WO2016003741
"14. The method of claim 1, wherein removing the remaining non-implanted regions of the silicon layer with the selective etch process comprises using a hydroxide-based（水酸化物を主成分とする）wet etchant, the method further comprising using the selective etch process to texturize portions of the substrate exposed upon removing the remaining non-implanted regions of the silicon layer."
WO2007082299
"3. The composition of claim 1 wherein the composition is a nanoparticle based（ナノ粒子を主成分とする）lubricant."
WO2010141130
"26. The system of claim 17, wherein the substrate is a fiber tow having a sizing and an iron based（サイジング剤及び鉄を主成分とする）catalyst thereon."
WO2008033113
"39. The fuel cell according to claim 28, wherein the electrically conductive support is carbon-based（炭素を主成分とする）."
WO02083595
"12. The thermal protection system of claim 10, wherein the charred substrate is impregnated with a silicon based ablative（シリコンを主成分とする融除のできる）resin and cured."
US2003012939
"6. The article of claim 5 in which the matrix is ceramic based on alumina（アルミナを主成分とするセラミック）."
US2013280621; JP
"5. The method according to claim 4, wherein
the negative electrode comprises a negative electrode active material portion comprising the negative electrode active material as the primary component（主成分とする）, and
the non-aqueous electrolyte solution is placed in the container such that the BF3-cyclic ether complex is contained in the electrolyte solution in an amount greater than 0 mg/cm<2>, but 0.1 mg/cm<2 >or less of the external surface area of the negative electrode active material portion."
US2003043373
"8. The spectrometer of claim 1, further including a collimator positioned to receive and collimate the infrared beam projected from the source（光源から照射）."
US2008169589
"1. A solid imaging apparatus（立体造形装置）for creating a build（造形品）layer-by-layer（一層ずつ）, said apparatus comprising:
a) an image plane assembly（集成造形面）comprising a rigid surface transparent to solid imaging radiation（立体造形光）;
b) a build platform（造形プラットフォーム）located adjacent to said rigid transparent surface on one side thereof for receiving a build pad and supporting a build thereon, said build platform elevatingly disposed（上下可能な態様で配置）with respect to said rigid transparent surface;
c) at least one source of solid imaging radiation for illuminating said rigid transparent surface opposite said build platform;
d) an elevator for moving said build platform with respect to said rigid transparent surface;
e) a cartridge comprising:
(i) a cartridge housing;
(ii) a source of solid imaging build material contained in said cartridge housing; and
(iii) an extendable and retractable reciprocating transport surface contained in said cartridge housing and transparent to solid imaging radiation for transporting build material layer-by-layer from said source of build material to said image plane between said build platform and said rigid transparent surface, whereby said elevator moves said build platform for supporting a build and build pad into and out of solid imaging contact with the build material on said transport surface for illumination from said at least source of solid imaging radiation through said rigid surface and said transport surface; and
f) a controller in controlling communication with（制御のために通信する）said apparatus, whereby a build is alternately coated and imaged with layers of solid imaging build material（立体造形材料）."
"Solid imaging devices（立体造形装置）have been used for rapid prototyping（高速試作）for models for product development, and, more recently, for manufacturing operations. Solid imaging devices produce three-dimensional objects（３次元物体）from fusible powders（可融性粉末）or photocurable liquids（光硬化性液体）, typically by exposure to radiation（露光）in response to computer control. Data representing thin cross-sectional layers of a three-dimensional object provide the computer with control parameters for programs for automated building（自動化造形）of the object, typically layer-by-layer. A laser or other source of radiation（光源）suitable for solid imaging sequentially irradiates（照射）individual thin layers of the build material in response to which the material transforms into a solid（固体）, layer-upon-layer（層に層を重ねて）, to create a solid imaging product（立体造形品）.
Solid imaging is sometimes referred to as "rapid prototyping and manufacturing" and includes such diverse techniques as stereolithography, laser sintering, ink jet printing, and others. Powders, liquids, and other materials for solid imaging sometimes are referred to as "build materials（造形材料）" and the three-dimensional objects that solid imaging produces sometimes are called "builds（造形品）," "parts," and "solid imaging products," which can include a variety of shapes. The builds are usually prepared on surfaces referred to as "build pads" or "build platforms" that can be raised or lowered to place the surface of a build into contact with imaging radiation. The area where the build material is exposed sometimes is referred to as the "build plane" or "image plane.""
