US9184346
"An approach describes a reflective electrode(反射電極)for a semiconductor light emitting device as including an ohmic contact layer formed of(形成)Ag or an Ag-alloy, which forms an ohmic contact with a p-type compound semiconductor layer."
WO2013116623
"A solid state light sheet (10) and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips(LEDのベアチップ)have top and bottom(上部および下部)electrodes, where the bottom electrode is a large reflective electrode(反射電極). The bottom electrodes of an array of LEDs (e.g., greater than 1,000 LEDs) (12) are bonded to(接合)an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over(上に積層)the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets (10) may be formed to emit light from opposite(対向)surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor."
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