封入、封止

US5122818
"Molded plastic packages are widely used to house microelectronic devices, such as silicon based semiconductor integrated circuits. The molded plastic packages are characterized by low cost, ease of assembly and adequate protection of the device from water vapor and other sources of corrosion. Usually, the device is mounted on a centrally positioned die attach paddle. The electronic device is then electrically interconnected（相互接続）to the inner ends of a plurality of leads which approach（接近）the die attach paddle from at least one side and up to all four sides of the paddle. Electrical interconnection is typically by wire bonding or tape automated bonding. Following electrical interconnection, the centrally positioned die attach paddle, electronic device and inner portion of the leadframe are encapsulated（封入）in a molding resin by a process such as transfer molding. The resin forms a hard, relatively moisture impervious（耐湿性、通さない）shell protecting both the semiconductor device and the electrical connections."

US8053869
(Abstract)
"A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing（反対）backside surface (14). A dielectric molding resin（モールド樹脂）(26) at least partially encapsulates（封入、封止）the integrated circuit die and the plurality of electrically conductive leads (20) with the backside surface（裏面）(14) and the plurality of electrical contacts (24) being exposed on opposing sides of the package (10). Features（形状）(30) are formed into electrically inactive portions of the integrated circuit die (12) to seal（封止）moisture paths and relieve packaging stress. The features (30) are formed by forming a trough (54) partially through the backside (56) of the wafer (40) in alignment with（揃う、一致、合致）a saw street (48), the trough (54) having a first width; and forming a channel (62) extending from the trough (54) to the electrically active face (42) to thereby singulate（単体化）the integrated circuit device member, the channel (62) having a second width that is less than the first width."

"Molded plastic electronic packages provide environmental protection to integrated circuit devices. Packages such as the PQFP (plastic quad flat pack) and the PLCC (plastic leaded chip carrier) protect an encapsulated（封入）device from contaminants such as moisture and from mechanical shock.

One disadvantage with molded plastic packages is poor thermal dissipation（放熱）. During operation, the integrated circuit device generates heat that must be removed to maintain the operating integrity of the device. Some heat is dissipated（放熱）through the bonding wires and the lead frame, the remainder is absorbed into the molding resin. The molding resin is a poor thermal conductor so the device temperature increases. To prevent the device from overheating, the power provided to the device must be limited."

US6188130
"Molded plastic electronic packages provide environmental protection to integrated circuit devices. Packages such as the QFP (quad flat package) and PLCC (plastic-leaded chip carrier) protect an encapsulated device from contaminants such as moisture as well as from mechanical shock. One molded plastic package is illustrated in U.S. Pat. No. 4,707,724 to Suzuki et al. The package has a leadframe with a centrally positioned die attach pad. The semiconductor device is bonded to（接合）the pad and electrically interconnected（接続）to the inner ends of the leadframe. A polymer molding resin encapsulates（封入）the device, die attach pad and inner lead ends.

One disadvantage with molded plastic packages is poor thermal dissipation. During operation, the semiconductor device generates heat which must be removed to maintain the operating integrity of the device. While some heat is dissipated through the bonding wires and leadframe, the remainder is absorbed into the molding resin. The molding resin is a poor thermal conductor so the device temperature will increase unless the power provided to the device is limited.

Incorporating a heat spreader into the molded plastic package provides an enhanced path for thermal dissipation. As a result, more power may be provided to the semiconductor device without a resultant excessive increase in device temperature. The heat spreader, which is usually copper or aluminum, is embedded in the molding resin, usually below the die attach pad, reducing the amount of molding resin through which heat must pass to reach a surface of the package."

US7816186
"In lead frame based semiconductor packages, electrical signals are transmitted between at least one integrated circuit device (die) and external circuitry, such as a printed circuit board, by an electrically conductive（導電性）lead frame. The lead frame includes a number of leads, each having an inner lead end and an opposing（反対の）outer lead frame end. The inner lead ends are electrically interconnected to input/output (I/O) pads on the die and the outer lead ends provide terminals outside the package body for interconnection to external circuitry. When the outer lead end terminates at（終わる、終端）a sidewall of the package body, the package is known as a "no lead" package. If the outer leads extend beyond the package body perimeter（外周）, the package is referred to as "leaded." Examples of well known no-lead packages include quad flat no lead (QFN) packages which have four sets of leads disposed around the perimeter of the bottom of a square package body and dual flat no lead (DFN) packages which have two sets of lead disposed along opposite（反対）sides of the bottom of a package body."

"If a flat package bottom is desired, additional molding resin, or another dielectric, may be utilized to seal（封止）the cut areas."

US7148083
"Integrated circuitry chips are typically formed into packages, with the packages then being mounted or otherwise connected to other substrates and devices. Many different packaging methods and devices exist for integrated circuitry in the form of a semiconductor chip. One exemplary package mounts a semiconductor chip to another circuit substrate, for example a printed circuit board. The printed circuit board is typically fabricated to have a plurality of conductive traces formed thereon in desired patterns. An insulative layer referred to as a soldermask is then typically formed on the circuit substrate. Such layers are typically patterned to provide openings to locations on the circuit traces therebeneath（その下）. The soldermask typically prevents solder bridging（橋絡？）on the circuit side of the assembly. The semiconductor chip is typically mounted to the circuit substrate by being adhered to（接着）the soldermask with a die attach adhesive. Conductive wire or other bonding is then conducted to connect the circuitry of the chip with the circuitry of the substrate.

Thereafter, in one exemplary packaging process, an insulative encapsulant material（封入材）is provided to one side of the substrate over the semiconductor chip and soldermask. Such can be formed by a transfer molding process whereby（というプロセス）a mold having a void is placed against the circuit substrate and an encapsulant（封入材、剤）caused to flow therein. The mold is ultimately（最終的）removed and the encapsulant is allowed to cure."

"Traditionally, soldermask materials are used to cover all areas of a ball grid array substrate that are not specifically open to reveal some part of the underlying circuit. In the area of the perimeter of the mold body, the soldermask is typically used to protect the circuit traces from the clamping forces applied by the mold body and to form a level surface of the ball grid array substrate so that the mold body can form a good seal（封止状態）during encapsulation."