of the catheter and travelling outside of the proximal hub of the catheter (and outside the patient).
カテーテルアセンブリは、外径面から移動し、カテーテルの内径面（または内側ルーメン）へと反転し、カテーテルの近位ハブの外側（および患者の対外）へと移動する、使い捨てフィルムまたは隔離媒体を含み得る。

This provides a mechanical anti-occlusion mechanism that insulates or isolates the catheter from the environment the catheter is placed in.
これは、カテーテルが留置される環境からカテーテルを保護または隔離する機械的な閉塞防止機構を形成する。

The isolating medium may be removed and simultaneously replaced by isolating medium in the film reservoir.
隔離媒体は除去され、同時にフィルムリザーバ内の隔離媒体によって置換され得る。

The reservoir may contain a disposable film or isolating medium. Additionally, the catheter assembly may include a locking mechanism between the inner tube component and the outer tube component and connected at the proximal hub.
リザーバは、使い捨てフィルムまたは隔離媒体を収容し得る。加えて、カテーテルアセンブリは、内管部材と外管部材との間にあり、近位ハブで接続される係止機構を含み得る。

Generally, catheters are not double-tubed or tube-in-a-tube and if they are, catheters are not joined at the proximal end as described and detailed.
一般に、カテーテルは、二重管またはチューブインチューブ式ではないが、その形である場合、カテーテルは、記載され詳述されているように、近位端で接合されない。

Whether the locking mechanism is a lock and key mechanism or screwed into be secured, the outer tube component and the inner tube component must be connected at the proximal hub.
係止機構がロックアンドキー機構であるか、またはねじ込まれて固定されるかに関係なく、外管部材および内管部材は、近位ハブにおいて接続されなければならない。