IBM Labs: 10 Chip Breakthroughs in 10 Years

"Made in IBM Labs: 10 Chip Breakthroughs in 10 Years", 03 May 2007
　http://www.ibm.com/press/us/en/pressrelease/21474.wss

1. Copper (September 1997)
2. SOI (August 1998)
3. Strained Silicon (June 2001)
4. Dual-Core Microprocessors (October 2001)
5. Immersion Lithography (December 2004)
6. Frozen SiGe Chip (June 2006)
7. High-k (January 2007)
8. eDRAM (February 2007)
9. 3-D Chip Stacking (April 2007)
10. Airgap (May 2007)

写真：http://www.ibm.com/press/us/en/photo/21476.wss
Copper (September 1997) 以外はプレスリリースへのリンクがあります。

最新プレスリリース：Airgap (May 2007)、これはスゴイかも！
"IBM Brings Nature to Computer Chip Manufacturing", 03 May 2007
　http://www.ibm.com/press/us/en/pressrelease/21473.wss
"today announced the first-ever application of a breakthrough self-assembling nanotechnology to conventional chip manufacturing, borrowing a process from nature to build the next generation computer chips."

"The natural pattern-creating process that forms seashells, snowflakes, and enamel on teeth has been harnessed by IBM to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip."

"The self-assembly process already has been integrated with IBM's state-of-the-art manufacturing line in East Fishkill, New York and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies."

The Secret of Self Assembly
"The secret of IBM's breakthrough lies in how the IBM scientists’ moved the self-assembly process from the laboratory to a production manufacturing environment in a way that can potentially yield millions of chips with consistent, high performance results."

"The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead IBM scientists discovered the right mix of compounds, which they pour onto a silicon wafer with the wired chip patterns, then bake it."


Using Self Assembly to Create Airgap Microprocessors, Press kits (Video: 5本等)
　http://www.ibm.com/press/us/en/presskit/21463.wss
IBM Airgap Microprocessor, Date added: 03 May 2007
"IBM Airgap Microprocessor -- IBM has created experimental versions of its latest POWER6 microprocessor using self-assembly techniques to create a vacuum between the miles of on-chip wiring."


ついでに、
"More Details Emerge on IBM's Upcoming Power6 Server Launch", April 30, 2007, The Four Hundred
　http://www.itjungle.com/tfh/tfh043007-story02.html