搭載面

US6051888
"FIG. 1 is an exploded view of the present invention showing a flip-chip package 10. Semiconductor device 12 is mounted on substrate 11 which is used to interconnect the various electrical connections 22 (FIG. 2) of semiconductor device 12 to a mounting surface（搭載面、実装面、取付面）, for example a printed wiring board."

US8629566
"Note that resistor 50 can be erected in tomb-stone fashion（墓石のように）(with its longest dimension perpendicular to the mounting surface（搭載面) as shown by dotted line 51 to reduce the area (or “foot print”（設置面積）) needed for the substrate 10."

US5399898
"In another embodiment, the first semiconductor die is a double-sided flip-chip die, the substrate has conductive pads disposed on a mounting surface（搭載面）thereof, and the first semiconductor die is mounted to（取付）the conductive pads on the substrate."