冷熱衝撃試験

US2005148721(GEN ELECTRIC [US])
[0081] Reliability Testing.
  信頼性試験

In addition to "as assembled" thermal resistance and adhesion strength measurements, the compositions of Examples 1 and 3 were used to make TIMs which were subjected to accelerated reliability testing to determine their ability to survive high stress environments.
 「接合直後」の熱抵抗及び接着強さの測定に加えて、例１と例３の組成物を用いてＴＩＭを製造し、促進信頼性試験を行って高応力環境での保持性能を測定した。

The two reliability testing methods were Air-to-Air Thermal Shock and Temperature/Humidity Exposure.
２つの信頼性試験法は冷熱衝撃試験及び温度／湿度曝露試験であった。

US2022216563(ASAHI CHEMICAL IND [JP])
—Heat Cycle Test—
【０１１２】
－ヒートサイクル試験－

A wiring component of each of the examples and comparative examples was allowed to stand in an environment of 23° C. and 50% RH for 7 days or longer.
各実施例及び比較例の配線部品を７日以上２３℃５０％ＲＨの環境に静置した。

After being allowed to stand, a thermal shock resistance test was conducted for 500 cycles using a thermal shock tester (DC2010S dew cycle tester (manufactured by Kusumoto Chemicals, Ltd.)). In the test, each cycle included heating at 120° C. for 30 minutes, lowering the temperature to −10° C. and maintaining the temperature to −10° C. for 30 minutes, and then raising the temperature to 120° C.
静置後、冷熱衝撃試験機（結露サイクル試験機  ＤＣ２０１０Ｓ（楠本化成製））を用いて１２０℃にて３０分加熱、－１０℃に降温して３０分冷却、さらに１２０℃に昇温する過程を１サイクルとする耐ヒートショック試験を５００サイクル実施し、被覆部材の割れや位置ずれの有無を目視にて観察した。

The evaluation was made according to the following criteria: Good (superior) when no crack or displacement was observed, No good (inferior) when a crack and/or displacement were observed.
そして、割れおよび位置ずれの発生がない場合を○（良好）とし、割れ及び／または位置ずれが見られた場合を×（不良）として評価した。

US2022106486(DAINIPPON INK & CHEMICALS [JP])
(Measurement of Thermal Shock Properties of the Molded Body)
【００７１】
（成形体の耐冷熱衝撃性の測定）

The obtained test specimen was introduced into a thermal shock test apparatus (“TSA-103EL”, manufactured by ESPEC Corp.), and subjected to thermal cycle of −40° C./30 minutes→150° C./30 minutes (1 cycle: 1 hour).
 得られた試験片を、冷熱衝撃試験装置（エスペック株式会社「ＴＳＡ－１０３ＥＬ」）内に導入して、－４０℃／３０分→１５０℃／３０分のヒートサイクルを行った（１サイクル１時間）。

After each thermal cycle, the appearance of the molded body was observed, and the number of thermal cycles before a crack was formed was measured, and an average of 5 measurements was determined.
各ヒートサイクル後に成形体の外観を観察し、クラックが発生するまでのヒートサイクル回数を測定し、５回測定の平均値を求めた。

US2021347130(DAINIPPON INK & CHEMICALS [JP])
Metal-resin composites each including a metal member and a resin member which are joined together are used in a wide range of fields such as the automobile industry, the electronic device industry, etc.
金属部材と樹脂部材とが接合された金属樹脂複合体は、自動車業界、電子機器業界など幅広い分野で使用されている。

Examples of a general technique for joining together a metal member and a resin member include a technique using a fixing member such as a screw, a claw, or the like, and a technique using an adhesive,
金属部材と樹脂部材とを接合する技術としては、例えばネジや爪などの固定部材を用いる技術や、接着剤を用いる技術が一般的である

but these techniques have a problem of causing unsatisfactory joining strength or causing unsatisfactory hot-cold shock resistance.
が、これらの技術では接合強度が十分でない、あるいは耐冷熱衝撃性が不十分であるなどの問題があった。

There is also a technique for joining a metal member and a resin member together by inserting in advance the metal member into a mold with a predetermined shape and then injecting a melt of the resin member into the mold.
また、金属部材を予め所定形状の金型に挿入した後、金型内に樹脂部材の溶融物を射出して、金属部材と樹脂部材とを接合する技術もある

However, this technique has a problem that the metal member cannot be joined to the existing resin member or that joining strength is unsatisfactory.
が、既存の樹脂部材に対して金属部材を接合できない、あるいは接合強度が十分でないなどの問題があった。

US2021246284(ZEON CORP [JP])
[0005] For example, PTL 1 discloses a technique for forming a printed circuit board using a crystalline thermoplastic alicyclic structure-containing resin as a board material.
例えば、特許文献１では、基板材料として、結晶性の熱可塑性脂環式構造含有樹脂を用いて、プリント配線基板を形成する技術が開示されている。

The printed circuit board obtained in accordance with the teachings of PTL 1 is excellent in the balance between heat shock test resistance and transmission characteristics and can be used particularly suitably for transmission of high-frequency signals.
特許文献１に従って得られたプリント配線基板は、冷熱衝撃試験耐性及び伝送特性のバランスに優れており、高周波信号の伝送用に特に好適に用いることができる。

 

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熱衝撃試験：thermal shock test (半導体用語集、SEMI-NET）

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