和英特許翻訳メモ

便利そうな表現、疑問、謎、その他メモ書き。思いつきで書いてます。
拾った用例は必ずしも典型例、模範例ではありません。

に入力する

2023-03-23 15:39:50 | 英語特許散策

US10403268(INTEL IP CORP [US])
[0026] The posterior probabilities can be computed based on the frame terms (or frame values). Thus, the probabilities of each acoustic model state at the output of an acoustic model given a single frame term can be computed for each frame term in an utterance using acoustic model activation values at the output acoustic model states. Each frame term is inputted into(*に入力する)an acoustic model separately so that multiple acoustic model activation states are formed for each frame term. 

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[0034] The acoustic score unit 310 uses an acoustic model where the input frame value is input to(*に入力する)the model one at a time. The acoustic model has one or more output acoustic model states, and activation values are determined for each of the states in order to compute acoustic scores for phonemes. Specifically, the DNN is trained so that the output layer node corresponding to a given phoneme HMM state is more activated when an input speech frame known to be that phoneme HMM state (from labeled training data) is input into the DNN. The most active node of the output layer is the classification of that frame, and the distribution over all the nodes of the output layer gives (or can be turned into) the probability distribution of the states/classes for that frame. The activations of these DNN output layer nodes vary based on the input speech frame given as input to(*への入力)the DNN at the acoustic model. The acoustic score unit 310 then provides these acoustic scores in the form of activation values to the decoder 312 .

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[0039] The posterior confidence score unit 322 also may have a posterior probability unit 326 that reads the phoneme order, and in turn, frame term order, of an utterance sequence being processed at the decoder, and then computes a posterior probability using a log of a softmax normalization equation by one example. This may include using the activation values for each output acoustic model state in an acoustic model each time a frame term is inputted to the acoustic model.

/////////

[0086] Process 800 may include “receive frame values of frame terms” 802 . As mentioned above, this may include receiving frame values that were input into an acoustic model used to provide phonemes with acoustic scores. The frame values each correspond to a frame term of a single frame as described above.

US9137084(INTEL CORP [US])
[0024] FIG. 1 depicts a functional block diagram of a segmented Digital-to-Time Converter (DTC) 100 according to the subject matter disclosed herein that can be used as part of a Digital Polar Transmitter (DPTX) architecture. DTC 100 includes a coarse-delay generating segment 101 and a fine-delay generating or segment 102 . Coarse-delay segment 101 comprises a Tapped Delay Line (TDL) 105 , and an Even/Odd Phase Multiplexer (E/O MUX) 107 . Fine-delay segment 102 comprises a digitally controlled edge interpolator (DCEI) 108 . A local oscillator (LO) 103 outputs an LO signal 104 that is input to TDL 105 . A phase-modulation input value that is to be modulated onto LO signal 104 is input to a control logic 106 . Control logic 106 processes and separates the phase modulation input value into a group of coarse delay/phase control bits and a group of fine delay/phase control bits. The coarse delay/phase control bits are input to E/O MUX 107 and control the specific even or odd phase signals that are respectively output from the Even Phase Output and from the Odd Phase Output. The Even and Odd Phase Outputs are respectively input to the IN 1 and IN 2 inputs of DCEI 108 . The fine delay/phase control bits output from control logic 106 are input to DCEI 108 and control the interpolation between even and odd phases input to IN 1 and IN 2 of the fine delay/phase output signal OUT.

US9542561(INTEL CORP [US])
[0006] These SHA2 hash algorithms allow computing a message digest representing a condensed representation of input data referred to as a message. When a message with a length less than 2^64 bits (for SHA-224 and SHA-256) or less than 2^128 bits (for SHA-384 and SHA-512) is input to the hash algorithm, a result called a message digest is output. The message digest is also sometimes referred to as a digest or a hash. The message digest is 224-bits for SHA-224, 256-bits for SHA-256, 384-bits for SHA-384, or 512-bits for SHA-512. SHA-224 and SHA-256 are based on a 32-bit word length. SHA-384 and SHA-512 are based on a 64-bit word length.

US2018068653(INTEL IP CORP [US])
[0039] The posterior confidence score unit 322 also may have a posterior probability unit 326 that reads the phoneme order, and in turn, frame term order, of an utterance sequence being processed at the decoder, and then computes a posterior probability using a log of a softmax normalization equation by one example. This may include using the activation values for each output acoustic model state in an acoustic model each time a frame term is inputted to the acoustic model. 

