異物

WO2013172986(特表2015-517737）
タイトル：PREVENTING SHORTING（電気的短絡）OF ADJACENT DEVICES

"1. A method comprising: forming a plurality of fins (101-104) of a plurality of field-effect-transistors on a substrate (109); forming at least one barrier structure (162) between a first (102) and a second (103) fin（複数部材の初出時記載の単複問題；"fins"とはなってない。まあ、和英翻訳では省略しないでa first fin and a second fin、またはfirst and second finsとすれば良いワケだが）of said plurality of fins; and growing an epitaxial film (181-188) from said plurality of fins, said epitaxial film extending horizontally from sidewalls of at least said first and second fins and said barrier structure (162) preventing said first and second fins from contacting（接触）each other through said epitaxial film.

...

6. The method of claim 2, further comprising, before growing said epitaxial film: removing said sacrificial layer (FIG. 7C) thereby exposing said plurality of fins underneath thereof and said barrier structure; and pre-cleaning said plurality of fins to remove contaminants（混入物）and strange objects（異物）."

WO2008033994(特表2010-514648)
"2. The method of claim 1 , further comprising: after placing the source material and the seed holder with attached seed material in the reaction crucible and placing the reaction crucible in the sublimation system, and then evacuating the sublimation system to remove ambient air, gaseous impurities and extraneous solid particulates（異物固体粒子）; backfilling（再充填）the sublimation system using at least one（一つの；＊一種類の）inert gas; heating the sublimation system to a temperature facilitating（＊分詞の形容詞的用法；temperature that facilitates）SiC crystal growth; and reducing the pressure on the reaction crucible within the sublimation system to initiate SiC crystal growth."

WO0108163(特表2003-505876)
"2. A method as claimed in claim 1 wherein said Ti doped Si02 glass is inclusion free（混入異物を含まない）."

WO2015021287(特表2016-531440)
(Ab)
"A cleaning film designed to remove foreign matter（異物）and particulates from working surfaces（作業面）of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris（デブリ）collected on the cleaning wafer working surfaces is removed by the particle removal film（＊初出で定冠詞）allowing（＊filmに係る分詞の形容詞的用法か、全体に係る分詞構文か？）the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh（再生）the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process."

海馬

海馬…seahorse…horse…hippo…多数の馬が大学キャンパスに出現…hippocampus

　　　　凸
hippo   hippo   hippo
　  hippo   hippo   hippo
　       hippo   hippo    hippo

hippopotamus (hippo): horse of the river　河馬

hippophile　愛馬家

hippophagy　馬肉食の

hippodrome　馬術演技場