That is the several billion $$ question, and there are several waysto do this. 1) turbo boost the top core for best single core performance, andthen have TONS of smaller cores throughout the rest of the chip. Soinstead of having architecture akin to what we are use to with 2-8traditional cores which can each do anything, we would seesomething more like the Cell processor with 1 'command' core,followed by a bunch of either specialized cores, or even morehomogeneous cores that are more similar to an ARM architecture. 2) You can have a fair amount of physical distance between layers,and still have an advantage over a flat chip for signal processing.Thermal pipes or vents could still be crammed between layers forheat dissipation.
Joytech22 mentioned the idea of changing the heatsink contact from the top only, to being on the top and edges. Iwould submit an idea of putting the pin-outs on the edges andhaving heat spreaders on what has traditionally been the top andbottom. 3) Engineers ultimately need lithography and design tools thatallow them to get away from 2D chip design. The real advantage to3D chips is not in layering cores on top of each other, but makingeach core a 3D structure so that the inputs and outputs ofindividual processing 'routes' are closer together, and then makingthe physical distance of these 'routes' shorter.
Less distance,means less resistance, means lower voltage, means less amperage,means less heat. These also mean less latency and faster processingtime for instructions (and also less material used). However, thisis still in the science fiction realm as the tools to do it are notreally available yet, but this is the direction we will have totake in time. 4) The material we are using for chips today (silicon) is not thebest at heat dispersal, it was merely readily available at thetime, and we have a whole eco system built around it which helpskeep the cost down. Moving to other materials (graphene,molybdenite, even diamond) will go a long way towards better heatdispersal. T8 Led Tube Light
Silicone is a heat insulator. Moving to something thatconducts heat without a large amount of electricity would allow formuch better cooling. Even more interesting is the idea of havingthe chip made out of a conductive material, and then insulating theroutes. IBM has already done this with a copper processor ~20 yearsago. China Led Stage Lights
It was just a research project to see if it could be done, butwas not seriously pursued because it was not practical. Still, itis just one of many ideas of how to make 'cooler' chips that couldbe stacked. 5) Stacking everything in layers is not necessarily the bestdesign. In a 3D space where heat is of concern a better approachmay be more of a radial hub and spoke aproach, or constructing achip with a backplane and fins like we do in our computer with amotherboard and daughter cards (a backplane controller andconnector interface with specialty processors at right angles toit). China Led Swimming Pool Lights
Imagine the control unit (with integrated northbridge andcache... because lets face it, the north-bridge is going todisappear soon) on the back-plane, and then having processing coresperpendicular to it, or radiating outwards from it. 6) moving away from electrical processors and moving towards lightbased processing. Very cool, less heat, less power, and superawesome (aka, I have no idea how it works ) anywho, sorry for rambling. This is something I have dreamed aboutsense I was a kid, and it is super exciting to see it start to comeinto reality! It will be very interesting to see what comes out ofthe market to solve these interesting space and heat issues.
Soexciting!
Joytech22 mentioned the idea of changing the heatsink contact from the top only, to being on the top and edges. Iwould submit an idea of putting the pin-outs on the edges andhaving heat spreaders on what has traditionally been the top andbottom. 3) Engineers ultimately need lithography and design tools thatallow them to get away from 2D chip design. The real advantage to3D chips is not in layering cores on top of each other, but makingeach core a 3D structure so that the inputs and outputs ofindividual processing 'routes' are closer together, and then makingthe physical distance of these 'routes' shorter.
Less distance,means less resistance, means lower voltage, means less amperage,means less heat. These also mean less latency and faster processingtime for instructions (and also less material used). However, thisis still in the science fiction realm as the tools to do it are notreally available yet, but this is the direction we will have totake in time. 4) The material we are using for chips today (silicon) is not thebest at heat dispersal, it was merely readily available at thetime, and we have a whole eco system built around it which helpskeep the cost down. Moving to other materials (graphene,molybdenite, even diamond) will go a long way towards better heatdispersal. T8 Led Tube Light
Silicone is a heat insulator. Moving to something thatconducts heat without a large amount of electricity would allow formuch better cooling. Even more interesting is the idea of havingthe chip made out of a conductive material, and then insulating theroutes. IBM has already done this with a copper processor ~20 yearsago. China Led Stage Lights
It was just a research project to see if it could be done, butwas not seriously pursued because it was not practical. Still, itis just one of many ideas of how to make 'cooler' chips that couldbe stacked. 5) Stacking everything in layers is not necessarily the bestdesign. In a 3D space where heat is of concern a better approachmay be more of a radial hub and spoke aproach, or constructing achip with a backplane and fins like we do in our computer with amotherboard and daughter cards (a backplane controller andconnector interface with specialty processors at right angles toit). China Led Swimming Pool Lights
Imagine the control unit (with integrated northbridge andcache... because lets face it, the north-bridge is going todisappear soon) on the back-plane, and then having processing coresperpendicular to it, or radiating outwards from it. 6) moving away from electrical processors and moving towards lightbased processing. Very cool, less heat, less power, and superawesome (aka, I have no idea how it works ) anywho, sorry for rambling. This is something I have dreamed aboutsense I was a kid, and it is super exciting to see it start to comeinto reality! It will be very interesting to see what comes out ofthe market to solve these interesting space and heat issues.
Soexciting!