US7570659(INTEL CORP [US])
[0030] In greater detail, again referring to FIG. 6, the serial data being outputted from the elastic buffer 620 is inputted to both the comma detector 630 and the register chain consisting of register- 0 , register- 1 , register- 2 , . . . , register-N. The outputs of the registers are fed to the multiplexer 660 whose output Data x is the skew corrected data output of the lane. The multiplexer selects the appropriate output based on the value of the lane tolerance counter. The output of register- 0 is the output of the elastic buffer after having been delayed by one clock period. Similarly, the output of register- 1 is the output of the elastic buffer after having been delayed by two clock periods and the output of register-N is the output of the elastic buffer after having been delayed by (N+1) clock periods.

US10664750(GOOGLE INC [US])
[0026] Furthermore, in some implementations in which the condition prediction model is used to provide predictions regarding the future occurrence of adverse conditions, the imagery that is input into such model to receive predictions can be accompanied by information sufficient to determine a time (e.g., date) at which each of such input images were captured. As one example, one or more images and one or more respective times at which such images were respectively captured can be input into the condition prediction model. Inclusion of input information regarding the time of capture of images can enable the condition prediction model to more accurately and precisely predict when a projected future occurrence of the adverse condition may likely occur. In some implementations, the time of capture information may simply indicate an amount of time that elapsed between each respective pair of sequential images in a time-sequence of imagery and an amount of time that has elapsed since the most recent of such images (e.g., rather than specifying a particular objective time or date of capture).

US9234246(GOOGLE INC [US])
[0033] In one embodiment, stage 305 comprises diode D2 , resistor R1 , zener diode Z2 (e.g., a 3 V zener diode), microprocessor 307 , resistor R2 , a switch S1 , a diode D3 , and a relay. The combination of the diode D2 , resistor R1 , and zener diode Z2 converts the 120 V AC into a digital signal that can be managed by the microprocessor 307 . In one embodiment, the combination of the diode D2 , resistor R1 , and zener diode Z2 outputs an oscillating voltage between 0V and 3 V. When the 120 V AC input voltage is above 3 V, diode D2 conducts and the zener diode Z2 holds the voltage at 3 V due to the 3 V voltage drop across the zener diode Z2 . When the 120 V AC input voltage is below 3V, the diode D2 stops conducting and 0 V is inputted into the microprocessor 307 . Thus, the combination of the diode D2 , resistor R1 , and zener diode Z2 converts the 120 V AC into a digital signal that alternates between a 0 V and 3 V in the form of a square wave.

US9116529(GOOGLE INC [US])
[0071] FIG. 6B is a schematic of high voltage low dropout voltage regulators used to provide bootstrap power and battery, according to some embodiments. The bootstrap LDO circuitry 680 , and battery LDO circuitry correspond to the bootstrap LDO 380 and battery LDO 382 in FIG. 3 respectively. Rectified input 624 is input to bootstrap circuit 680 . According to some embodiments, regulator 670 is low-dropout linear regulator such as the TPS79801 from Texas Instruments. The output power 690 is provided to the backplate at 3.0V. The bootstrap disable signal 680 can be used to disable the bootstrap power unit, as shown. The input 660 comes from VCC main, which can be, for example, from the rechargeable battery. According to some embodiments, the low dropout regulator 662 is a low quiescent current device designed for power-sensitive applications such as the TLV70030 from Texas Instruments.

US10848389(GOOGLE LLC [US])
[0065] The set of network connected devices each with an assigned device type and at least one or more device priority values is inputted to the device prioritization scheme function ( 404 ). For example, the input list for the above-mentioned example includes: medical device/high device priority value, appliance/low device priority value, and media device/medium device priority value. The device priority values can be rated on many different scaling systems including a rating of X out of Y (e.g., 3 out of 10), threshold levels (e.g., low/medium/high), or the like.

US8327282(GOOGLE INC [US])
[0030] To select one of the keys from the extended keyboard, the user may release the contact with the user interface at the location associated with the desired key. In the example, the extended key where the user releases the contact, as shown in screen 115 , is an “&” key. After the user releases the contact, the selected character is entered into the e-mail application, as shown in screen 120 .

US8930233(APPLE INC [US])
[0105] Continuing with the eBay example above, a user would like to be made aware of a rare antique table as soon as it becomes available in the eBay database. This disclosure, and the parent applications this is a continuation in part for, provide real time activation of data as soon as is entered into the deliverable content database, and real time delivery of the data to eligible receiving devices with the applicable configured situational location(s). 

