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基板を撮影する

2017-05-05 12:29:49 | 英語特許散策

WO2011005445(特表2012-531746)
"The method of the present invention can be implemented with the use of imaging devices(撮像デバイス)and analysis software intended to detect the presence, absence, or alignment(位置合わせ)of chiplets on a substrate. For example digital cameras can photograph the substrate(基板を撮影)and a computer-based software image-processing program employed to detect the presence, absence, or alignment of chiplets on a substrate. The results of such analysis can be used to mechanically direct the operation of laser ablation devices, micro-dispensers, micro gas jets, suction devices, and stamps."

WO2015105935(特表2017-505481)
(Ab)
"Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object(物体の超音波画像を撮影する;*物体を撮影して画像を得る) placed on a sensor surface."

WO2012151280(特表2014-515690)
"6. The medication dispensing cabinet of claim 5, wherein the camera is positioned to photograph a user(ユーザを撮影する)of the medication dispensing cabinet."

WO03002960(特表2004-533617)
"1. Apparatus for estimating, predicting or determining the temperature profile of a surface being sprayed or otherwise treated, the apparatus comprising at least one thermal image capture device for capturing thermal images of said surface(表面の熱画像を撮影する;*表面を撮影して画像を得る), said surface being sprayed or otherwise treated by means of one or more devices located such that they obscure said thermal images at least at some time during a spraying or treatment process, said apparatus including means for estimating, predicting or determining the temperature profile of obscured portions of said thermal images."

WO2013059223(特表2015-503084)
"1. A method for inspecting a part by taking a plurality of images of different image fields(画像フィールドの複数の画像を撮影する)of the part with an imaging camera having imaging optics with a fixed resolution and depth of field wherein the surface of the part is characterized by height variations within a given image field and wherein the image optics depth of field has a value such that focusing on(焦点を合わせる)any point in the given image field does not guarantee that the entire corresponding image will be in focus(焦点が合う), said method comprising the steps of:
A) sampling the height of the part surface at multiple positions for a given image field wherein the sample spacing is sufficiently small to determine the range of height variations of the surface in the image field,
B) determining a focus position(焦点位置)for the imaging optics or imaging camera for each image based upon the sampled heights for a given image field such that all surfaces of interest in the image field will be within the depth of field for the imaging optics, and
C) moving the imaging optics to the focus position for the given image field whereby the image will be in focus across the image field."

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