張り合わせる

WO2012125632(特表2014-512091)
"1. A method for preparing a silicon-on-insulator structure comprising a handle wafer, a silicon device layer, a dielectric layer between the handle wafer and the silicon device layer, the handle wafer having an axis, a radius, a front surface, a back surface, and a peripheral edge extending in the axial direction from the front surface to the back surface, wherein ...

bonding a donor wafer and the handle wafer（ドナーウエハおよび前記ハンドルウエハを張り合わせる）to form a bonded wafer wherein the donor wafer and handle wafer are separated along the axis by the dielectric layer, the dielectric layer forming a donor-dielectric interface between the donor wafer and dielectric layer and a handle-dielectric interface between the dielectric layer and front surface of the handle wafer, the bonded wafer comprising a bond interface located at the donor-dielectric interface, the handle-dielectric interface or in the dielectric layer between the two interfaces; and
removing a portion of the donor wafer from the bonded wafer such that a silicon layer remains bonded to the dielectric layer to form the silicon on insulator structure."

WO2009049265(特表2011-501821)
"29. An apparatus for laminating curved optical films, comprising: a curved drum operable to provide a curved surface for bonding（張り合わせる）first and second optical films; at least two feeders operable to feed the first and second optical films onto the curve drum; a coating apparatus operable to apply adhesive to a surface of the first or second optical film; and a press roller operable to apply pressure against the first and second optical films and laminate the first and second optical films."

US20090100872(特表2011-500498)
"(Ab)
A method for laminating（張り合わせる）glass, glass-ceramic, or ceramic layers. The method comprises providing a first layer of glass, glass-ceramic, or ceramic, wherein the glass, glass-ceramic, or ceramic of the first layer is electromagnetic radiation-sensitive or has an electromagnetic radiation susceptor disposed on it; stacking（積層する）a second layer of glass, glass-ceramic, or ceramic on the first layer; and irradiating the stack with electromagnetic radiation to laminate the first and second layers."

WO2006138626(特表2008-547210)（中村修二氏）
(Ab)
"An (Al, Ga, In)N and ZnO direct wafer bonded（直接ウェーハ・ボンディングされた）light emitting diode (LED), wherein light passes through electrically conductive ZnO. Flat and clean surfaces are prepared for both the (Al, Ga, In)N and ZnO wafers. A wafer bonding process is then performed between the (Al, Ga, In)N and ZnO wafers, wherein the (Al, Ga, In)N and ZnO wafers are joined together（張り合わせ）and then wafer bonded（ウェーハ・ボンディングを行う）in a nitrogen ambient（窒素雰囲気中で）under uniaxial pressure at a set temperature for a set duration. After the wafer bonding process, ZnO is shaped for increasing light extraction from inside of LED."

WO2006135642(特表2008-543371)
(Ab)
"A stapler for delivering a staple formed from a shape memory material is disclosed. The staple includes a first tine and a second tine connected by a bridge. The staple may be disposed within the stapler in an open position with the first tine distal of the second tine. The stapler is configured to sequentially deliver the first tine and the second tine, respectively, to opposing body tissues. The stapler includes an elongate shaft (e.g., a catheter) having a working lumen and a control mechanism for delivering the staple. A drive cable extends along the working lumen of the elongate shaft. Upon warming up to a temperature at or above a transformation temperature of the shape memory material, the staple may assume a closed position, thus drawing together（引っ張り合わせ）opposing body tissues and closing an incision."

WO2006113179(特表2008-538449)
(Ab)
"A self-supported thin film membrane of ceramic materials and related electrochemical cells and cell stacks. The membrane structure is divided into a plurality of self-supporting thin membrane regions by a network of thicker integrated support ribs. The membrane structure may be prepared by laminating（張り合わせ）a thin electrolyte layer with a thicker ceramic layer that forms a network of support ribs."

WO200183623(特表2003-531758)
"16. A reactive multilayer foil comprising a deformed and laminated stack（張り合わせた積層体）of alternating layers of materials that can exothermically react, the stack deformed by pressure into a sheet with the layers laminated（張り合わされ）by cold welding."

WO2005012615(特表2007-500626)
"14. A method for forming a trim cover comprising:
a. supplying a cloth
b; applying（設ける）a polyurethane dispersion as a backing layer to said cloth, wherein said polyurethane backing layer is applied and adhered to（張り合わせかつ接着）the cloth without the use of adhesives or flame lamination."