US2020359204(APPLE INC [US])
[0113] In one embodiment, the parent device 710 and the child device 720 can exchange machine information data ( 727 ) via an authentication framework 730 on each device, as described above in FIG. 7A. Additionally, a prompt ( 712 ) for a username and password, or other credentials, can be displayed on the parent device 710 on behalf of the child device 720 . The username and password for the account to use on the child device 720 is entered on(*上で入力)the parent device 710 due to the ease of use of the parent device 710 for credential entry relative to the child device 720 

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接合電極

2023-03-23 10:21:38 | 英語特許散策

US10453592(MICROSOFT TECHNOLOGY LICENSING LLC [US])
At temperatures below Tc , niobium is superconductive; however, at temperatures above Tc , it behaves as a normal metal with electrical resistance.
Tc未満の温度では、ニオブは超電導であるが、Tcを超える温度では、ニオブは電気抵抗のある通常の金属としてふるまう。

In a superconductor-insulator-superconductor (SIS) type Josephson junction, the superconductor layers can be made from niobium and the insulator layer may be formed from aluminum oxide.
超電導体-絶縁体-超電導体(SIS)タイプのジョセフソン接合では、超電導体層はニオブから形成することができ、絶縁体層は酸化アルミニウムから形成することができる。

A supercurrent passes through the Joseph injunction as a function of the sign of the phase difference between the two junction electrodes.
超電流は、2つの接合電極の間の位相差の符号の関数としてジョセフ接合部を通過する。

US10608159(NORTHROP GRUMMAN SYSTEMS CORP [US])
[0030] The methodology accomplishes this by incorporating a hardmask process to eliminate exposure of the Josephson junction to resist strip processes and chemicals following junction definition.
【0011】
  方法は、これを、ハードマスクプロセスを組み入れて、接合の画定後にジョセフソン接合がレジスト剥離プロセスおよび化学薬品に晒されることを排除することによって達成する。

Additionally, a plasma passivation is incorporated of the junction material stack immediately following the junction etch process without exposure to the ambient environment.
さらに、プラズマパッシベーションは、周囲環境への露出なしに接合エッチングプロセスの直後に接合材料スタックに組み込まれる。

Furthermore, diffusion barriers are incorporated within the junction electrodes to prevent migration of oxygen within the junction metallization.
さらに、拡散バリアが接合電極内に組み込まれて、接合メタライゼーション内の酸素の移動を防止する。

US8789493(LAM RES CORP [US])
[0051] During plasma processing, the elastomer bonded electrodes are able to sustain high operation temperatures, high power densities, and long RF hours.
【0035】
  プラズマ処理の間、エラストマー接合電極は、高い動作温度、高い出力密度、および長いRF時間に耐えることが可能である。

Accordingly, etch tools with a showerhead or electrode assembly 110 as described herein have been widely used in semiconductor wafer etch processes.
したがって、本明細書に記載のシャワーヘッドまたは電極アセンブリ110を備えたエッチングツールは、半導体ウェハエッチング工程において広く使用されてきている。

The widely successful uses of this kind of electrodes are largely due to such electrodes having electrical conductivity and high thermal conductivity.
この種の電極の使用が広く成功してきたのは、主に、かかる電極が、電気伝導率および高い熱伝導率を有するためである。

More specifically, the high conductivities are largely due to the use of Al particles (which appear as microscopic Al balls) as filler in the elastomeric bonding material 160 (the filler is typically a powdery material made of Al alloy),
より具体的には、こうした高い伝導率は、主にAl粒子(微視的なAlボールとして見られる)をエラストマー接合材料160のフィラーとして使用することによるものであり(フィラーは、典型的にはAl合金製の粉末材料である)、

which is commonly called Al powder or Al ball. 
このAl粒子は、一般にAl粉末またはAlボールと呼ばれている。

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との接合面

2023-03-23 10:03:23 | 英語特許散策

US11121336(UNIV MICHIGAN REGENTS [US])
[0041] As used and depicted herein, a “layer” refers to a member or component of a photosensitive device whose primary dimension is X-Y, i.e., along its length and width.
【0034】
  本願で使用され、説明される「層」は、主な次元がX-Yである(すなわち、自身の長さおよび幅に沿う)感光性デバイスの要素または構成要素を意味する。

It should be understood that the term layer is not necessarily limited to single layers or sheets of materials.
層の用語は、単層または材料のシートに必ずしも限定されないことを理解されたい。

In addition, it should be understood that the surfaces of certain layers, including the interface(s) of such layers with other material(s) or layers(s), may be imperfect,
さらに、他の材料または層と、そのような層との接合面を含む、ある層の表面は、不完全であってもよく、

wherein said surfaces represent an interpenetrating, entangled or convoluted network with other material(s) or layer(s). 
ここで、当該表面は、他の材料または層と浸透したり、混在されたり、入り組んだりするネットワークを示すことを理解されたい。

EP4054944(TAK LOGIC LLC [US])
 This subsequent adhesive increase may also be due to the viscoelastomeric properties of the overlay 3,
この後続する粘着力増加は、さらに、オーバーレイ層3の粘弾性にも起因するかもしれず、

which due to adhesive cradling of an adhered item 13,
その粘弾性は、粘着されたアイテム13をオーバーレイ層3が粘着状態でクレイドリングすること(cradling、オーバーレイ層3が、アイテム13と接触する部分において局部的に凹部化して、そのアイテム13がオーバーレイ層3内に埋没し、その状態でアイテム13が保持されること、など)に起因して、

will provide added interfacing surface contacting area with the adhered item 13,
オーバーレイ層3の接合面(interfacing surface、基体5との接合面、基体5との間の界面)のうち、それに粘着されたアイテム13との接触面積が増加し、

resulting in an increase and subsequent stabilization of the adhesive attraction therebetween.
その結果、両者間の粘着力による引力の増加と、後続する安定化とが生じる。