US2014036455
"1. A method of additive manufacturing（積層造形）of a three-dimensional object（造形物）, comprising sequentially forming（連続して形成）a plurality of layers each patterned according to the shape of a cross section of the object, thereby forming the object;
wherein for at least one of said plurality of layers, said formation of said layer comprises operating a first dispensing head to perform a raster scan while dispensing at least a first building material composition（構築材料組成物）, and opening a second dispensing head to perform a vector scan while dispensing at least a second building material composition."
US2016365667
"1. A fuel manifold apparatus, comprising: an annular array（環状配列）of fuel nozzles interconnected by a plurality of manifold tubes, wherein each manifold tube includes at least two fuel passages（流路）integrally formed therein, the fuel passages being configured for conduction heat transfer（伝導伝熱）therebetween.
2. The apparatus of claim 1 wherein each manifold tube is a monolithic component formed using an additive manufacturing（積層造形）process."
WO2016119885
"9. An additive manufacturing（積層造形）system comprising:
a build layer fabricator（構築層作製手段）to deposit（堆積）a layer of non-solidified build material（構築材料）and treat the build material to form a selected area of solidified build material; and a sensor to measure a variation（変化）in height of the layer across a transition between（間の遷移部にわたって）an area of solidified build material and an area of non- solidified build material."
"[0001 ] Additive manufacturing systems that generate three-dimensional objects on a layer-by-layer basis（各層毎に；＊一層ずつ）have been proposed as a potentially convenient way to produce three-dimensional objects.
[0002] Some additive manufacturing systems operate by selective treatment of a build material. To form an individual layer or slice of the object being fabricated a layer of suitable build material is deposited in a fabrication area and the build material is treated so as to solidify the build material in a selected area that corresponds to a slice of the object being fabricated. The rest of the build material remains non-solidified."
US2016175934
"[0002] The subject matter disclosed herein relates to additive manufacturing（積層造形）and, more specifically, to hybrid additive manufacturing methods using hybrid additively manufactured features for hybrid components.
[0003] Additive manufacturing processes generally involve the buildup（堆積）of one or more materials to make a net or near net shape object, in contrast to subtractive manufacturing methods. Though “additive manufacturing” is an industry standard term (ASTM F2792), additive manufacturing encompasses various manufacturing and prototyping techniques known under a variety of names, including freeform fabrication（自由造形）, 3D printing, rapid prototyping/tooling, etc. Additive manufacturing techniques are capable of fabricating complex components from a wide variety of materials. Generally, a freestanding object（自立する対象物）can be fabricated（作製）from a computer aided design (CAD) model. One exemplary additive manufacturing process uses an energy beam, for example, an electron beam or electromagnetic radiation such as a laser beam, to sinter（焼結）or melt a powder material, creating a solid three-dimensional object in which particles of the powder material are bonded together. Different material systems, for example, engineering plastics, thermoplastic elastomers, metals, and ceramics may be used. Laser sintering or melting is one exemplary additive manufacturing process for rapid（迅速な）fabrication of functional prototypes and tools. Applications can include patterns for investment casting, metal molds for injection molding and die casting, molds and cores for sand casting, and relatively complex components themselves. Fabrication of prototype objects to facilitate communication and testing of concepts during the design cycle are other potential uses of additive manufacturing processes. Likewise, components comprising more complex designs, such as those with internal passages that are less susceptible to（影響を受けにくい）other manufacturing techniques including casting or forging, may be fabricated using additive manufacturing methods."
US2005079086
"[0001] The efficient production of prototype three-dimensional compositions or objects can provide an effective means of reducing the time it takes to bring a product to market at a reasonable cost. A typical approach for preparing prototypes has required specific tooling, such as molds and dies, which can be a slow and cumbersome（厄介；＊面倒）process.
[0002] Recently, computerized modeling has alleviated（回避）some of the need for building prototypes by providing a good idea of what a product will look like without a specialized tooling requirement. However, the fabrication of a tangible（有形）object is still often preferred for prototyping. The merging of computer modeling and the physical formation of three-dimensional objects is sometimes referred to as solid free-form fabrication（立体造形）.
