Common Materials for Bonding Sputtering Targets
1. Indium bonding: indium is the commonest and most cost-effective bonding material for brittle sputtering targets. The melting point of Indium is as high as 156.6°C, and thus the operating temperature should not exceed 156 ℃.
2. Silver filled Epoxy: Silver filled epoxy has a higher melting point than that of indium. Thus Silver filled epoxy will resist higher temperature. However, its high hardness might result in the breaking of targets. additionally, the price of Silver is much higher.
Backing Plate Materials
1. Oxygen Free Copper: Oxygen Free Copper (OFHC) is the commonest backing plate material. It has excellent electrical and thermal conductivity properties and is easy to machine.
2. Molybdenum Plate: Mo plates are usually used when copper plates aren't appropriate for the application. For instance, once a high-temperature bond is needed, Copper might oxidize or warp. At this time, the molybdenum plate is applied.
Cleaning
1. Metal Targets: Metal targets are often polished by alcohol and asepsis materials. Pre-sputtering is suggested at the start of the method.
2. Nonmetal Targets: Nonmetal targets are often polished by non-impregnated scotch bright and asepsis materials. Pre-sputtering is suggested at the start of the method.
Storage
1. It is not recommended to store the sputtering targets in a vacuum.
2. Don’t touch the targets with ungloved hands. Always handle targets using protective gloves.
Please visit our website for more information.
1. Indium bonding: indium is the commonest and most cost-effective bonding material for brittle sputtering targets. The melting point of Indium is as high as 156.6°C, and thus the operating temperature should not exceed 156 ℃.
2. Silver filled Epoxy: Silver filled epoxy has a higher melting point than that of indium. Thus Silver filled epoxy will resist higher temperature. However, its high hardness might result in the breaking of targets. additionally, the price of Silver is much higher.
Backing Plate Materials
1. Oxygen Free Copper: Oxygen Free Copper (OFHC) is the commonest backing plate material. It has excellent electrical and thermal conductivity properties and is easy to machine.
2. Molybdenum Plate: Mo plates are usually used when copper plates aren't appropriate for the application. For instance, once a high-temperature bond is needed, Copper might oxidize or warp. At this time, the molybdenum plate is applied.
Cleaning
1. Metal Targets: Metal targets are often polished by alcohol and asepsis materials. Pre-sputtering is suggested at the start of the method.
2. Nonmetal Targets: Nonmetal targets are often polished by non-impregnated scotch bright and asepsis materials. Pre-sputtering is suggested at the start of the method.
Storage
1. It is not recommended to store the sputtering targets in a vacuum.
2. Don’t touch the targets with ungloved hands. Always handle targets using protective gloves.
Please visit our website for more information.