US2021085462(HALF MOON MEDICAL INC [US])
[0058] The coaptation member includes a frame 501 and a covering 503 similar to the coaptation members 104 - 404 described above.
【0049】
  接合部材は、上述の接合部材104~404に類似したフレーム501を及び覆い503を有する。

In some embodiments, the surface of the inner portion 512 of the coaptation member 504 (or a portion thereof) can initially function as a coaptation surface.
幾つかの実施形態では、接合部材504(又はその一部分)の内方部分512の表面は、当初、接合面として機能するのが良い。

For example, the lateral portions of the inner surface 512 may serve as a coaptation surface with the leaflet engaged at a central portion via the second clip mechanism 516 b ,
例えば、内面512の外方部分は、第2のクリップ機構体516bを介して中央部分のところに係合した尖との接合面としての役目を果たすことができ

or the entire inner surface 512 can serve as a coaptation surface (without the secondary clip mechanism 516 b ). 
又は内面512全体は、接合面(二次クリップ機構体516bなしで)としての役目を果たすことができる。

US2021386523(3M INNOVATIVE PROPERTIES CO [US])
Note that use of a filled adhesive is not critical due to the close conformity of the bonding surfaces with the custom pad in apparatuses 100 of the present disclosure;
本開示の装置100のカスタムパッドとの接合面密接な適合により、充填型接着剤の使用は必須ではなく、

unfilled or lightly filled (e.g., less than 10 wt. % filler) may be used.
未充填型又は低充填型(例えば、10重量%未満の充填剤)を使用してもよいことに留意されたい。

The apparatus 100 is then placed on the patient's teeth, and the adhesive is allowed to cure. 
次いで、装置100を患者の歯に配置し、接着剤を硬化させることが可能になる。

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四周

2023-03-23 09:10:38 | 英語特許散策

US2022145624(PANASONIC IP MAN CO LTD [JP])
[0037] The panel body 10 is constituted such that an end face layer is provided on side end faces of four peripheries of the base member 11 .
また、パネル本体10は、基材11の四周の側端面に端面層を設けた構成とされている。

The end face layer can be constituted in the same manner as the surface layer 12 .
この端面層は、表面層12と同様の構成とされたものでもよい。

The end face layer can be successively formed from the surface layer 12 or can be separately formed in the shape of an edge sheet.
また、この端面層は、表面層12から一連状に設けられたものでもよく、エッジシート状に別途に設けられたものでもよい。

US2022140430(HONDA MOTOR CO LTD [JP])
Moreover, since the end plate is fastened to the battery case by three faces among the four peripheral end faces a , a , b , and b ,
しかも、エンドプレート6は、四周の端面4a、4a、4b、4bのうちの三面でバッテリケース5に固定されるため、

the force resisting the counterforce from the battery cell 31 is strong, and thus, it is possible to suppress the counterforce of the battery cell 31 by the end plate and effectively hold the battery cell group .
バッテリセル31からの反力に抵抗する力が強く、エンドプレート6によってバッテリセル31の反力を抑えて、バッテリセル群3を効果的に保持することができる。

US2016353609(KOMATSU MFG CO LTD [JP])
[0035] The casing 11 has a bottom 11 A provided with an annular outer partition 21 extending along four peripheral edges (sometimes respectively referred to as first, second, third and fourth peripheral edges hereinafter) 11 B, 11 C, 11 D, 11 E of the bottom 11 A,
【0022】
  筐体11の底部11Aには、当該底部11Aの四周の片縁11B,11C,11D、11Eに沿った環状の外側仕切壁21と、

and an inner partition 22 (partitioning wall) extending approximately from a center of a part of the outer partition 21 along the second short-side edge 11 B toward the third short-side edge 11 D. 
外側仕切壁21のうち一方の短辺側片縁11Bに沿った部分の略中央から他方の短辺側片縁11Dに向けて延設された仕切壁としての内側仕切壁22とが設けられている。

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本ブログの「特許英語散策」等題した部分では、英語の例文を管理人の独断と偏見で収集し、適宜訳文・訳語を記載しています。 訳文等は原則として対応日本語公報をそのまま写したものです。私個人のコメント部分は(大抵)”*”を付しています。 訳語は多数の翻訳者の長年の努力の結晶ですが、誤訳、転記ミスもあると思いますのでご注意ください。