[0003] Solid free-form fabrication (SFF) is a process whereby three-dimensional objects, for example, prototype parts, models, working tools, production parts, molds, and other articles are manufactured by sequentially depositing layers of a structural material. Computer aided design (CAD) is commonly used to automate the design process. Using a suitable computer, an operator may design a three-dimensional article and then create that object by employing a positionable ejection head that selectively emits the structural material. Various techniques that employ solid free-form fabrication have been explored.
[0004] Traditional methods of forming solid free-form fabrication objects include using commercially available gypsum and biopolymer systems or acid-base cements. Traditional methods have also been developed to form solid metal objects. These traditional methods create parts with relatively low green strength（圧粉体強度）."
WO2014099722
"[0033] As used herein, truncated or truncation refers to the sectioning of a three-dimensional body（立体物）with a plane reducing the size of the body."
US2016009062
"[0001] The present application relates to laminated or Layer Object Manufacturing（積層造形）(LOM), and in particular to devices and in particular a tack and bond adhesive（粘着性および結合性接着）system and method for for Layered Object Manufacture.
BACKGROUND OF THE INVENTION
[0002] Rapid prototyping（ラピッドプロトタイピング（敏速試作））is defined as computer-controlled additive fabrication（付加式の製造）, in that an object can be fabricated by the addition of material rather than conventional machining methods that rely on removal or the subtraction of material. The term “rapid” is, it will be appreciated, a relative term but one that has specific meaning within the art, in that construction of a finished three dimensional articles can take from several hours to several days, depending on the method used and the size and complexity of the model. There are many known methodologies that are employed within the general field of rapid prototyping Layered Object Manufacture (LOM) is one form of Rapid prototyping (RP) which relates to the successive layering（連続して積層）of adhesive-coated paper, plastic, or metal laminates which are then successively glued together and cut to shape（切断して成形）with a knife or laser cutter.
[0003] After a plurality of media object layers are formed, a profiling（輪郭形成）and layer bonding process is performed. The plurality of layers are bonded together, and then a profiling or weeding process（淘汰処理）is performed which comprises removing unwanted support material from the printed media stack to reveal the 3D printed object."
WO2008032277
"1. Light emitting device (100), comprising a plurality of light emitting diodes (107), arranged spaced apart（間隔を置いて配設）from each other on a substrate (108), said light emitting diodes (107) being arranged to emit light in a general direction (L) along the surface of said substrate, wherein the light emitting device further comprises a light guide plate（導光板）(101) of a translucent（半透明）material having a back surface（背面）(103) facing said substrate (108) and an opposing front surface（前面）(102), said back surface (103) comprising a first array of protrusions (104) extending towards said substrate (108), said protrusions (104) providing a light receiving face（受光面）(105) for transmitting light from the light emitting diodes (107) into said light guide plate and a light reflection face（光反射面）(106) for reflecting light in said light guide plate (101), said light having a directional component along said general direction of light, towards said front surface (102), and wherein collimators (110) are arranged in the light path between said light emitting diodes (107) and said light receiving faces (105)."
US2015092390
"1. A lighting（照明）assembly for an instrument display comprising:
a light housing;
a display supported over（上方にわたって）an opening in the light housing;
a light source within the light housing;
a light guide including a light receiving surface（受光面）proximate（近傍の）the light source, a top surface（上面）and a bottom surface（底面）, wherein the top surface includes a plurality of prisms directing light toward the display."
US2013082980
" 22. An apparatus comprising:
a light guide having a major surface（主面）for receiving a touch input;
a light source for injecting light into the light guide;
a light sensor having a light receiving surface（受光面）, the light receiving surface having a plurality of light receiving locations; and
light-turning（光転向）means for redirecting（方向転換）light injected into the light guide and scattered by an object contacting the major surface such that each of the plurality of light receiving locations selectively receives the scattered light substantially only from an area of the major surface correlated with the each of the plurality of light receiving locations."
US2018040746
"17. The method of claim 5, wherein the substrate further comprises a back surface（裏面）opposite the light-receiving surface（受光面）, the method further comprising:
forming a plurality of alternating N-type and P-type semiconductor regions at or above the back surface（裏面または裏面の上方）of the substrate; and
forming a conductive contact structure electrically connected to the plurality of alternating N-type and P-type semiconductor regions."
